EP3783349 - FLUID CHIP AND ANALYSIS DEVICE [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.12.2022 Database last updated on 10.07.2024 | |
Former | Request for examination was made Status updated on 22.01.2021 | ||
Former | The international publication has been made Status updated on 25.10.2019 | Most recent event Tooltip | 09.12.2022 | Application deemed to be withdrawn | published on 11.01.2023 [2023/02] | Applicant(s) | For all designated states TEI Solutions Inc. NIRC, West 7A, SCR Building, 16-1 Onogawa Tsukuba-shi, Ibaraki 305-8569 / JP | [2021/08] | Inventor(s) | 01 /
IKEDA, Shuji 30-8 Nukuikitamachi 3-chome Koganei-shi, Tokyo 184-0015 / JP | 02 /
HASHIMOTO, Naotaka 30-8 Nukuikitamachi 3-chome Koganei-shi, Tokyo 184-0015 / JP | [2021/08] | Representative(s) | Bandpay & Greuter 11 rue Christophe Colomb 75008 Paris / FR | [N/P] |
Former [2021/08] | Bandpay & Greuter 30, rue Notre-Dame des Victoires 75002 Paris / FR | Application number, filing date | 19788620.3 | 15.04.2019 | [2021/08] | WO2019JP16216 | Priority number, date | JP20180081011 | 19.04.2018 Original published format: JP 2018081011 | [2021/08] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2019203201 | Date: | 24.10.2019 | Language: | JA | [2019/43] | Type: | A1 Application with search report | No.: | EP3783349 | Date: | 24.02.2021 | Language: | EN | [2021/08] | Search report(s) | International search report - published on: | JP | 24.10.2019 | (Supplementary) European search report - dispatched on: | EP | 16.12.2021 | Classification | IPC: | G01N33/487, C12Q1/6869 | [2022/03] | CPC: |
B01L3/502715 (EP,US);
G01N27/3278 (KR);
C12Q1/6869 (EP,KR);
G01N27/128 (US);
G01N27/4145 (KR);
G01N27/44791 (US);
G01N33/48721 (EP);
B01L2200/027 (US);
B01L2200/10 (US);
B01L2200/12 (EP);
B01L2300/0645 (EP);
B01L2300/0816 (EP);
B01L2300/0874 (EP);
B01L2300/0887 (EP);
B01L2300/0896 (EP);
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Former IPC [2021/08] | G01N27/00, C12M1/00, C12N15/09, C12Q1/6869 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/08] | Title | German: | FLUIDCHIP UND ANALYSEVORRICHTUNG | [2021/08] | English: | FLUID CHIP AND ANALYSIS DEVICE | [2021/08] | French: | PUCE FLUIDIQUE ET DISPOSITIF D'ANALYSE | [2021/08] | Entry into regional phase | 18.11.2020 | Translation filed | 19.11.2020 | National basic fee paid | 19.11.2020 | Search fee paid | 19.11.2020 | Designation fee(s) paid | 19.11.2020 | Examination fee paid | Examination procedure | 19.11.2020 | Examination requested [2021/08] | 31.05.2021 | Amendment by applicant (claims and/or description) | 23.07.2022 | Application deemed to be withdrawn, date of legal effect [2023/02] | 18.08.2022 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the communication from the examining division not received in time [2023/02] | Fees paid | Renewal fee | 30.04.2021 | Renewal fee patent year 03 | 31.03.2022 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP2006300633 (SHIMADZU CORP) [A] 1-6 * the whole document *; | [XA]WO2017158845 (HITACHI LTD [JP]) [X] 5,6 * fig. 16,22 and corresponding text passages * [A] 1-4; | [A]JP2014190719 (TDK CORP) [A] 1-6 * the whole document *; | [A]JP2010127931 (KOREA ELECTRONICS TELECOMM) [A] 1-6 * fig. 2 and corresponding text passages *; | [A]US2010292101 (SO DANIEL WAI-CHEONG [US]) [A] 1-6 * fig. 11 and corresponding text passages * | International search | [XA]JP2006300633 (SHIMADZU CORP) [X] 1-5, 9 * , paragraphs [0016]-[0026] (Family: none) * [A] 6-8, 10-11; | [XY]WO2017158845 (HITACHI LTD [JP]) [X] 10 * , paragraphs [0087]-[0100], fig. 22 * [Y] 11; | [Y]JP2014190719 (TDK CORP) [Y] 11 * , paragraphs [0025]-[0026], [0056]-[0062], fig. 2 (Family: none) *; | [A]JP2010127931 (KOREA ELECTRONICS TELECOMM) [A] 1-11 * , paragraph [0042], fig. 2 *; | [A]JP2017053808 (TOSHIBA CORP) [A] 1-11 * , entire text, all drawings *; | [A]WO2016038719 (HITACHI LTD [JP]) [A] 1-11 * , fig. 2 *; | [A]WO2017106727 (HARVARD COLLEGE [US]) [A] 1-11 * , paragraph [0152], fig. 8A * | by applicant | JP2015198652 |