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Extract from the Register of European Patents

EP About this file: EP3678462

EP3678462 - HEAT DISSIPATION STRUCTURE [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  02.04.2022
Database last updated on 22.08.2024
FormerRequest for examination was made
Status updated on  05.06.2020
FormerThe international publication has been made
Status updated on  09.03.2019
Most recent event   Tooltip02.04.2022Application deemed to be withdrawnpublished on 04.05.2022  [2022/18]
Applicant(s)For all designated states
Nippon Seiki Co., Ltd.
2-34 Higashi-Zaoh 2-chome
Nagaoka-shi, Niigata 940-8580 / JP
[2020/28]
Inventor(s)01 / IWANAGA Takahiro
Nippon Seiki, Co., Ltd.
2-2-34 Higashi Zaoh
Nagaoka
Niigata / JP
 [2020/28]
Representative(s)Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
[N/P]
Former [2020/28]Jackson, Richard Eric
Carpmaels & Ransford LLP
One Southampton Row
London WC1B 5HA / GB
Application number, filing date18851970.627.08.2018
[2020/28]
WO2018JP31479
Priority number, dateJP2017016512030.08.2017         Original published format: JP 2017165120
[2020/28]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2019044731
Date:07.03.2019
Language:JA
[2019/10]
Type: A1 Application with search report 
No.:EP3678462
Date:08.07.2020
Language:EN
[2020/28]
Search report(s)International search report - published on:JP07.03.2019
(Supplementary) European search report - dispatched on:EP26.04.2021
ClassificationIPC:H05K7/20, G09F9/00, H01L23/36, H01L23/40, F21V8/00
[2021/21]
CPC:
H05K7/20963 (EP,US); G02B6/0068 (EP); G02B6/0083 (EP);
G02B6/0085 (EP); G09F9/00 (EP); H01L23/36 (EP);
H01L23/40 (EP); H05K7/2039 (US) (-)
Former IPC [2020/28]H05K7/20, G09F9/00, H01L23/36, H01L23/40
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/28]
TitleGerman:LED-WÄRMEABLEITUNGSSTRUKTUR[2020/28]
English:HEAT DISSIPATION STRUCTURE[2020/28]
French:STRUCTURE DE DISSIPATION DE CHALEUR[2020/28]
Entry into regional phase04.02.2020Translation filed 
04.02.2020National basic fee paid 
04.02.2020Search fee paid 
04.02.2020Designation fee(s) paid 
04.02.2020Examination fee paid 
Examination procedure04.02.2020Examination requested  [2020/28]
25.11.2021Application deemed to be withdrawn, date of legal effect  [2022/18]
15.12.2021Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time  [2022/18]
Fees paidRenewal fee
13.08.2020Renewal fee patent year 03
13.08.2021Renewal fee patent year 04
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Documents cited:Search[X]EP2589852  (SHARP KK [JP]) [X] 1-3 * paragraph [0112] - paragraph [0132]; figures 16-18 *;
 [A]WO2012099001  (SHARP KK [JP], et al) [A] 1-3 * the whole document *
International search[XA]US5216283  (LIN PAUL T [US]) [X] 1, 3 * , * [A] 2;
 [A]JP2008245144  (FUJIFILM CORP) [A] 1-3 * , *;
 [A]JP2005077979  (NAGANO KOGAKU KENKYUSHO KK, et al) [A] 1-3 * , *;
 [A]US4540891  (KEENER ROBERT M [US], et al) [A] 1-3 * , *
by applicantJP2013170993
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