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Extract from the Register of European Patents

EP About this file: EP3648172

EP3648172 - SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME [Right-click to bookmark this link]
StatusThe application has been withdrawn
Status updated on  22.04.2022
Database last updated on 19.10.2024
FormerExamination is in progress
Status updated on  09.12.2021
FormerRequest for examination was made
Status updated on  06.11.2020
FormerThe application has been published
Status updated on  03.04.2020
Most recent event   Tooltip22.04.2022Withdrawal of applicationpublished on 25.05.2022  [2022/21]
Applicant(s)For all designated states
MediaTek Inc.
No. 1, Dusing Rd. 1st
Science-Based Industrial Park
Hsin-Chu 300 / TW
[2020/19]
Inventor(s)01 / WAN, Cheng-Tien
No. 1, Dusing Rd. 1st
Science-Based Industrial Park
30078 Taiwan / TW
02 / LEE, Ming-Cheng
No. 1, Dusing Rd. 1st
Science-Based Industrial Park
30078 Taiwan / TW
 [2020/19]
Representative(s)Gilani, Anwar, et al
Venner Shipley LLP
406 Science Park
Milton Road
Cambridge CB4 0WW / GB
[N/P]
Former [2020/19]Gilani, Anwar, et al
Venner Shipley LLP
Byron House
Cambridge Business Park
Cowley Road
Cambridge CB4 0WZ / GB
Application number, filing date19204764.523.10.2019
[2020/19]
Priority number, dateUS201862751753P29.10.2018         Original published format: US 201862751753 P
US20191659005301.10.2019         Original published format: US201916590053
[2020/19]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3648172
Date:06.05.2020
Language:EN
[2020/19]
Search report(s)(Supplementary) European search report - dispatched on:EP17.03.2020
ClassificationIPC:H01L29/06, H01L21/8234, H01L29/417, H01L29/423, H01L29/78, B82Y10/00, H01L29/165, H01L29/45, H01L29/775, H01L29/786, H01L21/336
[2020/19]
CPC:
H01L29/0847 (EP,US); H01L29/7855 (CN); H01L21/823425 (EP);
H01L21/823475 (EP); H01L21/823814 (US); H01L21/823821 (US);
H01L21/823871 (US); H01L27/0924 (US); H01L29/0673 (EP,US);
H01L29/165 (EP); H01L29/401 (EP); H01L29/41725 (EP);
H01L29/41733 (EP); H01L29/41766 (CN); H01L29/41791 (EP);
H01L29/42392 (EP); H01L29/456 (EP); H01L29/66439 (EP);
H01L29/6656 (EP); H01L29/66795 (EP,CN,US); H01L29/775 (EP);
H01L29/785 (EP,US); H01L29/78618 (EP); H01L29/78696 (EP);
B82Y10/00 (EP); H01L27/088 (EP); H01L27/0886 (EP);
H01L29/665 (EP); H01L29/66545 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/50]
Former [2020/19]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HALBLEITERVORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR[2020/19]
English:SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME[2020/19]
French:DISPOSITIFS SEMI-CONDUCTEURS ET LEURS PROCÉDÉS DE FORMATION[2020/19]
Examination procedure02.11.2020Amendment by applicant (claims and/or description)
02.11.2020Examination requested  [2020/50]
02.11.2020Date on which the examining division has become responsible
08.12.2021Despatch of a communication from the examining division (Time limit: M04)
19.04.2022Application withdrawn by applicant  [2022/21]
Fees paidRenewal fee
27.10.2021Renewal fee patent year 03
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Documents cited:Search[XAI]US2014346605  (ZEITZOFF PETER [US], et al) [X] 1-4,8,9 * paragraph [0016] - paragraph [0029] * * figures 1-12 * [A] 10,11 [I] 5-7,12-15;
 [XI]US2016276449  (BAE DONG-IL [KR], et al) [X] 1-4,8,10,11 * paragraph [0055] - paragraph [0075] * * paragraph [0101] - paragraph [0124] * * figures 6,7,17-27 * [I] 5-7,9,12-15;
 [XAI]US2016315081  (PARK MISEON [KR], et al) [X] 1-4,8,12,13 * paragraph [0030] - paragraph [0077] * * paragraph [0085] - paragraph [0131] * * figures 1-3A,5A-20B * [A] 11[I] 5-7,9,10,14,15
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.