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Extract from the Register of European Patents

EP About this file: EP3644235

EP3644235 - WIRELESS IC DEVICE, MOLDED RESIN ARTICLE, AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  08.09.2023
Database last updated on 03.09.2024
FormerThe patent has been granted
Status updated on  30.09.2022
FormerGrant of patent is intended
Status updated on  12.05.2022
FormerExamination is in progress
Status updated on  09.04.2021
FormerRequest for examination was made
Status updated on  14.08.2020
FormerThe application has been published
Status updated on  27.03.2020
Most recent event   Tooltip24.05.2024Lapse of the patent in a contracting state
New state(s): IT
published on 26.06.2024  [2024/26]
Applicant(s)For all designated states
Murata Manufacturing Co., Ltd.
10-1, Higashikotari 1-chome
Nagaokakyo-shi, Kyoto 617-8555 / JP
[2020/18]
Inventor(s)01 / Kato, Noboru
c/o Murata Manufacturing Co., Ltd.
10-1, Higashikotari 1-chome
Nagaokakyo-shi, Kyoto 617-8555 / JP
02 / Yasutake, Makoto
c/o Murata Manufacturing Co., Ltd.
10-1, Higashikotari 1-chome
Nagaokakyo-shi, Kyoto 617-8555 / JP
03 / Banba, Shinichiro
c/o Murata Manufacturing Co., Ltd.
10-1, Higashikotari 1-chome
Nagaokakyo-shi, Kyoto 617-8555 / JP
 [2020/18]
Representative(s)Zimmermann, Tankred Klaus, et al
Schoppe, Zimmermann, Stöckeler
Zinkler, Schenk & Partner mbB
Patentanwälte
Radlkoferstrasse 2
81373 München / DE
[2020/18]
Application number, filing date19214876.505.08.2015
[2020/18]
Priority number, dateJP2014025733619.12.2014         Original published format: JP 2014257336
[2020/18]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP3644235
Date:29.04.2020
Language:EN
[2020/18]
Type: B1 Patent specification 
No.:EP3644235
Date:02.11.2022
Language:EN
[2022/44]
Search report(s)(Supplementary) European search report - dispatched on:EP26.03.2020
ClassificationIPC:G06K19/077, B42D25/305, G06K19/07, H01Q1/38, H01Q1/40, H01Q7/00, H01Q7/06
[2020/18]
CPC:
H04B5/26 (EP,US); G06K19/07 (EP,US); G06K19/0723 (EP,US);
G06K19/077 (EP,US); G06K19/07722 (EP,US); G06K19/07745 (EP,US);
G06K19/0775 (EP,US); G06K19/07754 (EP,US); G06K19/07779 (EP,US);
G06K19/07784 (EP,US); H01L21/565 (US); H01L23/3107 (EP,US);
H01L23/3121 (US); H01L23/49838 (US); H01L23/66 (EP,US);
H01Q1/2283 (EP,US); H01Q7/00 (EP,US); H04B5/77 (EP,US);
H01L21/568 (EP,US); H01L2223/6677 (EP,US); H01L2224/131 (EP,US);
H01L2224/16227 (EP,US); H01L2224/48227 (EP,US); H01L2224/81815 (EP,US);
H01L2924/1421 (EP,US); H01L2924/15192 (EP,US); H01L2924/1531 (EP,US);
H01L2924/15313 (EP,US); H01L2924/19041 (EP,US); H01L2924/19105 (EP,US) (-)
C-Set:
H01L2224/131, H01L2924/014, H01L2924/00014 (EP,US)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/38]
Former [2020/18]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:DRAHTLOSE IC-VORRICHTUNG, GEFORMTER HARZARTIKEL UND VERFAHREN ZUR HERSTELLUNG EINER DRAHTLOSEN IC-VORRICHTUNG[2020/18]
English:WIRELESS IC DEVICE, MOLDED RESIN ARTICLE, AND METHOD FOR MANUFACTURING WIRELESS IC DEVICE[2020/18]
French:DISPOSITIF CI SANS FIL, ARTICLE MOULÉ EN RÉSINE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF CI SANS FIL[2020/18]
Examination procedure06.08.2020Amendment by applicant (claims and/or description)
06.08.2020Examination requested  [2020/38]
06.08.2020Date on which the examining division has become responsible
12.04.2021Despatch of a communication from the examining division (Time limit: M04)
19.08.2021Reply to a communication from the examining division
13.05.2022Communication of intention to grant the patent
23.09.2022Fee for grant paid
23.09.2022Fee for publishing/printing paid
23.09.2022Receipt of the translation of the claim(s)
Parent application(s)   TooltipEP15869588.2  / EP3136300
Opposition(s)03.08.2023No opposition filed within time limit [2023/41]
Fees paidRenewal fee
10.12.2019Renewal fee patent year 03
10.12.2019Renewal fee patent year 04
10.12.2019Renewal fee patent year 05
27.08.2020Renewal fee patent year 06
30.07.2021Renewal fee patent year 07
21.07.2022Renewal fee patent year 08
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAL02.11.2022
AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
IT02.11.2022
LT02.11.2022
LV02.11.2022
MC02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SI02.11.2022
SK02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
[2024/26]
Former [2024/16]AL02.11.2022
AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
MC02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SI02.11.2022
SK02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/51]AL02.11.2022
AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SI02.11.2022
SK02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/38]AL02.11.2022
AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SK02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/37]AL02.11.2022
AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/35]AT02.11.2022
CZ02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RO02.11.2022
RS02.11.2022
SE02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/34]AT02.11.2022
DK02.11.2022
EE02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RS02.11.2022
SE02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/33]AT02.11.2022
DK02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RS02.11.2022
SE02.11.2022
SM02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/29]AT02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
NL02.11.2022
PL02.11.2022
RS02.11.2022
SE02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/25]AT02.11.2022
ES02.11.2022
FI02.11.2022
HR02.11.2022
LT02.11.2022
LV02.11.2022
PL02.11.2022
RS02.11.2022
SE02.11.2022
NO02.02.2023
GR03.02.2023
IS02.03.2023
PT02.03.2023
Former [2023/23]AT02.11.2022
ES02.11.2022
FI02.11.2022
LT02.11.2022
LV02.11.2022
SE02.11.2022
NO02.02.2023
GR03.02.2023
PT02.03.2023
Former [2023/22]AT02.11.2022
ES02.11.2022
FI02.11.2022
LT02.11.2022
SE02.11.2022
NO02.02.2023
PT02.03.2023
Former [2023/20]LT02.11.2022
NO02.02.2023
Documents cited:Search[XA]GB2461443  (MURATA MANUFACTURING CO [JP]) [X] 1,11,12 * paragraph [0076] - paragraph [0081]; figures 11,12a * [A] 2-10;
 [A]EP2696438  (MURATA MANUFACTURING CO [JP]) [A] 1-12* paragraphs [0030] , [0066]; figures 1,15-17 *;
 [A]WO2014115454  (MURATA MANUFACTURING CO [JP]) [A] 1-12 * figure 2C *
by applicantJP2007102348
 WO2011108340
 US2012056337
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.