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Extract from the Register of European Patents

EP About this file: EP3483307

EP3483307 - PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  12.02.2021
Database last updated on 03.08.2024
FormerThe patent has been granted
Status updated on  28.02.2020
FormerGrant of patent is intended
Status updated on  12.11.2019
FormerRequest for examination was made
Status updated on  30.08.2019
FormerThe application has been published
Status updated on  12.04.2019
Most recent event   Tooltip15.07.2022Lapse of the patent in a contracting state
New state(s): BE, MK
published on 17.08.2022  [2022/33]
Applicant(s)For all designated states
MKS IP Association
Erasmusstraße 20
10553 Berlin / DE
[N/P]
Former [2019/20]For all designated states
Atotech Deutschland GmbH
Erasmusstraße 20
10553 Berlin / DE
Inventor(s)01 / WACHTER, Philipp
c/o Atotech Deutschland GmbH
Patent Management
Erasmusstraße 20
10553 Berlin / DE
02 / PFIRRMANN, Christina
c/o Atotech Deutschland GmbH
Patent Management
Erasmusstraße 20
10553 Berlin / DE
03 / KRETSCHMER, Stefan
c/o Atotech Deutschland GmbH
Patent Management
Erasmusstraße 20
10553 Berlin / DE
 [2019/20]
Representative(s)MKS IP Association
Intellectual Property
Erasmusstraße 20
10553 Berlin / DE
[N/P]
Application number, filing date17200836.909.11.2017
[2019/20]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3483307
Date:15.05.2019
Language:EN
[2019/20]
Type: B1 Patent specification 
No.:EP3483307
Date:01.04.2020
Language:EN
[2020/14]
Search report(s)(Supplementary) European search report - dispatched on:EP30.04.2018
ClassificationIPC:C25D3/38
[2019/20]
CPC:
C25D3/38 (EP,KR,US); C09B17/02 (US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/40]
Former [2019/20]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:PLATTIERUNGSZUSAMMENSETZUNGEN ZUR ABSCHEIDEN ZUR ELEKTROLYTISCHEN KUPFERABSCHEIDUNG, DEREN VERWENDUNG UND VERFAHREN ZUR ELEKTROLYTISCHEN ABSCHEIDUNG EINER KUPFER- ODER KUPFERLEGIERUNGSSCHICHT AUF MINDESTENS EINER OBERFLÄCHE EINES SUBSTRATS[2019/20]
English:PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE[2019/20]
French:COMPOSITIONS D'ÉLECTRODÉPOSITION POUR LE DÉPÔT ÉLECTROLYTIQUE DE CUIVRE, SON UTILISATION ET PROCÉDÉ DE DÉPÔT ÉLECTROLYTIQUE D'UNE COUCHE DE CUIVRE OU D'ALLIAGE DE CUIVRE SUR AU MOINS UNE SURFACE D'UN SUBSTRAT[2019/20]
Examination procedure22.08.2019Examination requested  [2019/40]
22.08.2019Date on which the examining division has become responsible
13.11.2019Communication of intention to grant the patent
20.01.2020Fee for grant paid
20.01.2020Fee for publishing/printing paid
20.01.2020Receipt of the translation of the claim(s)
Opposition(s)12.01.2021No opposition filed within time limit [2021/11]
Fees paidRenewal fee
26.11.2019Renewal fee patent year 03
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Lapses during opposition  TooltipHU09.11.2017
AL01.04.2020
AT01.04.2020
CY01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
MK01.04.2020
MT01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
TR01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
IE09.11.2020
LU09.11.2020
BE30.11.2020
CH30.11.2020
LI30.11.2020
[2022/33]
Former [2022/27]HU09.11.2017
AL01.04.2020
AT01.04.2020
CY01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
MT01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
TR01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
IE09.11.2020
LU09.11.2020
CH30.11.2020
LI30.11.2020
Former [2021/46]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
IE09.11.2020
LU09.11.2020
CH30.11.2020
LI30.11.2020
Former [2021/37]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
LU09.11.2020
CH30.11.2020
LI30.11.2020
Former [2021/33]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
LU09.11.2020
Former [2021/31]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
MC01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2021/24]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SI01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2021/10]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SK01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2021/09]AL01.04.2020
AT01.04.2020
DK01.04.2020
EE01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2021/08]AL01.04.2020
DK01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RO01.04.2020
RS01.04.2020
SE01.04.2020
SM01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2021/04]AL01.04.2020
FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RS01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2020/51]FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
RS01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2020/50]FI01.04.2020
HR01.04.2020
LT01.04.2020
LV01.04.2020
NL01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
GR02.07.2020
IS01.08.2020
Former [2020/48]FI01.04.2020
LT01.04.2020
NL01.04.2020
SE01.04.2020
BG01.07.2020
NO01.07.2020
IS01.08.2020
Former [2020/47]LT01.04.2020
BG01.07.2020
NO01.07.2020
IS01.08.2020
Former [2020/46]BG01.07.2020
IS01.08.2020
Former [2020/39]BG01.07.2020
Documents cited:Search[A]US4347108  (WILLIS WILLIAM J) [A] 1-15* column 7, line 64 - column 8, line 38 *;
 [A]JP2000248397  (ELECTROPLATING ENG) [A] 1-15 * paragraphs [0014] - [0020] - [0022] - [0032]; tables 1-4 *;
 [A]US2005133376  (OPASKAR VINCENT C [US], et al) [A] 1-15 * paragraphs [0064] - [0065] - [0109] *;
 [A]EP2025778  (ROHM & HAAS ELECT MAT [US]) [A] 1-15 * paragraphs [0036] , [0039] *
by applicantDE947656
 DE2028803
 DE2039831
 US5976341
 US6099711
 US6518182
 WO2004057061
 WO2012040417
 JP2013044035
 JP2013044007
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