Extract from the Register of European Patents

EP About this file: EP3753049

EP3753049 - SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  28.07.2023
Database last updated on 11.04.2026
FormerThe patent has been granted
Status updated on  19.08.2022
FormerGrant of patent is intended
Status updated on  19.05.2022
FormerExamination is in progress
Status updated on  11.06.2021
FormerRequest for examination was made
Status updated on  20.11.2020
FormerThe international publication has been made
Status updated on  13.11.2020
Formerunknown
Status updated on  24.09.2019
Most recent event   Tooltip26.12.2025Lapse of the patent in a contracting state
New state(s): TR
published on 28.01.2026  [2026/05]
Applicant(s)For all designated states
Light-Med (USA), Inc.
1130 Calle Cordillera
San Clemente, CA 92673 / US
[2020/52]
Inventor(s)01 / HUO, Yongjun
6 Logo Vista
Dana Point, CA 92629 / US
02 / LEE, Chin Chung
8 Curie Court
Irvine, CA 92617-4026 / US
 [2020/52]
Representative(s)Groth & Co. KB
P.O. Box 6107
102 32 Stockholm / SE
[2020/52]
Application number, filing date19768992.007.05.2019
[2020/52]
WO2019US31041
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2020226626
Date:12.11.2020
Language:EN
[2020/46]
Type: A1 Application with search report 
No.:EP3753049
Date:23.12.2020
Language:EN
The application published by WIPO in one of the EPO official languages on 12.11.2020 takes the place of the publication of the European patent application.
[2020/52]
Type: B1 Patent specification 
No.:EP3753049
Date:21.09.2022
Language:EN
[2022/38]
Search report(s)International search report - published on:US12.11.2020
(Supplementary) European search report - dispatched on:EP12.11.2020
ClassificationIPC:H01L23/36, H01L23/373, H01L21/48, H01L23/00, H01L23/488, H01L25/065
[2020/52]
CPC:
H10W40/25 (EP); H10H20/858 (KR); H10W40/255 (EP,US);
H10H20/832 (KR); H10W40/22 (US); H10W40/258 (EP);
H10W42/121 (EP); H10W70/02 (US); H10W72/01338 (US);
H10W72/01365 (US); H10W72/07331 (US); H10W72/07336 (EP,US);
H10W72/322 (US); H10W72/352 (EP,US); H10W72/923 (EP);
H10W72/952 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2020/52]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:VERFAHREN FÜR TRANSIENTE SILBER-INDIUM-FLÜSSIGPHASE ZUM BONDEN VON HALBLEITERBAUELEMENTEN UND WÄRMEVERTEILENDER TRÄGER UND HALBLEITERSTRUKTUR MIT BONDINGVERBINDUNG AUS TRANSIENTER SILBER-INDIUM-FLÜSSIGPHASE[2020/52]
English:SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT[2020/52]
French:PROCÉDÉ EN PHASE LIQUIDE TRANSITOIRE ARGENT-INDIUM DE LIAISON DE DISPOSITIF À SEMI-CONDUCTEUR ET SUPPORT DE DISSIPATEUR THERMIQUE ET STRUCTURE SEMI-CONDUCTRICE AYANT UN JOINT DE LIAISON DE PHASE LIQUIDE TRANSITOIRE ARGENT-INDIUM[2020/52]
Entry into regional phase24.09.2019National basic fee paid 
24.09.2019Search fee paid 
24.09.2019Designation fee(s) paid 
24.09.2019Examination fee paid 
Examination procedure24.09.2019Amendment by applicant (claims and/or description)
24.09.2019Examination requested  [2020/52]
10.06.2021Despatch of a communication from the examining division (Time limit: M04)
01.07.2021Reply to a communication from the examining division
20.05.2022Communication of intention to grant the patent
16.08.2022Fee for grant paid
16.08.2022Fee for publishing/printing paid
16.08.2022Receipt of the translation of the claim(s)
Opposition(s)22.06.2023No opposition filed within time limit [2023/35]
Appeal following opposition23.01.2023Appeal received No.  T0178/23
23.01.2023Statement of grounds filed
11.10.2024Date of oral proceedings
Fees paidRenewal fee
26.05.2021Renewal fee patent year 03
26.05.2022Renewal fee patent year 04
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Lapses during opposition  TooltipCY07.05.2019
HU07.05.2019
AL21.09.2022
AT21.09.2022
BG21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
TR21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
ES08.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
[2026/05]
Former [2025/39]CY07.05.2019
HU07.05.2019
AL21.09.2022
AT21.09.2022
BG21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
ES08.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
Former [2025/36]CY07.05.2019
AL21.09.2022
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CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
ES08.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
Former [2024/51]AL21.09.2022
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BG21.09.2022
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DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
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MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
ES08.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
Former [2024/35]AL21.09.2022
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FI21.09.2022
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MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
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SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
ES08.05.2023
BE31.05.2023
CH31.05.2023
FR31.05.2023
LI31.05.2023
Former [2024/25]AL21.09.2022
AT21.09.2022
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EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
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MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
GB07.05.2023
IE07.05.2023
IT07.05.2023
LU07.05.2023
BE31.05.2023
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FR31.05.2023
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Former [2024/21]AL21.09.2022
AT21.09.2022
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LT21.09.2022
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MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
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SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
IE07.05.2023
LU07.05.2023
CH31.05.2023
LI31.05.2023
Former [2024/09]AL21.09.2022
AT21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
LU07.05.2023
CH31.05.2023
LI31.05.2023
Former [2024/08]AL21.09.2022
AT21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
MC21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
LU07.05.2023
Former [2023/37]AL21.09.2022
AT21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
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LT21.09.2022
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NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SI21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
Former [2023/34]AL21.09.2022
AT21.09.2022
CZ21.09.2022
DK21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
Former [2023/30]AL21.09.2022
AT21.09.2022
CZ21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
NL21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
Former [2023/29]AL21.09.2022
AT21.09.2022
CZ21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
Former [2023/26]AT21.09.2022
CZ21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
PL21.09.2022
RO21.09.2022
RS21.09.2022
SE21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
IS21.01.2023
PT23.01.2023
Former [2023/23]AT21.09.2022
CZ21.09.2022
EE21.09.2022
FI21.09.2022
HR21.09.2022
LT21.09.2022
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RO21.09.2022
RS21.09.2022
SE21.09.2022
SK21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
PT23.01.2023
Former [2023/22]AT21.09.2022
CZ21.09.2022
FI21.09.2022
HR21.09.2022
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LV21.09.2022
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RS21.09.2022
SE21.09.2022
SM21.09.2022
NO21.12.2022
GR22.12.2022
PT23.01.2023
Former [2023/20]FI21.09.2022
HR21.09.2022
LT21.09.2022
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NO21.12.2022
GR22.12.2022
Former [2023/10]FI21.09.2022
HR21.09.2022
LT21.09.2022
LV21.09.2022
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SE21.09.2022
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GR22.12.2022
Former [2023/09]FI21.09.2022
LT21.09.2022
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NO21.12.2022
Former [2023/08]FI21.09.2022
LT21.09.2022
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SE21.09.2022
NO21.12.2022
Documents cited:Search[A] US6504242  (DEPPISCH CARL L et al.) [A] 1-15 * figures 1-3 * * column 1, line 51 - column 3, line 45 *
International search[XYA] US7023089  (LU DAOQIANG et al.) [X] 32, 35-37 * , FIGs. 1-3, col. 2 Ins 27-62, col. 4 Ins 9-23, 58 -63, col. 5 Ins 11-19, col. 7 Ins 27-36 *[Y] 1-5, 25-27, 29, 30 [A] 6-24, 28, 31, 33, 34, 38
 [YA] US7628309  (ERIKSEN ODD HARALD STEEN et al.) [Y] 1-5, 25-27, 29, 30 * , col. 4 Ins 37-63 *[A] 6-24, 28, 31, 33, 34
 [Y] US8968830  (RAMM JUERGEN et al.) [Y] 2, 4 * , col. 6 Ins 64-67 to col. 7 Ins 1-12 *
 [Y] US2013001782  (OTSUKA TAKUKAZU et al.) [Y] 3 * , paras [0023], [0080] *
 [Y] US9673163  (OTSUKA TAKUKAZU et al.) [Y] 5 * , col. 16 Ins 61-65, col. 17 Ins 9-13 *
 [Y] US5829124  (KRESGE JOHN STEVEN et al.) [Y] 27 * , col. 7 Ins 58-67 *
 [YA] US2008002460  (TUCKERMAN DAVID B et al.) [Y] 29 * , paras [0210], [0252] [0377] *[A] 6-24, 31, 33, 34, 38
by applicantUS6504242
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.