EP3644235 - WIRELESS IC DEVICE, MOLDED RESIN ARTICLE, AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 08.09.2023 Database last updated on 03.09.2024 | |
Former | The patent has been granted Status updated on 30.09.2022 | ||
Former | Grant of patent is intended Status updated on 12.05.2022 | ||
Former | Examination is in progress Status updated on 09.04.2021 | ||
Former | Request for examination was made Status updated on 14.08.2020 | ||
Former | The application has been published Status updated on 27.03.2020 | Most recent event Tooltip | 24.05.2024 | Lapse of the patent in a contracting state New state(s): IT | published on 26.06.2024 [2024/26] | Applicant(s) | For all designated states Murata Manufacturing Co., Ltd. 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 / JP | [2020/18] | Inventor(s) | 01 /
Kato, Noboru c/o Murata Manufacturing Co., Ltd. 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 / JP | 02 /
Yasutake, Makoto c/o Murata Manufacturing Co., Ltd. 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 / JP | 03 /
Banba, Shinichiro c/o Murata Manufacturing Co., Ltd. 10-1, Higashikotari 1-chome Nagaokakyo-shi, Kyoto 617-8555 / JP | [2020/18] | Representative(s) | Zimmermann, Tankred Klaus, et al Schoppe, Zimmermann, Stöckeler Zinkler, Schenk & Partner mbB Patentanwälte Radlkoferstrasse 2 81373 München / DE | [2020/18] | Application number, filing date | 19214876.5 | 05.08.2015 | [2020/18] | Priority number, date | JP20140257336 | 19.12.2014 Original published format: JP 2014257336 | [2020/18] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3644235 | Date: | 29.04.2020 | Language: | EN | [2020/18] | Type: | B1 Patent specification | No.: | EP3644235 | Date: | 02.11.2022 | Language: | EN | [2022/44] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 26.03.2020 | Classification | IPC: | G06K19/077, B42D25/305, G06K19/07, H01Q1/38, H01Q1/40, H01Q7/00, H01Q7/06 | [2020/18] | CPC: |
H04B5/26 (EP,US);
G06K19/07 (EP,US);
G06K19/0723 (EP,US);
G06K19/077 (EP,US);
G06K19/07722 (EP,US);
G06K19/07745 (EP,US);
G06K19/0775 (EP,US);
G06K19/07754 (EP,US);
G06K19/07779 (EP,US);
G06K19/07784 (EP,US);
H01L21/565 (US);
H01L23/3107 (EP,US);
H01L23/3121 (US);
H01L23/49838 (US);
H01L23/66 (EP,US);
H01Q1/2283 (EP,US);
H01Q7/00 (EP,US);
H04B5/77 (EP,US);
H01L21/568 (EP,US);
H01L2223/6677 (EP,US);
H01L2224/131 (EP,US);
H01L2224/16227 (EP,US);
H01L2224/48227 (EP,US);
H01L2224/81815 (EP,US);
H01L2924/1421 (EP,US);
H01L2924/15192 (EP,US);
H01L2924/1531 (EP,US);
| C-Set: |
H01L2224/131, H01L2924/014, H01L2924/00014 (EP,US)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/38] |
Former [2020/18] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | DRAHTLOSE IC-VORRICHTUNG, GEFORMTER HARZARTIKEL UND VERFAHREN ZUR HERSTELLUNG EINER DRAHTLOSEN IC-VORRICHTUNG | [2020/18] | English: | WIRELESS IC DEVICE, MOLDED RESIN ARTICLE, AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE | [2020/18] | French: | DISPOSITIF CI SANS FIL, ARTICLE MOULÉ EN RÉSINE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF CI SANS FIL | [2020/18] | Examination procedure | 06.08.2020 | Amendment by applicant (claims and/or description) | 06.08.2020 | Examination requested [2020/38] | 06.08.2020 | Date on which the examining division has become responsible | 12.04.2021 | Despatch of a communication from the examining division (Time limit: M04) | 19.08.2021 | Reply to a communication from the examining division | 13.05.2022 | Communication of intention to grant the patent | 23.09.2022 | Fee for grant paid | 23.09.2022 | Fee for publishing/printing paid | 23.09.2022 | Receipt of the translation of the claim(s) | Parent application(s) Tooltip | EP15869588.2 / EP3136300 | Opposition(s) | 03.08.2023 | No opposition filed within time limit [2023/41] | Fees paid | Renewal fee | 10.12.2019 | Renewal fee patent year 03 | 10.12.2019 | Renewal fee patent year 04 | 10.12.2019 | Renewal fee patent year 05 | 27.08.2020 | Renewal fee patent year 06 | 30.07.2021 | Renewal fee patent year 07 | 21.07.2022 | Renewal fee patent year 08 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AL | 02.11.2022 | AT | 02.11.2022 | CZ | 02.11.2022 | DK | 02.11.2022 | EE | 02.11.2022 | ES | 02.11.2022 | FI | 02.11.2022 | HR | 02.11.2022 | IT | 02.11.2022 | LT | 02.11.2022 | LV | 02.11.2022 | MC | 02.11.2022 | NL | 02.11.2022 | PL | 02.11.2022 | RO | 02.11.2022 | RS | 02.11.2022 | SE | 02.11.2022 | SI | 02.11.2022 | SK | 02.11.2022 | SM | 02.11.2022 | NO | 02.02.2023 | GR | 03.02.2023 | IS | 02.03.2023 | PT | 02.03.2023 | [2024/26] |
Former [2024/16] | AL | 02.11.2022 | |
AT | 02.11.2022 | ||
CZ | 02.11.2022 | ||
DK | 02.11.2022 | ||
EE | 02.11.2022 | ||
ES | 02.11.2022 | ||
FI | 02.11.2022 | ||
HR | 02.11.2022 | ||
LT | 02.11.2022 | ||
LV | 02.11.2022 | ||
MC | 02.11.2022 | ||
NL | 02.11.2022 | ||
PL | 02.11.2022 | ||
RO | 02.11.2022 | ||
RS | 02.11.2022 | ||
SE | 02.11.2022 | ||
SI | 02.11.2022 | ||
SK | 02.11.2022 | ||
SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
Former [2023/51] | AL | 02.11.2022 | |
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SI | 02.11.2022 | ||
SK | 02.11.2022 | ||
SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
Former [2023/38] | AL | 02.11.2022 | |
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EE | 02.11.2022 | ||
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SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
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RO | 02.11.2022 | ||
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SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
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RO | 02.11.2022 | ||
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SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
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PL | 02.11.2022 | ||
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SE | 02.11.2022 | ||
SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
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PT | 02.03.2023 | ||
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NL | 02.11.2022 | ||
PL | 02.11.2022 | ||
RS | 02.11.2022 | ||
SE | 02.11.2022 | ||
SM | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
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NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
Former [2023/25] | AT | 02.11.2022 | |
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PL | 02.11.2022 | ||
RS | 02.11.2022 | ||
SE | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
IS | 02.03.2023 | ||
PT | 02.03.2023 | ||
Former [2023/23] | AT | 02.11.2022 | |
ES | 02.11.2022 | ||
FI | 02.11.2022 | ||
LT | 02.11.2022 | ||
LV | 02.11.2022 | ||
SE | 02.11.2022 | ||
NO | 02.02.2023 | ||
GR | 03.02.2023 | ||
PT | 02.03.2023 | ||
Former [2023/22] | AT | 02.11.2022 | |
ES | 02.11.2022 | ||
FI | 02.11.2022 | ||
LT | 02.11.2022 | ||
SE | 02.11.2022 | ||
NO | 02.02.2023 | ||
PT | 02.03.2023 | ||
Former [2023/20] | LT | 02.11.2022 | |
NO | 02.02.2023 | Documents cited: | Search | [XA]GB2461443 (MURATA MANUFACTURING CO [JP]) [X] 1,11,12 * paragraph [0076] - paragraph [0081]; figures 11,12a * [A] 2-10; | [A]EP2696438 (MURATA MANUFACTURING CO [JP]) [A] 1-12* paragraphs [0030] , [0066]; figures 1,15-17 *; | [A]WO2014115454 (MURATA MANUFACTURING CO [JP]) [A] 1-12 * figure 2C * | by applicant | JP2007102348 | WO2011108340 | US2012056337 |