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EP3486947
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EP About this file: EP3486947
| EP3486947 - SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 25.03.2022 Database last updated on 31.08.2024 | |
| Former | Request for examination was made Status updated on 19.04.2019 | ||
| Former | The international publication has been made Status updated on 20.01.2018 | Most recent event Tooltip | 19.06.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Sony Group Corporation 1-7-1 Konan Minato-ku Tokyo 108-0075 / JP | [2021/30] |
| Former [2019/21] | For all designated states Sony Corporation 1-7-1 Konan Minato-ku Tokyo 108-0075 / JP | Inventor(s) | 01 /
NISHIKIDO Kenju c/o SONY SEMICONDUCTOR MANUFACTURING CORPORATION 4000-1 Oazaharamizu Kikuyo-machi Kikuchi-gun Kumamoto 869-1102 / JP | 02 /
SHINOHARA Takekazu c/o SONY SEMICONDUCTOR MANUFACTURING CORPORATION 4000-1 Oazaharamizu Kikuyo-machi Kikuchi-gun Kumamoto 869-1102 / JP | 03 /
NOUDO Shinichiro c/o SONY SEMICONDUCTOR MANUFACTURING CORPORATION 4000-1 Oazaharamizu Kikuyo-machi Kikuchi-gun Kumamoto 869-1102 / JP | 04 /
KONDO Misato c/o SONY SEMICONDUCTOR MANUFACTURING CORPORATION 4000-1 Oazaharamizu Kikuyo-machi Kikuchi-gun Kumamoto 869-1102 / JP | [2019/21] | Representative(s) | MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB Amalienstraße 62 80799 München / DE | [2019/21] | Application number, filing date | 17827444.5 | 30.06.2017 | [2019/21] | WO2017JP24102 | Priority number, date | JP20160140380 | 15.07.2016 Original published format: JP 2016140380 | [2019/21] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2018012314 | Date: | 18.01.2018 | Language: | JA | [2018/03] | Type: | A1 Application with search report | No.: | EP3486947 | Date: | 22.05.2019 | Language: | EN | [2019/21] | Search report(s) | International search report - published on: | JP | 18.01.2018 | (Supplementary) European search report - dispatched on: | EP | 24.05.2019 | Classification | IPC: | H01L27/146, G02B3/00, H04N5/369, G02B5/02 | [2019/26] | CPC: |
G02B3/0056 (EP);
H01L27/14625 (US);
G02B3/0012 (EP);
G02B5/0215 (EP);
G02B5/0231 (EP);
G02B5/0268 (EP);
H01L27/146 (EP);
H01L27/14603 (US);
H01L27/14636 (US);
H01L27/14685 (US);
H04N25/70 (EP);
H01L2224/04042 (US);
H01L27/14643 (US)
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| Former IPC [2019/21] | H01L27/146, G02B3/00, H04N5/369 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2019/21] | Title | German: | FESTKÖRPERBILDGEBUNGSELEMENT UND HERSTELLUNGSVERFAHREN UND ELEKTRONISCHE VORRICHTUNG | [2019/21] | English: | SOLID-STATE IMAGING ELEMENT AND MANUFACTURING METHOD, AND ELECTRONIC DEVICE | [2019/21] | French: | ÉLÉMENT D'IMAGERIE À SEMI-CONDUCTEURS ET PROCÉDÉ DE FABRICATION AINSI QUE DISPOSITIF ÉLECTRONIQUE | [2019/21] | Entry into regional phase | 14.01.2019 | Translation filed | 08.02.2019 | National basic fee paid | 08.02.2019 | Search fee paid | 08.02.2019 | Designation fee(s) paid | 08.02.2019 | Examination fee paid | Examination procedure | 08.02.2019 | Examination requested [2019/21] | 25.11.2019 | Amendment by applicant (claims and/or description) | 29.03.2022 | Despatch of a communication from the examining division (Time limit: M04) | 20.07.2022 | Reply to a communication from the examining division | 03.01.2024 | Despatch of a communication from the examining division (Time limit: M04) | 03.05.2024 | Reply to a communication from the examining division | Fees paid | Renewal fee | 25.06.2019 | Renewal fee patent year 03 | 31.03.2020 | Renewal fee patent year 04 | 23.06.2021 | Renewal fee patent year 05 | 21.06.2022 | Renewal fee patent year 06 | 20.06.2023 | Renewal fee patent year 07 | 19.06.2024 | Renewal fee patent year 08 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]JP2014099563 (CANON KK) [X] 1,2,4-7 * abstract * * figures 1-28 * [I] 3,8; | [A]US2016033688 (WU HAN-LIN [TW], et al) [A] 1-8 * paragraph [0019] - paragraph [0034] ** figures 1,2b-2e * | International search | [A]JP2005129952 (MANGNACHIP SEMICONDUCTOR LTD) [A] 1-8 * , paragraphs [0005] to [0038]; fig. 1 to 4 & US 2005/0090035 A1 paragraphs [0005] to [0045]; fig. 1 to 4 & KR 10-2005-0039157 A *; | [A]JP2009290229 (SONY CORP) [A] 1-8* , paragraphs [0013] to [0016]; fig. 1 (Family: none) *; | [A]JP2010109137 (SONY CORP) [A] 1-8 * , paragraphs [0013] to [0025]; fig. 1 & US 2010/0109006 A1 paragraphs [0034] to [0046]; fig. 1 & KR 10-2010-0048890 A & CN 101728408 A & TW 201027731 A *; | [A]US2012001286 (YOON JUNHO [KR]) [A] 1-8 * , paragraphs [0061] to [0089]; fig. 8 & KR 10-2012-0001895 A paragraphs [0052] to [0081]; fig. 8 *; | [A]JP2012084693 (SONY CORP) [A] 1-8 * , paragraphs [0028] to [0044], [0089] to [0093]; fig. 1 to 2, 16 & US 2012/0086094 A1 paragraphs [0054] to [0076], [0132] to [0139]; fig. 1 to 2, 16 & CN 102446933 A & KR 10-2012-0037876 A & TW 201218366 A *; | [A]JP2014044989 (SONY CORP) [A] 1-8 * , paragraphs [0039] to [0045]; fig. 1 to 3 & US 2014/0054739 A1 paragraphs [0052] to [0058]; fig. 1 to 3 & CN 103633105 A *; | [A]JP2015029011 (SONY CORP) [A] 1-8 * , paragraphs [0038] to [0065]; fig. 3 to 6 & US 2015/0035104 A1 paragraphs [0056] to [0083]; fig. 3 to 6 & CN 104347657 A * |