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Extract from the Register of European Patents

EP About this file: EP3407381

EP3407381 - BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.12.2022
Database last updated on 15.05.2024
FormerThe patent has been granted
Status updated on  21.01.2022
FormerGrant of patent is intended
Status updated on  28.11.2021
FormerExamination is in progress
Status updated on  17.06.2020
FormerRequest for examination was made
Status updated on  26.10.2018
FormerThe international publication has been made
Status updated on  28.07.2017
Most recent event   Tooltip03.02.2023Lapse of the patent in a contracting state
New state(s): SI		published on 08.03.2023  [2023/10]
Applicant(s)For all designated states
Mitsubishi Materials Corporation
2-3, Marunouchi 3-chome
Chiyoda-ku
Tokyo 100-8117 / JP
[2022/08]
Former [2019/31]For all designated states
Mitsubishi Materials Corporation
2-3, Marunouchi 3-chome
Chiyoda-ku
Tokyo 100-8117 / JP
Former [2018/48]For all designated states
Mitsubishi Materials Corporation
3-2, Otemachi 1-chome Chiyoda-ku
Tokyo 100-8117 / JP
Inventor(s)01 / TERASAKI, Nobuyuki
c/o MITSUBISHI MATERIALS CORPORATION
Central Research Institute
1975-2 Shimoishitokami
Kitamoto-shi Saitama 364-0022 / JP
02 / NAGATOMO, Yoshiyuki
c/o MITSUBISHI MATERIALS CORPORATION
Central Research Institute
1975-2 Shimoishitokami
Kitamoto-shi Saitama 364-0022 / JP
 [2018/48]
Representative(s)Hoffmann Eitle
Patent- und Rechtsanwälte PartmbB
Arabellastraße 30
81925 München / DE
[2018/48]
Application number, filing date17741530.420.01.2017
[2018/48]
WO2017JP01922
Priority number, dateJP2016001067622.01.2016         Original published format: JP 2016010676
JP2017000041705.01.2017         Original published format: JP 2017000417
[2018/48]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2017126653
Date:27.07.2017
Language:JA
[2017/30]
Type: A1 Application with search report 
No.:EP3407381
Date:28.11.2018
Language:EN
[2018/48]
Type: B1 Patent specification 
No.:EP3407381
Date:23.02.2022
Language:EN
[2022/08]
Search report(s)International search report - published on:JP27.07.2017
(Supplementary) European search report - dispatched on:EP19.07.2019
ClassificationIPC:H01L23/373, C04B35/581, C04B35/645, C04B37/02
[2019/34]
CPC:
H01L23/3735 (EP,US); H01L23/53228 (KR); B23K1/008 (EP);
B23K35/0233 (EP); B23K35/0238 (EP); B23K35/262 (EP);
B23K35/302 (EP); C04B35/581 (EP); C04B35/645 (EP);
C04B37/026 (EP); C22C9/02 (KR); H01L21/4871 (EP);
H01L21/4882 (US); H01L23/142 (KR); H01L23/15 (EP,KR);
H01L23/3731 (KR); H01L23/3736 (KR); B23K2101/36 (EP);
B23K2101/40 (EP); B23K2103/172 (EP); C04B2235/3244 (EP);
C04B2235/6562 (EP); C04B2235/6567 (EP); C04B2237/121 (EP);
C04B2237/122 (EP); C04B2237/124 (EP); C04B2237/126 (EP);
C04B2237/127 (EP); C04B2237/128 (EP); C04B2237/366 (EP);
C04B2237/402 (EP); C04B2237/407 (EP); C04B2237/704 (EP);
C04B2237/706 (EP); C04B2237/72 (EP); C04B2237/74 (EP);
H01L2224/291 (EP); H01L2224/29109 (EP); H01L2224/29111 (EP);
H01L2224/29139 (EP); H01L2224/29147 (EP); H01L2224/32227 (EP);
H01L2224/83447 (EP); H01L2224/83801 (EP); H01L24/29 (EP);
H01L24/32 (EP); H01L24/83 (EP); H01L2924/12041 (EP) (-)
C-Set:
H01L2224/29109, H01L2924/014, H01L2924/0105, H01L2924/00014 (EP);
H01L2224/29111, H01L2924/014, H01L2924/01029, H01L2924/01047, H01L2924/00014 (EP);
H01L2224/29111, H01L2924/014, H01L2924/01047, H01L2924/00014 (EP);
H01L2224/29111, H01L2924/014, H01L2924/01049, H01L2924/00014 (EP);
H01L2224/29139, H01L2924/014, H01L2924/01029, H01L2924/0105, H01L2924/00014 (EP);
H01L2224/29139, H01L2924/014, H01L2924/0105, H01L2924/00014 (EP);
H01L2224/29147, H01L2924/014, H01L2924/01047, H01L2924/0105, H01L2924/00014 (EP);
H01L2224/291, H01L2924/014 (EP);
H01L2224/83447, H01L2924/00014 (EP);
H01L2224/83801, H01L2924/00014 (EP)
(-)
Former IPC [2018/48]H01L23/13, H01L23/14, H01L23/36
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2018/48]
Extension statesBANot yet paid
MENot yet paid
Validation statesMANot yet paid
MDNot yet paid
TitleGerman:GEBONDETER KÖRPER, LEISTUNGSMODULSUBSTRAT, LEISTUNGSMODUL, VERFAHREN ZUR HERSTELLUNG EINES GEBONDETEN KÖRPERS UND VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSMODULSUBSTRATS[2018/48]
English:BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE, BONDED BODY MANUFACTURING METHOD, AND POWER MODULE SUBSTRATE MANUFACTURING METHOD[2018/48]
French:CORPS LIÉ AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, SUBSTRAT POUR MODULE DE PUISSANCE AINSI QUE PROCÉDÉ DE FABRICATION DE CELUI-CI, ET MODULE DE PUISSANCE[2018/48]
Entry into regional phase17.08.2018Translation filed 
17.08.2018National basic fee paid 
17.08.2018Search fee paid 
17.08.2018Designation fee(s) paid 
17.08.2018Examination fee paid 
Examination proceduredeletedDate on which the examining division has become responsible
17.08.2018Examination requested  [2018/48]
14.02.2020Amendment by applicant (claims and/or description)
22.06.2020Despatch of a communication from the examining division (Time limit: M06)
22.12.2020Reply to a communication from the examining division
18.10.2021Cancellation of oral proceeding that was planned for 09.11.2021
09.11.2021Date of oral proceedings (cancelled)
29.11.2021Communication of intention to grant the patent
14.01.2022Fee for grant paid
14.01.2022Fee for publishing/printing paid
14.01.2022Receipt of the translation of the claim(s)
Opposition(s)24.11.2022No opposition filed within time limit [2023/05]
Fees paidRenewal fee
22.01.2019Renewal fee patent year 03
21.01.2020Renewal fee patent year 04
19.01.2021Renewal fee patent year 05
13.01.2022Renewal fee patent year 06
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAL23.02.2022
AT23.02.2022
CZ23.02.2022
DK23.02.2022
EE23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RO23.02.2022
RS23.02.2022
SE23.02.2022
SI23.02.2022
SK23.02.2022
SM23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
[2023/10]
Former [2023/01]AL23.02.2022
AT23.02.2022
CZ23.02.2022
DK23.02.2022
EE23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RO23.02.2022
RS23.02.2022
SE23.02.2022
SK23.02.2022
SM23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/49]AT23.02.2022
CZ23.02.2022
DK23.02.2022
EE23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RO23.02.2022
RS23.02.2022
SE23.02.2022
SK23.02.2022
SM23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/48]AT23.02.2022
CZ23.02.2022
DK23.02.2022
EE23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RO23.02.2022
RS23.02.2022
SE23.02.2022
SM23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/47]AT23.02.2022
DK23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RO23.02.2022
RS23.02.2022
SE23.02.2022
SM23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/46]AT23.02.2022
DK23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RS23.02.2022
SE23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/42]AT23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RS23.02.2022
SE23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
IS23.06.2022
PT23.06.2022
Former [2022/39]AT23.02.2022
ES23.02.2022
FI23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RS23.02.2022
SE23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
PT23.06.2022
Former [2022/36]AT23.02.2022
ES23.02.2022
HR23.02.2022
LT23.02.2022
LV23.02.2022
NL23.02.2022
PL23.02.2022
RS23.02.2022
SE23.02.2022
BG23.05.2022
NO23.05.2022
GR24.05.2022
PT23.06.2022
Former [2022/35]ES23.02.2022
HR23.02.2022
LT23.02.2022
NL23.02.2022
RS23.02.2022
SE23.02.2022
BG23.05.2022
NO23.05.2022
PT23.06.2022
Former [2022/34]ES23.02.2022
LT23.02.2022
NL23.02.2022
NO23.05.2022
PT23.06.2022
Former [2022/33]LT23.02.2022
NO23.05.2022
Documents cited:Search[XY]JP2015065423  (MITSUBISHI MATERIALS CORP) [X] 1-5 * paragraph [0061] - paragraph [0078]; figures 10-15 * [Y] 6-9;
 [XY]US2015208496  (TERASAKI NOBUYUKI [JP], et al) [X] 1-5 * paragraph [0106] - paragraph [0113]; claim 1 *[Y] 6-9
International search[Y]JP2008181940  (MITSUBISHI MATERIALS CORP) [Y] 6-9* , paragraph [0027] (Family: none) *;
 [XY]JP2015065423  (MITSUBISHI MATERIALS CORP) [X] 1-5 * , paragraphs [0018] to [0101]; fig. 1 to 17 & US 2016/0249452 A1 paragraphs [0040] to [0204]; fig. 1 to 17 & WO 2015/029811 A1 & EP 3041045 A1 & TW 201523803 A & CN 105393347 A & KR 10-2016-0046808 A * [Y] 6-9
by applicantJP4375730B
 JP2015043392
 JP2015043393
 JP2015065423
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.