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Extract from the Register of European Patents

EP About this file: EP3410474

EP3410474 - MICROELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  30.06.2023
Database last updated on 06.07.2024
FormerThe patent has been granted
Status updated on  22.07.2022
FormerGrant of patent is intended
Status updated on  08.03.2022
FormerExamination is in progress
Status updated on  16.07.2021
FormerRequest for examination was made
Status updated on  07.06.2019
FormerThe application has been published
Status updated on  02.11.2018
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT		published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
MEDIATEK INC.
No. 1, Dusing Rd. 1st.
Science-Based Industrial Park
Hsin-Chu 300 / TW
[2022/34]
Former [2018/49]For all designated states
MediaTek Inc.
No. 1, Dusing Road 1
Science-Based Industrial Park
Hsin-chu 300 / TW
Inventor(s)01 / SUN, Ruey-Bo
2F., No.286, Wenlin N. Rd., Beitou Dist.
Taipei City 112 / TW
02 / WU, Wen-Chou
5F.-2, No.582, Nanda Rd., East Dist.
Hsinchu City 300 / TW
 [2018/49]
Representative(s)Hoefer & Partner Patentanwälte mbB
Pilgersheimer Straße 20
81543 München / DE
[2018/49]
Application number, filing date18173808.923.05.2018
[2018/49]
Priority number, dateUS201762513496P01.06.2017         Original published format: US 201762513496 P
US20181597354108.05.2018         Original published format: US201815973541
[2018/49]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3410474
Date:05.12.2018
Language:EN
[2018/49]
Type: B1 Patent specification 
No.:EP3410474
Date:24.08.2022
Language:EN
[2022/34]
Search report(s)(Supplementary) European search report - dispatched on:EP25.09.2018
ClassificationIPC:H05K7/20, H05K9/00, H01L23/552, H01L23/66, H05K1/02
[2022/09]
CPC:
H01L23/552 (EP,CN,US); H01L23/06 (US); H01L23/373 (US);
H01L23/564 (CN); H01L23/645 (US); H01L23/66 (EP,US);
H01L25/0655 (US); H05K1/0203 (EP,US); H05K1/0216 (EP,US);
H05K7/20454 (EP,US); H05K9/0032 (EP,US); H01L2224/16225 (US);
H01L2224/16227 (EP); H01L2224/73253 (EP); H01L24/16 (US);
H01L2924/3025 (EP); H05K1/0215 (EP,US); H05K2201/09972 (EP,US);
H05K2201/10371 (EP,US); H05K2201/1056 (EP,US) (-)
Former IPC [2018/49]H01L23/552, H01L23/66, H05K1/02
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2019/28]
Former [2018/49]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:MIKROELEKTRONISCHE VORRICHTUNG MIT ELEKTROMAGNETISCHER ABSCHIRMUNG[2018/49]
English:MICROELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING[2018/49]
French:ENSEMBLE MICROÉLECTRONIQUE AVEC BLINDAGE ÉLECTROMAGNÉTIQUE[2018/49]
Examination procedure31.05.2019Amendment by applicant (claims and/or description)
31.05.2019Examination requested  [2019/28]
31.05.2019Date on which the examining division has become responsible
19.07.2021Despatch of a communication from the examining division (Time limit: M04)
18.11.2021Reply to a communication from the examining division
09.03.2022Communication of intention to grant the patent
13.07.2022Fee for grant paid
13.07.2022Fee for publishing/printing paid
13.07.2022Receipt of the translation of the claim(s)
Opposition(s)25.05.2023No opposition filed within time limit [2023/31]
Fees paidRenewal fee
30.03.2020Renewal fee patent year 03
26.05.2021Renewal fee patent year 04
25.03.2022Renewal fee patent year 05
Opt-out from the exclusive  Tooltip
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Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAL24.08.2022
AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
IT24.08.2022
LT24.08.2022
LV24.08.2022
MC24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SI24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
IE23.05.2023
LU23.05.2023
[2024/26]
Former [2024/21]AL24.08.2022
AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
MC24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SI24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
IE23.05.2023
LU23.05.2023
Former [2024/08]AL24.08.2022
AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
MC24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SI24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
LU23.05.2023
Former [2023/37]AL24.08.2022
AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SI24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/29]AL24.08.2022
AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/23]AT24.08.2022
CZ24.08.2022
DK24.08.2022
EE24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SK24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/22]AT24.08.2022
CZ24.08.2022
DK24.08.2022
ES24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RO24.08.2022
RS24.08.2022
SE24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/21]DK24.08.2022
FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RS24.08.2022
SE24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/20]FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RS24.08.2022
SE24.08.2022
SM24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/12]FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RS24.08.2022
SE24.08.2022
NO24.11.2022
GR25.11.2022
IS24.12.2022
PT26.12.2022
Former [2023/11]FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
PL24.08.2022
RS24.08.2022
SE24.08.2022
NO24.11.2022
GR25.11.2022
PT26.12.2022
Former [2023/10]FI24.08.2022
HR24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
RS24.08.2022
SE24.08.2022
NO24.11.2022
GR25.11.2022
PT26.12.2022
Former [2023/09]FI24.08.2022
LT24.08.2022
LV24.08.2022
NL24.08.2022
RS24.08.2022
SE24.08.2022
NO24.11.2022
PT26.12.2022
Former [2023/08]FI24.08.2022
LT24.08.2022
NL24.08.2022
RS24.08.2022
SE24.08.2022
NO24.11.2022
Documents cited:Search[Y]US2005077596  (BAUER MICHAEL [DE], et al) [Y] 1-15 * paragraphs [0026] - [0033]; figure 1 *;
 [Y]US2012025356  (LIAO KUO-HSIEN [TW], et al) [Y] 1-15 * paragraphs [0022] - [0035]; figures 1-4 *;
 [Y]EP2584605  (HUAWEI DEVICE CO LTD [CN]) [Y] 1-15 * paragraphs [0015] - [0021]; figures 2a,2b *;
 [Y]US2014160699  (ZHANG YANG [US], et al) [Y] 1-15 * paragraphs [0026] - [0034]; figures 2,3 *;
 [T]US9633158  (JONES JAKOB RAYMOND [US], et al) [T] 1-15* column 1, lines 6-53 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.