| EP3753049 - SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 28.07.2023 Database last updated on 11.04.2026 | |
| Former | The patent has been granted Status updated on 19.08.2022 | ||
| Former | Grant of patent is intended Status updated on 19.05.2022 | ||
| Former | Examination is in progress Status updated on 11.06.2021 | ||
| Former | Request for examination was made Status updated on 20.11.2020 | ||
| Former | The international publication has been made Status updated on 13.11.2020 | ||
| Former | unknown Status updated on 24.09.2019 | Most recent event Tooltip | 26.12.2025 | Lapse of the patent in a contracting state New state(s): TR | published on 28.01.2026 [2026/05] | Applicant(s) | For all designated states Light-Med (USA), Inc. 1130 Calle Cordillera San Clemente, CA 92673 / US | [2020/52] | Inventor(s) | 01 /
HUO, Yongjun 6 Logo Vista Dana Point, CA 92629 / US | 02 /
LEE, Chin Chung 8 Curie Court Irvine, CA 92617-4026 / US | [2020/52] | Representative(s) | Groth & Co. KB P.O. Box 6107 102 32 Stockholm / SE | [2020/52] | Application number, filing date | 19768992.0 | 07.05.2019 | [2020/52] | WO2019US31041 | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020226626 | Date: | 12.11.2020 | Language: | EN | [2020/46] | Type: | A1 Application with search report | No.: | EP3753049 | Date: | 23.12.2020 | Language: | EN | The application published by WIPO in one of the EPO official languages on 12.11.2020 takes the place of the publication of the European patent application. | [2020/52] | Type: | B1 Patent specification | No.: | EP3753049 | Date: | 21.09.2022 | Language: | EN | [2022/38] | Search report(s) | International search report - published on: | US | 12.11.2020 | (Supplementary) European search report - dispatched on: | EP | 12.11.2020 | Classification | IPC: | H01L23/36, H01L23/373, H01L21/48, H01L23/00, H01L23/488, H01L25/065 | [2020/52] | CPC: |
H10W40/25 (EP);
H10H20/858 (KR);
H10W40/255 (EP,US);
H10H20/832 (KR);
H10W40/22 (US);
H10W40/258 (EP);
H10W42/121 (EP);
H10W70/02 (US);
H10W72/01338 (US);
H10W72/01365 (US);
H10W72/07331 (US);
H10W72/07336 (EP,US);
H10W72/322 (US);
H10W72/352 (EP,US);
H10W72/923 (EP);
H10W72/952 (EP)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2020/52] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERFAHREN FÜR TRANSIENTE SILBER-INDIUM-FLÜSSIGPHASE ZUM BONDEN VON HALBLEITERBAUELEMENTEN UND WÄRMEVERTEILENDER TRÄGER UND HALBLEITERSTRUKTUR MIT BONDINGVERBINDUNG AUS TRANSIENTER SILBER-INDIUM-FLÜSSIGPHASE | [2020/52] | English: | SILVER-INDIUM TRANSIENT LIQUID PHASE METHOD OF BONDING SEMICONDUCTOR DEVICE AND HEAT-SPREADING MOUNT AND SEMICONDUCTOR STRUCTURE HAVING SILVER-INDIUM TRANSIENT LIQUID PHASE BONDING JOINT | [2020/52] | French: | PROCÉDÉ EN PHASE LIQUIDE TRANSITOIRE ARGENT-INDIUM DE LIAISON DE DISPOSITIF À SEMI-CONDUCTEUR ET SUPPORT DE DISSIPATEUR THERMIQUE ET STRUCTURE SEMI-CONDUCTRICE AYANT UN JOINT DE LIAISON DE PHASE LIQUIDE TRANSITOIRE ARGENT-INDIUM | [2020/52] | Entry into regional phase | 24.09.2019 | National basic fee paid | 24.09.2019 | Search fee paid | 24.09.2019 | Designation fee(s) paid | 24.09.2019 | Examination fee paid | Examination procedure | 24.09.2019 | Amendment by applicant (claims and/or description) | 24.09.2019 | Examination requested [2020/52] | 10.06.2021 | Despatch of a communication from the examining division (Time limit: M04) | 01.07.2021 | Reply to a communication from the examining division | 20.05.2022 | Communication of intention to grant the patent | 16.08.2022 | Fee for grant paid | 16.08.2022 | Fee for publishing/printing paid | 16.08.2022 | Receipt of the translation of the claim(s) | Opposition(s) | 22.06.2023 | No opposition filed within time limit [2023/35] | Appeal following opposition | 23.01.2023 | Appeal received No. T0178/23 | 23.01.2023 | Statement of grounds filed | 11.10.2024 | Date of oral proceedings | Fees paid | Renewal fee | 26.05.2021 | Renewal fee patent year 03 | 26.05.2022 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | CY | 07.05.2019 | HU | 07.05.2019 | AL | 21.09.2022 | AT | 21.09.2022 | BG | 21.09.2022 | CZ | 21.09.2022 | DK | 21.09.2022 | EE | 21.09.2022 | FI | 21.09.2022 | HR | 21.09.2022 | LT | 21.09.2022 | LV | 21.09.2022 | MC | 21.09.2022 | NL | 21.09.2022 | PL | 21.09.2022 | RO | 21.09.2022 | RS | 21.09.2022 | SE | 21.09.2022 | SI | 21.09.2022 | SK | 21.09.2022 | SM | 21.09.2022 | TR | 21.09.2022 | NO | 21.12.2022 | GR | 22.12.2022 | IS | 21.01.2023 | PT | 23.01.2023 | GB | 07.05.2023 | IE | 07.05.2023 | IT | 07.05.2023 | LU | 07.05.2023 | ES | 08.05.2023 | BE | 31.05.2023 | CH | 31.05.2023 | FR | 31.05.2023 | LI | 31.05.2023 | [2026/05] |
| Former [2025/39] | CY | 07.05.2019 | |
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| NO | 21.12.2022 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
| GB | 07.05.2023 | ||
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| NO | 21.12.2022 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
| GB | 07.05.2023 | ||
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| BE | 31.05.2023 | ||
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| NO | 21.12.2022 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
| GB | 07.05.2023 | ||
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| BE | 31.05.2023 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
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| IT | 07.05.2023 | ||
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| BE | 31.05.2023 | ||
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| NO | 21.12.2022 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
| IE | 07.05.2023 | ||
| LU | 07.05.2023 | ||
| CH | 31.05.2023 | ||
| LI | 31.05.2023 | ||
| Former [2024/09] | AL | 21.09.2022 | |
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| NO | 21.12.2022 | ||
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| IS | 21.01.2023 | ||
| PT | 23.01.2023 | ||
| LU | 07.05.2023 | ||
| CH | 31.05.2023 | ||
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| Former [2024/08] | AL | 21.09.2022 | |
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| IS | 21.01.2023 | ||
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| NO | 21.12.2022 | ||
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| NO | 21.12.2022 | Documents cited: | Search | [A] US6504242 (DEPPISCH CARL L et al.) [A] 1-15 * figures 1-3 * * column 1, line 51 - column 3, line 45 * | International search | [XYA] US7023089 (LU DAOQIANG et al.) [X] 32, 35-37 * , FIGs. 1-3, col. 2 Ins 27-62, col. 4 Ins 9-23, 58 -63, col. 5 Ins 11-19, col. 7 Ins 27-36 *[Y] 1-5, 25-27, 29, 30 [A] 6-24, 28, 31, 33, 34, 38 | [YA] US7628309 (ERIKSEN ODD HARALD STEEN et al.) [Y] 1-5, 25-27, 29, 30 * , col. 4 Ins 37-63 *[A] 6-24, 28, 31, 33, 34 | [Y] US8968830 (RAMM JUERGEN et al.) [Y] 2, 4 * , col. 6 Ins 64-67 to col. 7 Ins 1-12 * | [Y] US2013001782 (OTSUKA TAKUKAZU et al.) [Y] 3 * , paras [0023], [0080] * | [Y] US9673163 (OTSUKA TAKUKAZU et al.) [Y] 5 * , col. 16 Ins 61-65, col. 17 Ins 9-13 * | [Y] US5829124 (KRESGE JOHN STEVEN et al.) [Y] 27 * , col. 7 Ins 58-67 * | [YA] US2008002460 (TUCKERMAN DAVID B et al.) [Y] 29 * , paras [0210], [0252] [0377] *[A] 6-24, 31, 33, 34, 38 | by applicant | US6504242 |