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Extract from the Register of European Patents

EP About this file: EP3427190

EP3427190 - METHOD FOR MANUFACTURING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE [Right-click to bookmark this link]
Former [2019/03]METHOD FOR PRODUCING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE
[2023/21]
StatusNo opposition filed within time limit
Status updated on  08.08.2024
Database last updated on 03.10.2024
FormerThe patent has been granted
Status updated on  01.09.2023
FormerGrant of patent is intended
Status updated on  07.05.2023
FormerExamination is in progress
Status updated on  08.06.2020
FormerRequest for examination was made
Status updated on  14.12.2018
FormerThe international publication has been made
Status updated on  15.09.2017
Formerunknown
Status updated on  11.03.2017
Most recent event   Tooltip08.08.2024No opposition filed within time limitpublished on 11.09.2024  [2024/37]
Applicant(s)For all designated states
Thales Dis France SAS
6, rue de la Verrerie
92190 Meudon / FR
[2022/04]
Former [2019/36]For all designated states
Thales Dis France SA
6, rue de la Verrerie
92190 Meudon / FR
Former [2019/03]For all designated states
GEMALTO SA
6 Rue de la Verrerie
92190 Meudon / FR
Inventor(s)01 / OTTOBON, Stéphane
Attn Intellectual Property Department
525 Avenue du Pic de Bertagne
CS12023
13881 GEMENOS Cedex / FR
02 / CHARLES, Luc
Attn Intellectual Property Department
525 Avenue du Pic de Bertagne
CS12023
13881 GEMENOS Cedex / FR
03 / LAVIRON, Thierry
Attn Intellectual Property Department
525 Avenue du Pic de Bertagne
CS12023
13881 GEMENOS Cedex / FR
04 / DOSSETTO, Lucile
Attn Intellectual Property Department
525 Avenue du Pic de Bertagne
CS12023
13881 GEMENOS Cedex / FR
 [2019/03]
Representative(s)Thomas, Christine Marie Catherine
Thales Dis France SAS
Intellectual Property Department
Avenue du Jujubier
ZI Athélia IV
13705 La Ciotat / FR
[N/P]
Former [2023/40]Milharo, Emilien
Thales Dis France SAS
Intellectual Property Department
525, avenue du Pic de Bertagne
CS12023
13881 Gémenos Cedex / FR
Former [2019/03]Milharo, Emilien
Gemalto SA
Département Propriété Intellectuelle
525, avenue du Pic de Bretagne
13881 Gemenos Cedex / FR
Application number, filing date17708284.906.03.2017
[2019/03]
WO2017EP55218
Priority number, dateEP2016030525607.03.2016         Original published format: EP 16305256
[2019/03]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2017153353
Date:14.09.2017
Language:FR
[2017/37]
Type: A1 Application with search report 
No.:EP3427190
Date:16.01.2019
Language:FR
The application published by WIPO in one of the EPO official languages on 14.09.2017 takes the place of the publication of the European patent application.
[2019/03]
Type: B1 Patent specification 
No.:EP3427190
Date:04.10.2023
Language:FR
[2023/40]
Search report(s)International search report - published on:EP14.09.2017
ClassificationIPC:G06K19/077
[2019/03]
CPC:
G06K19/07747 (EP); G06K19/07752 (EP); G06K19/07754 (EP)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/03]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:HERSTELLUNGSVERFAHREN EINES CHIPMODULS EINES INTEGRIERTEN SCHALTKREISES, UND VORRICHTUNG, DIE DIESES MODUL UMFASST[2023/21]
English:METHOD FOR MANUFACTURING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE[2023/21]
French:PROCEDE DE FABRICATION DE MODULE A PUCE DE CIRCUIT INTEGRE ET DISPOSITIF COMPRENANT UN TEL MODULE[2019/03]
Former [2019/03]VERFAHREN ZUR HERSTELLUNG EINES MODULS MIT EINEM IC-CHIP UND VORRICHTUNG MIT SOLCH EINEM MODUL
Former [2019/03]METHOD FOR PRODUCING A MODULE WITH AN INTEGRATED CIRCUIT CHIP AND DEVICE COMPRISING SUCH A MODULE
Entry into regional phase08.10.2018National basic fee paid 
08.10.2018Designation fee(s) paid 
08.10.2018Examination fee paid 
Examination procedure08.10.2018Examination requested  [2019/03]
08.10.2018Date on which the examining division has become responsible
25.04.2019Amendment by applicant (claims and/or description)
12.06.2020Despatch of a communication from the examining division (Time limit: M06)
16.10.2020Reply to a communication from the examining division
25.02.2022Despatch of a communication from the examining division (Time limit: M06)
19.08.2022Reply to a communication from the examining division
08.05.2023Communication of intention to grant the patent
24.08.2023Fee for grant paid
24.08.2023Fee for publishing/printing paid
24.08.2023Receipt of the translation of the claim(s)
Opposition(s)05.07.2024No opposition filed within time limit [2024/37]
Fees paidRenewal fee
22.03.2019Renewal fee patent year 03
20.03.2020Renewal fee patent year 04
23.03.2021Renewal fee patent year 05
23.03.2022Renewal fee patent year 06
21.03.2023Renewal fee patent year 07
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT04.10.2023
CZ04.10.2023
DK04.10.2023
EE04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RO04.10.2023
RS04.10.2023
SE04.10.2023
SK04.10.2023
SM04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
[2024/36]
Former [2024/35]AT04.10.2023
CZ04.10.2023
DK04.10.2023
EE04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RO04.10.2023
RS04.10.2023
SE04.10.2023
SM04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/34]AT04.10.2023
DK04.10.2023
EE04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RS04.10.2023
SE04.10.2023
SM04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/33]AT04.10.2023
DK04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RS04.10.2023
SE04.10.2023
SM04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/26]AT04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
LV04.10.2023
NL04.10.2023
PL04.10.2023
RS04.10.2023
SE04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/25]AT04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
NL04.10.2023
PL04.10.2023
RS04.10.2023
SE04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/24]AT04.10.2023
ES04.10.2023
HR04.10.2023
LT04.10.2023
NL04.10.2023
RS04.10.2023
SE04.10.2023
BG04.01.2024
NO04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/23]AT04.10.2023
ES04.10.2023
LT04.10.2023
NL04.10.2023
BG04.01.2024
GR05.01.2024
IS04.02.2024
PT05.02.2024
Former [2024/21]LT04.10.2023
NL04.10.2023
BG04.01.2024
GR05.01.2024
IS04.02.2024
Former [2024/20]NL04.10.2023
GR05.01.2024
IS04.02.2024
Former [2024/17]NL04.10.2023
Cited inInternational search[A]EP1039543  (MORGAN ADHESIVES CO [US]) [A] 1-13 * figure 3 * * paragraphs [0027] - [0029] - [0032] , [0036] , [0040] *;
 [A]WO2009020852  (AVERY DENNISON CORP [US], et al) [A] 1-13 * figures 3,4,9 ** paragraphs [0020] , [0025] , [0030] , [0035] *;
 [XI]EP2811427  (GEMALTO SA [FR]) [X] 1,4,5,8,11-13 * figures 5A,5B,8 * * paragraphs [0023] , [0024] , [0027] , [0028] , [0031] , [0034] , [0036] , [0038] , [0043] , [0044] , [0048] * * claim 7 * [I] 2,3,6,7,9,10
by applicantEP0972268
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