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Extract from the Register of European Patents

EP About this file: EP3427297

EP3427297 - LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  21.05.2021
Database last updated on 12.06.2024
FormerThe patent has been granted
Status updated on  12.06.2020
FormerGrant of patent is intended
Status updated on  06.02.2020
FormerExamination is in progress
Status updated on  28.06.2019
FormerRequest for examination was made
Status updated on  14.12.2018
FormerThe international publication has been made
Status updated on  15.09.2017
Formerunknown
Status updated on  20.03.2017
Most recent event   Tooltip27.04.2024Lapse of the patent in a contracting state
New state(s): MK
published on 29.05.2024  [2024/22]
Applicant(s)For all designated states
MKS IP Association
Erasmusstraße 20
10553 Berlin / DE
[N/P]
Former [2019/03]For all designated states
Atotech Deutschland GmbH
Erasmusstraße 20
10553 Berlin / DE
Inventor(s)01 / NEOH, Din-Ghee
c/o Atotech Deutschland GmbH
Patent Management
Erasmusstraße 20
10553 Berlin / DE
02 / BARTHELMES, Jürgen
c/o Atotech Deutschland GmbH
Patent Management
Erasmusstraße 20
10553 Berlin / DE
 [2019/03]
Representative(s)MKS IP Association
Intellectual Property
Erasmusstraße 20
10553 Berlin / DE
[N/P]
Application number, filing date17709983.510.03.2017
[2019/03]
WO2017EP55726
Priority number, dateEP2016015988011.03.2016         Original published format: EP 16159880
[2019/03]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017153590
Date:14.09.2017
Language:EN
[2017/37]
Type: A1 Application with search report 
No.:EP3427297
Date:16.01.2019
Language:EN
The application published by WIPO in one of the EPO official languages on 14.09.2017 takes the place of the publication of the European patent application.
[2019/03]
Type: B1 Patent specification 
No.:EP3427297
Date:15.07.2020
Language:EN
[2020/29]
Search report(s)International search report - published on:EP14.09.2017
ClassificationIPC:H01L23/495, C23C18/42, C23C18/18, C25D3/46, H01L23/31, C23C18/54, C23C18/16, C25D5/48, C25D5/34, C25D5/02, H01L21/48, // H01L23/00
[2020/08]
CPC:
H01L23/49582 (EP,KR,US); C23C18/1603 (EP,KR,US); C23C18/1689 (EP,KR,US);
C23C18/42 (EP,US); C23C18/54 (EP,KR,US); C25D3/46 (EP,US);
C25D5/02 (EP,KR,US); C25D5/34 (EP,KR,US); C25D5/48 (EP,US);
H01L21/4821 (EP,KR,US); H01L23/14 (US); H01L23/3142 (EP,KR,US);
H01L23/49541 (US); H01L23/49575 (US); C23C18/1614 (US);
C23C18/1893 (EP,US); H01L2224/97 (EP); H01L23/564 (EP,US) (-)
Former IPC [2019/03]H01L23/495, H01L21/48, C25D5/02, C25D5/34, C25D5/48, C23C18/16, C23C18/54, H01L23/31, C25D3/46, C23C18/18, C23C18/42
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/03]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:LEITERRAHMENSTRUKTUR, LEITERRAHMEN, OBERFLÄCHENMONTIERTE ELEKTRONISCHE VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG DAVON[2019/03]
English:LEAD-FRAME STRUCTURE, LEAD-FRAME, SURFACE MOUNT ELECTRONIC DEVICE AND METHODS OF PRODUCING SAME[2019/03]
French:STRUCTURE DE GRILLE DE CONNEXION, GRILLE DE CONNEXION, DISPOSITIF ÉLECTRONIQUE DE MONTAGE EN SURFACE ET LEURS PROCÉDÉS DE PRODUCTION[2020/08]
Former [2019/03]STRUCTURE DE GRILLE DE CONNEXION, GRILLE DE CONNEXION, DISPOSITIF ÉLECTRONIQUE À MONTAGE EN SURFACE ET LEURS PROCÉDÉS DE PRODUCTION
Entry into regional phase30.08.2018National basic fee paid 
30.08.2018Designation fee(s) paid 
30.08.2018Examination fee paid 
Examination procedure30.08.2018Examination requested  [2019/03]
30.08.2018Date on which the examining division has become responsible
20.03.2019Amendment by applicant (claims and/or description)
02.07.2019Despatch of a communication from the examining division (Time limit: M06)
20.12.2019Reply to a communication from the examining division
07.02.2020Communication of intention to grant the patent
03.06.2020Fee for grant paid
03.06.2020Fee for publishing/printing paid
03.06.2020Receipt of the translation of the claim(s)
Opposition(s)16.04.2021No opposition filed within time limit [2021/25]
Fees paidRenewal fee
26.03.2019Renewal fee patent year 03
24.03.2020Renewal fee patent year 04
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipHU10.03.2017
AL15.07.2020
CY15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
MK15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
BE31.03.2021
CH31.03.2021
LI31.03.2021
[2024/22]
Former [2023/33]HU10.03.2017
AL15.07.2020
CY15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
BE31.03.2021
CH31.03.2021
LI31.03.2021
Former [2023/30]AL15.07.2020
CY15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
BE31.03.2021
CH31.03.2021
LI31.03.2021
Former [2022/33]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
BE31.03.2021
CH31.03.2021
LI31.03.2021
Former [2022/11]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
CH31.03.2021
LI31.03.2021
Former [2022/09]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
GB10.03.2021
IE10.03.2021
LU10.03.2021
Former [2022/07]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
IE10.03.2021
Former [2021/45]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
MC15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/36]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SI15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/28]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SK15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/25]AL15.07.2020
CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/22]CZ15.07.2020
DK15.07.2020
EE15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RO15.07.2020
RS15.07.2020
SE15.07.2020
SM15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/21]DK15.07.2020
ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RS15.07.2020
SE15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/17]ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
NL15.07.2020
PL15.07.2020
RS15.07.2020
SE15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/10]ES15.07.2020
FI15.07.2020
HR15.07.2020
LT15.07.2020
LV15.07.2020
PL15.07.2020
RS15.07.2020
SE15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
IS15.11.2020
PT16.11.2020
Former [2021/09]ES15.07.2020
FI15.07.2020
LT15.07.2020
SE15.07.2020
BG15.10.2020
NO15.10.2020
GR16.10.2020
PT16.11.2020
Former [2021/08]ES15.07.2020
FI15.07.2020
LT15.07.2020
SE15.07.2020
BG15.10.2020
NO15.10.2020
PT16.11.2020
Former [2021/07]FI15.07.2020
LT15.07.2020
NO15.10.2020
Cited inInternational search[A]US4968397  (ASHER REGINALD K [US], et al) [A] 1-14 * column 3, line 3 - line 17 * * column 11, line 5 - line 38 ** claim 1 *;
 [A]US2008216921  (KWAN YIU FAI [HK], et al) [A] 1-14 * paragraph [0017] - paragraph [0031] *;
 [AD]WO2010043291  (ATOTECH DEUTSCHLAND GMBH [DE], et al) [AD] 1-14 * page 6, line 26 - page 7, line 13 * * page 10, line 16 - page 11, line 21 *
by applicantUS5300158
 US5343073
 US5449951
 US6852427
 US2005121330
 EP1820884
 WO2010043291
    - CUI, "Adhesion Enhancement of Pd Plated Leadframes", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, (1999), page 837, XP000903859
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.