EP3483307 - PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.02.2021 Database last updated on 03.08.2024 | |
Former | The patent has been granted Status updated on 28.02.2020 | ||
Former | Grant of patent is intended Status updated on 12.11.2019 | ||
Former | Request for examination was made Status updated on 30.08.2019 | ||
Former | The application has been published Status updated on 12.04.2019 | Most recent event Tooltip | 15.07.2022 | Lapse of the patent in a contracting state New state(s): BE, MK | published on 17.08.2022 [2022/33] | Applicant(s) | For all designated states MKS IP Association Erasmusstraße 20 10553 Berlin / DE | [N/P] |
Former [2019/20] | For all designated states Atotech Deutschland GmbH Erasmusstraße 20 10553 Berlin / DE | Inventor(s) | 01 /
WACHTER, Philipp c/o Atotech Deutschland GmbH Patent Management Erasmusstraße 20 10553 Berlin / DE | 02 /
PFIRRMANN, Christina c/o Atotech Deutschland GmbH Patent Management Erasmusstraße 20 10553 Berlin / DE | 03 /
KRETSCHMER, Stefan c/o Atotech Deutschland GmbH Patent Management Erasmusstraße 20 10553 Berlin / DE | [2019/20] | Representative(s) | MKS IP Association Intellectual Property Erasmusstraße 20 10553 Berlin / DE | [N/P] | Application number, filing date | 17200836.9 | 09.11.2017 | [2019/20] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3483307 | Date: | 15.05.2019 | Language: | EN | [2019/20] | Type: | B1 Patent specification | No.: | EP3483307 | Date: | 01.04.2020 | Language: | EN | [2020/14] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 30.04.2018 | Classification | IPC: | C25D3/38 | [2019/20] | CPC: |
C25D3/38 (EP,KR,US);
C09B17/02 (US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/40] |
Former [2019/20] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | PLATTIERUNGSZUSAMMENSETZUNGEN ZUR ABSCHEIDEN ZUR ELEKTROLYTISCHEN KUPFERABSCHEIDUNG, DEREN VERWENDUNG UND VERFAHREN ZUR ELEKTROLYTISCHEN ABSCHEIDUNG EINER KUPFER- ODER KUPFERLEGIERUNGSSCHICHT AUF MINDESTENS EINER OBERFLÄCHE EINES SUBSTRATS | [2019/20] | English: | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | [2019/20] | French: | COMPOSITIONS D'ÉLECTRODÉPOSITION POUR LE DÉPÔT ÉLECTROLYTIQUE DE CUIVRE, SON UTILISATION ET PROCÉDÉ DE DÉPÔT ÉLECTROLYTIQUE D'UNE COUCHE DE CUIVRE OU D'ALLIAGE DE CUIVRE SUR AU MOINS UNE SURFACE D'UN SUBSTRAT | [2019/20] | Examination procedure | 22.08.2019 | Examination requested [2019/40] | 22.08.2019 | Date on which the examining division has become responsible | 13.11.2019 | Communication of intention to grant the patent | 20.01.2020 | Fee for grant paid | 20.01.2020 | Fee for publishing/printing paid | 20.01.2020 | Receipt of the translation of the claim(s) | Opposition(s) | 12.01.2021 | No opposition filed within time limit [2021/11] | Fees paid | Renewal fee | 26.11.2019 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | HU | 09.11.2017 | AL | 01.04.2020 | AT | 01.04.2020 | CY | 01.04.2020 | DK | 01.04.2020 | EE | 01.04.2020 | FI | 01.04.2020 | HR | 01.04.2020 | LT | 01.04.2020 | LV | 01.04.2020 | MC | 01.04.2020 | MK | 01.04.2020 | MT | 01.04.2020 | NL | 01.04.2020 | RO | 01.04.2020 | RS | 01.04.2020 | SE | 01.04.2020 | SI | 01.04.2020 | SK | 01.04.2020 | SM | 01.04.2020 | TR | 01.04.2020 | BG | 01.07.2020 | NO | 01.07.2020 | GR | 02.07.2020 | IS | 01.08.2020 | IE | 09.11.2020 | LU | 09.11.2020 | BE | 30.11.2020 | CH | 30.11.2020 | LI | 30.11.2020 | [2022/33] |
Former [2022/27] | HU | 09.11.2017 | |
AL | 01.04.2020 | ||
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CY | 01.04.2020 | ||
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MT | 01.04.2020 | ||
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TR | 01.04.2020 | ||
BG | 01.07.2020 | ||
NO | 01.07.2020 | ||
GR | 02.07.2020 | ||
IS | 01.08.2020 | ||
IE | 09.11.2020 | ||
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CH | 30.11.2020 | ||
LI | 30.11.2020 | ||
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BG | 01.07.2020 | ||
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IE | 09.11.2020 | ||
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BG | 01.07.2020 | ||
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LU | 09.11.2020 | ||
CH | 30.11.2020 | ||
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