blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News flashes

New version of the European Patent Register - SPC information for Unitary Patents.

2024-03-06

More...
blank Related links

Release notes
European Patent Register Assistant
European Patent Register Resource Book
European Patent Register – pocket guide
FAQ - European Patent Register
FAQ - Register Alert
Federated Register (Flyer)
Global Dossier (Flyer)
Register events
Deep link coverage
Federated Register content
The Patent Information Tour
Fair use charter

Extract from the Register of European Patents

EP About this file: EP3633723

EP3633723 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  29.12.2023
Database last updated on 14.06.2024
FormerThe patent has been granted
Status updated on  20.01.2023
FormerGrant of patent is intended
Status updated on  12.09.2022
FormerExamination is in progress
Status updated on  19.03.2021
FormerRequest for examination was made
Status updated on  06.03.2020
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT		published on 26.06.2024 [2024/26]
Applicant(s)For all designated states
ROHM CO., LTD.
21, Saiin Mizosaki-cho
Ukyo-ku
Kyoto 615-8585 / JP
[2020/15]
Inventor(s)01 / YOSHIHARA, Katsuhiko
Rohm Co. Ltd.
21, Saiin Mizosaki-cho, Ukyo-ku
Kyoto 615-8585 / JP
02 / ISHII, Masaru
Rohm Co. Ltd.
21, Saiin Mizosaki-cho, Ukyo-ku
Kyoto 615-8585 / JP
03 / KITAGURO, Kouichi
Rohm Co. Ltd.
21, Saiin Mizosaki-cho, Ukyo-ku
Kyoto 615-8585 / JP
 [2020/15]
Representative(s)Isarpatent
Patent- und Rechtsanwälte Barth
Charles Hassa Peckmann & Partner mbB
Friedrichstrasse 31
80801 München / DE
[2023/08]
Former [2020/15]Isarpatent
Patent- und Rechtsanwälte Behnisch Barth Charles
Hassa Peckmann & Partner mbB
Friedrichstrasse 31
80801 München / DE
Application number, filing date19197461.712.05.2010
[2020/15]
Priority number, dateJP2009011727114.05.2009         Original published format: JP 2009117271
JP2009023001701.10.2009         Original published format: JP 2009230017
[2020/15]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP3633723
Date:08.04.2020
Language:EN
[2020/15]
Type: A3 Search report 
No.:EP3633723
Date:24.06.2020
Language:EN
[2020/26]
Type: B1 Patent specification 
No.:EP3633723
Date:22.02.2023
Language:EN
[2023/08]
Search report(s)(Supplementary) European search report - dispatched on:EP25.05.2020
ClassificationIPC:H01L23/64, H01L25/07, H01L25/18, H01L23/49, H01L23/48, H01L23/488, H01L23/498, // H01L23/373
[2022/31]
CPC:
H01L25/18 (EP,US); H01L23/49844 (US); H01L23/315 (US);
H01L23/49811 (EP); H01L23/49822 (US); H01L23/645 (EP,US);
H01L24/32 (EP,US); H01L24/33 (US); H01L24/34 (US);
H01L24/36 (US); H01L24/37 (EP,US); H01L24/40 (EP,US);
H01L24/49 (EP,US); H01L24/72 (EP,US); H01L24/73 (EP,US);
H01L24/84 (EP); H01L24/90 (EP); H01L25/072 (EP,US);
H01L2223/6611 (EP,US); H01L2224/291 (EP,US); H01L2224/29111 (EP,US);
H01L2224/32221 (US); H01L2224/32225 (EP,US); H01L2224/37147 (EP,US);
H01L2224/40225 (EP,US); H01L2224/45014 (EP,US); H01L2224/45015 (EP,US);
H01L2224/45124 (EP,US); H01L2224/45144 (EP,US); H01L2224/48091 (EP,US);
H01L2224/48111 (EP,US); H01L2224/48137 (EP,US); H01L2224/48227 (EP,US);
H01L2224/49111 (EP,US); H01L2224/73221 (EP); H01L2224/73251 (EP,US);
H01L2224/73265 (EP,US); H01L2224/83801 (EP,US); H01L2224/84205 (EP,US);
H01L2224/8485 (EP); H01L2224/85205 (EP,US); H01L23/3735 (EP,US);
H01L23/5385 (EP); H01L23/5386 (EP); H01L24/45 (EP,US);
H01L24/48 (EP,US); H01L2924/00014 (EP,US); H01L2924/01006 (EP,US);
H01L2924/01013 (EP,US); H01L2924/01014 (EP,US); H01L2924/01023 (EP,US);
H01L2924/01028 (EP,US); H01L2924/01029 (EP,US); H01L2924/01033 (EP,US);
H01L2924/0105 (EP,US); H01L2924/01078 (EP,US); H01L2924/01079 (EP,US);
H01L2924/01082 (EP,US); H01L2924/0132 (EP,US); H01L2924/01322 (EP,US);
H01L2924/014 (EP,US); H01L2924/10253 (EP,US); H01L2924/10272 (US);
H01L2924/1203 (US); H01L2924/12032 (EP,US); H01L2924/12041 (EP,US);
H01L2924/1305 (EP,US); H01L2924/13055 (EP,US); H01L2924/1306 (EP,US);
H01L2924/13091 (EP,US); H01L2924/15747 (EP,US); H01L2924/181 (EP,US);
H01L2924/2076 (EP,US); H01L2924/30107 (EP,US) (-)
C-Set:
H01L2224/291, H01L2924/014 (US,EP);
H01L2224/45014, H01L2224/45124, H01L2924/00 (US,EP);
H01L2224/45014, H01L2224/45144, H01L2924/00 (EP,US);
H01L2224/45014, H01L2924/00014 (US,EP);
H01L2224/45015, H01L2924/00014, H01L2924/2076 (US,EP);
H01L2224/45015, H01L2924/2076 (US,EP);
H01L2224/45015, H01L2924/2076, H01L2924/00 (US,EP);
H01L2224/45124, H01L2924/00014 (US,EP);
H01L2224/45144, H01L2924/00014 (US,EP);
H01L2224/48091, H01L2924/00014 (US,EP);
H01L2224/49111, H01L2224/48137, H01L2924/00 (US,EP);
H01L2224/49111, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/73221, H01L2224/40225, H01L2224/48227, H01L2924/00 (EP);
H01L2224/73251, H01L2224/32, H01L2224/72 (US,EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00 (US,EP);
H01L2224/83801, H01L2924/00014 (US,EP);
H01L2224/84205, H01L2924/00014 (US,EP);
H01L2224/8485, H01L2924/00014 (EP);
H01L2224/85205, H01L2224/45124, H01L2924/00, H01L2924/00 (US,EP);
H01L2224/85205, H01L2224/45144, H01L2924/00 (EP,US);
H01L2924/00014, H01L2224/45014, H01L2924/206 (EP,US);
H01L2924/00014, H01L2224/73221 (EP);
H01L2924/0132, H01L2924/0105, H01L2924/01082 (US,EP);
H01L2924/12032, H01L2924/00 (EP,US);
H01L2924/12041, H01L2924/00 (EP,US);
H01L2924/13055, H01L2924/00 (US,EP);
H01L2924/1305, H01L2924/00 (US,EP);
H01L2924/1306, H01L2924/00 (EP,US);
H01L2924/181, H01L2924/00 (US,EP);
H01L2924/3512, H01L2924/00, H01L2924/00 (EP,US)
(-)
Former IPC [2022/30]H01L23/64, H01L25/07, H01L25/18, H01L23/49, H01L23/48, H01L23/498, // H01L23/373
Former IPC [2020/26]H01L23/64, H01L25/07, H01L25/18, H01L23/49, H01L23/48, // H01L23/373
Former IPC [2020/15]H01L23/64, H01L25/07, H01L25/18
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   SE,   SI,   SK,   SM,   TR [2021/04]
Former [2020/15]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  SE,  SI,  SK,  SM,  TR 
TitleGerman:HALBLEITERBAUELEMENT[2020/15]
English:SEMICONDUCTOR DEVICE[2020/15]
French:DISPOSITIF À SEMICONDUCTEUR[2020/15]
Examination procedure28.10.2019Examination requested  [2020/15]
17.12.2020Amendment by applicant (claims and/or description)
23.03.2021Despatch of a communication from the examining division (Time limit: M04)
21.07.2021Reply to a communication from the examining division
28.09.2021Despatch of a communication from the examining division (Time limit: M02)
29.11.2021Reply to a communication from the examining division
03.02.2022Despatch of a communication from the examining division (Time limit: M02)
31.03.2022Reply to a communication from the examining division
13.09.2022Communication of intention to grant the patent
11.01.2023Fee for grant paid
11.01.2023Fee for publishing/printing paid
11.01.2023Receipt of the translation of the claim(s)
Parent application(s)   TooltipEP10774936.8  / EP2432014
Opposition(s)23.11.2023No opposition filed within time limit [2024/05]
Fees paidRenewal fee
16.09.2019Renewal fee patent year 03
16.09.2019Renewal fee patent year 04
16.09.2019Renewal fee patent year 05
16.09.2019Renewal fee patent year 06
16.09.2019Renewal fee patent year 07
16.09.2019Renewal fee patent year 08
16.09.2019Renewal fee patent year 09
16.09.2019Renewal fee patent year 10
30.03.2020Renewal fee patent year 11
31.05.2021Renewal fee patent year 12
31.03.2022Renewal fee patent year 13
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court		 See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
IT22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
IE12.05.2023
LU12.05.2023
GB22.05.2023
NO22.05.2023
GR23.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
IS22.06.2023
PT22.06.2023
[2024/26]
Former [2024/25]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
IE12.05.2023
LU12.05.2023
GB22.05.2023
NO22.05.2023
GR23.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
IS22.06.2023
PT22.06.2023
Former [2024/21]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
IE12.05.2023
LU12.05.2023
NO22.05.2023
GR23.05.2023
CH31.05.2023
LI31.05.2023
IS22.06.2023
PT22.06.2023
Former [2024/11]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SI22.02.2023
SK22.02.2023
SM22.02.2023
LU12.05.2023
NO22.05.2023
GR23.05.2023
CH31.05.2023
LI31.05.2023
IS22.06.2023
PT22.06.2023
Former [2024/09]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SK22.02.2023
SM22.02.2023
LU12.05.2023
NO22.05.2023
GR23.05.2023
CH31.05.2023
LI31.05.2023
IS22.06.2023
PT22.06.2023
Former [2024/08]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
MC22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SK22.02.2023
SM22.02.2023
LU12.05.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/50]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SK22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/49]AT22.02.2023
CZ22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
RO22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/48]AT22.02.2023
DK22.02.2023
EE22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/46]AT22.02.2023
DK22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
SE22.02.2023
SM22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/39]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
IS22.06.2023
PT22.06.2023
Former [2023/38]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
PL22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
PT22.06.2023
Former [2023/37]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
SE22.02.2023
NO22.05.2023
GR23.05.2023
PT22.06.2023
Former [2023/36]AT22.02.2023
ES22.02.2023
FI22.02.2023
HR22.02.2023
LT22.02.2023
LV22.02.2023
NL22.02.2023
SE22.02.2023
NO22.05.2023
PT22.06.2023
Former [2023/35]AT22.02.2023
ES22.02.2023
HR22.02.2023
LT22.02.2023
NL22.02.2023
NO22.05.2023
PT22.06.2023
Former [2023/34]ES22.02.2023
LT22.02.2023
PT22.06.2023
Former [2023/33]ES22.02.2023
LT22.02.2023
Documents cited:Search[A]US6566750  (SOFUE KENICHI [JP], et al) [A] 1-18 * column 3, line 20 - column 5, line 59; figures 2A,2B,3A,3B *;
 [A]US2004227231  (MALY DOUGLAS K [US], et al) [A] 1-18 * paragraphs [0024] - [0031]; figures 1,2A,2B,3 *;
 [A]US2008105896  (KAWAGUCHI YASUTO [JP], et al) [A] 1-18 * paragraph [0017] - paragraph [0018]; figures 1,2 *;
 [A]US2009039498  (BAYERER REINHOLD [DE]) [A] 1-18* the whole document *;
 [A]  - TSUNODA T ET AL, "Low-inductance module construction for high speed, high-current IGBT module suitable for electric vehicle application", POWER SEMICONDUCTOR DEVICES AND ICS, 1993. ISPSD '93., PROCEEDINGS OF THE 5TH INTERNATIONAL SYMPOSIUM ON MONTEREY, CA, USA 18-20 MAY 1993, NEW YORK, NY, USA,IEEE, US, (19930518), doi:10.1109/ISPSD.1993.297140, ISBN 978-0-7803-1313-2, pages 292 - 295, XP010116938 [A] 1-18 * page 292 - page 293; figures 2,3 *

DOI:   http://dx.doi.org/10.1109/ISPSD.1993.297140
by applicantJP2009117271
 JP2009230017
 JP20020026251
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.