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EP3671186
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EP About this file: EP3671186
| EP3671186 - PHOTONIC SENSOR CHIP, PACKAGED PHOTONIC SENSOR DEVICE AND ARRANGEMENT [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 18.06.2021 Database last updated on 03.06.2024 | |
| Former | The application has been published Status updated on 22.05.2020 | Most recent event Tooltip | 18.06.2021 | Application deemed to be withdrawn | published on 21.07.2021 [2021/29] | Applicant(s) | For all designated states IHP GmbH - Innovations for High Performance Microelectronics / Leibniz-Institut für innovative Mikroelektronik Im Technologiepark 25 15236 Frankfurt (Oder) / DE | [2020/26] | Inventor(s) | 01 /
Steglich, Patrick Pfarrstraße 130 10317 Berlin / DE | 02 /
Mai, Andreas Dorfstraße 61 03172 Guben / DE | 03 /
Mai, Christian Am Waldrand 2 03172 Guben / DE | [2020/26] | Representative(s) | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Stralauer Platz 34 10243 Berlin / DE | [N/P] |
| Former [2020/26] | Eisenführ Speiser Patentanwälte Rechtsanwälte PartGmbB Anna-Louisa-Karsch-Strasse 2 10178 Berlin / DE | Application number, filing date | 19166562.9 | 01.04.2019 | [2020/26] | Priority number, date | EP20180215524 | 21.12.2018 Original published format: EP 18215524 | [2020/26] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3671186 | Date: | 24.06.2020 | Language: | EN | [2020/26] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.10.2019 | Classification | IPC: | G01N21/77, G01N33/543, G02B6/12, B01L3/00, G01N15/00, H01L27/14, // G01N21/25, G01N21/552, G01N33/04 | [2020/26] | CPC: |
G01N21/7703 (EP,US);
G02B6/1225 (US);
G01N15/1456 (EP);
G01N15/1484 (EP);
G01N21/553 (EP,US);
G01N31/223 (US);
G01N33/04 (EP);
G01N33/54373 (EP);
G02B6/12004 (EP);
B01L2300/0877 (EP);
B01L2300/0887 (EP);
G01N2015/1006 (EP);
G01N2015/1438 (EP);
G01N2021/7763 (EP);
G01N21/253 (EP);
G01N21/7746 (EP);
G01N2201/0221 (EP);
G01N33/025 (EP);
G01N33/12 (EP);
G02B2006/12061 (EP);
G02B2006/121 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/26] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | PHOTONISCHER SENSORCHIP, VERPACKTE PHOTONISCHE SENSORVORRICHTUNG UND ANORDNUNG | [2020/26] | English: | PHOTONIC SENSOR CHIP, PACKAGED PHOTONIC SENSOR DEVICE AND ARRANGEMENT | [2020/26] | French: | PUCE DE DÉTECTEUR PHOTONIQUE, DISPOSITIF DE CAPTEUR PHOTONIQUE EMBALLÉ ET AGENCEMENT | [2020/26] | Examination procedure | 12.01.2021 | Application deemed to be withdrawn, date of legal effect [2021/29] | 23.02.2021 | Despatch of communication that the application is deemed to be withdrawn, reason: examination fee not paid in time [2021/29] | Fees paid | Penalty fee | Additional fee for renewal fee | 30.04.2021 | 03 M06 Not yet paid |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]EP1918693 (HONEYWELL INT INC [US]) [X] 1,4,5,7,9,10,12-14 * paragraphs [0002] , [0006] - [0009] - [0021] - [0045]; figures 1,2,5-9 * [I] 2,3,6,8,11,15; | [XI]US2009087137 (DOAN MY THE [CA]) [X] 1,4,5,9,12-14 * paragraphs [0002] , [0004] , [0013] - [0041] - [0055] - [0059]; figures 9,10; claims 1,2,7,21 * [I] 2,3,7,8,10,15; | [A]EP2515099 (FRAUNHOFER GES FORSCHUNG [DE]) [A] 6 * paragraphs [0026] , [0031] - [0034]; figure 1 *; | [A]WO2018150205 (ARISTOTLE UNIV OF THESSALONIKI RESEARCH COMMITTEE E L K E [GR], et al) [A] 11 * page 6, lines 12-27; figure 1 ** page 8, lines 28-33 * |