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Extract from the Register of European Patents

EP About this file: EP3870368

EP3870368 - REVERSIBLE MICROFLUIDIC CHIP [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  17.11.2023
Database last updated on 26.07.2024
FormerThe patent has been granted
Status updated on  09.12.2022
FormerGrant of patent is intended
Status updated on  08.08.2022
FormerExamination is in progress
Status updated on  04.02.2022
FormerRequest for examination was made
Status updated on  30.07.2021
FormerThe international publication has been made
Status updated on  02.05.2020
Formerunknown
Status updated on  10.12.2019
Most recent event   Tooltip07.06.2024Lapse of the patent in a contracting state
New state(s): MC
published on 10.07.2024  [2024/28]
Applicant(s)For all designated states
Institut National des Sciences Appliquées de Toulouse
135 avenue de Rangueil
31077 Toulouse Cedex 4 / FR
For all designated states
Centre national de la recherche scientifique
3, rue Michel Ange
75016 Paris / FR
[2021/35]
Inventor(s)01 / RAFFY, Simon
21 avenue Marcel Langer
31400 TOULOUSE / FR
02 / RESSIER, Laurence
2 Impasse le Clos du Moulin
31320 AUZEVILLE TOLOSANE / FR
03 / PALLEAU, Etienne
18 Résidence en Poutet
31750 ESCALQUENS / FR
 [2021/35]
Representative(s)Ipsilon
Le Centralis
63, avenue du Général Leclerc
92340 Bourg-la-Reine / FR
[2021/35]
Application number, filing date19813100.523.10.2019
[2021/35]
WO2019FR52530
Priority number, dateFR2018005990026.10.2018         Original published format: FR 1859900
[2021/35]
Filing languageFR
Procedural languageFR
PublicationType: A1 Application with search report
No.:WO2020084255
Date:30.04.2020
Language:FR
[2020/18]
Type: A1 Application with search report 
No.:EP3870368
Date:01.09.2021
Language:FR
The application published by WIPO in one of the EPO official languages on 30.04.2020 takes the place of the publication of the European patent application.
[2021/35]
Type: B1 Patent specification 
No.:EP3870368
Date:11.01.2023
Language:FR
[2023/02]
Search report(s)International search report - published on:EP30.04.2020
ClassificationIPC:B01L3/00, B29C65/76, B29C39/00, B81C99/00, B32B7/02, B32B27/38
[2021/35]
CPC:
B01L3/502707 (EP,US); B29C33/3857 (US); B29C33/405 (US);
B29C39/006 (US); B29C39/025 (US); B29C39/36 (US);
B32B27/08 (US); B32B27/38 (US); B01L2200/12 (EP,US);
B01L2300/04 (US); B01L2300/041 (EP); B01L2300/0816 (EP);
B01L2300/0887 (EP,US); B01L2300/123 (EP,US); B29K2063/00 (US);
B29K2833/12 (US); B29K2883/00 (US); B29K2995/0046 (US);
B29L2031/752 (US); B32B2250/24 (US); B32B2307/51 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/35]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:UMKEHRBARER MIKROFLUIDISCHER CHIP[2021/35]
English:REVERSIBLE MICROFLUIDIC CHIP[2021/35]
French:PUCE MICROFLUIDIQUE RÉVERSIBLE[2022/33]
Former [2021/35]PUCE MICROFLUIDIQUE REVERSIBLE
Entry into regional phase14.04.2021National basic fee paid 
14.04.2021Designation fee(s) paid 
14.04.2021Examination fee paid 
Examination procedure14.04.2021Examination requested  [2021/35]
14.04.2021Date on which the examining division has become responsible
12.10.2021Amendment by applicant (claims and/or description)
07.02.2022Despatch of a communication from the examining division (Time limit: M06)
08.07.2022Reply to a communication from the examining division
09.08.2022Communication of intention to grant the patent
01.12.2022Fee for grant paid
01.12.2022Fee for publishing/printing paid
01.12.2022Receipt of the translation of the claim(s)
Opposition(s)12.10.2023No opposition filed within time limit [2023/51]
Fees paidRenewal fee
29.10.2021Renewal fee patent year 03
25.10.2022Renewal fee patent year 04
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Lapses during opposition  TooltipAT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
IT11.01.2023
LT11.01.2023
LV11.01.2023
MC11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
RS11.01.2023
SE11.01.2023
SI11.01.2023
SK11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
[2024/28]
Former [2024/26]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
IT11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
RS11.01.2023
SE11.01.2023
SI11.01.2023
SK11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2024/11]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
RS11.01.2023
SE11.01.2023
SI11.01.2023
SK11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/50]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
RS11.01.2023
SE11.01.2023
SK11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/49]AT11.01.2023
CZ11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RO11.01.2023
RS11.01.2023
SE11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/48]AT11.01.2023
DK11.01.2023
EE11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RS11.01.2023
SE11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/46]AT11.01.2023
DK11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RS11.01.2023
SE11.01.2023
SM11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/39]AT11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RS11.01.2023
SE11.01.2023
NO11.04.2023
GR12.04.2023
IS11.05.2023
PT11.05.2023
Former [2023/38]AT11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
PL11.01.2023
RS11.01.2023
SE11.01.2023
NO11.04.2023
GR12.04.2023
PT11.05.2023
Former [2023/37]AT11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
RS11.01.2023
SE11.01.2023
NO11.04.2023
GR12.04.2023
PT11.05.2023
Former [2023/36]AT11.01.2023
ES11.01.2023
FI11.01.2023
HR11.01.2023
LT11.01.2023
LV11.01.2023
NL11.01.2023
RS11.01.2023
SE11.01.2023
NO11.04.2023
PT11.05.2023
Former [2023/35]AT11.01.2023
ES11.01.2023
HR11.01.2023
LT11.01.2023
NL11.01.2023
RS11.01.2023
NO11.04.2023
PT11.05.2023
Former [2023/34]ES11.01.2023
LT11.01.2023
NL11.01.2023
RS11.01.2023
PT11.05.2023
Former [2023/33]ES11.01.2023
LT11.01.2023
NL11.01.2023
Former [2023/31]NL11.01.2023
Cited inInternational search[A]US2017156623  (CHU MICHAEL [US], et al) [A] 1,15-17 * abstract *;
 [A]  - ZHEN CHENG ET AL, "Enclosed casting of epoxy resin for rapid fabrication of rigid microfluidic chips", SENSORS AND ACTUATORS B: CHEMICAL: INTERNATIONAL JOURNAL DEVOTED TO RESEARCH AND DEVELOPMENT OF PHYSICAL AND CHEMICAL TRANSDUCERS, NL, (20170609), vol. 252, doi:10.1016/j.snb.2017.06.053, ISSN 0925-4005, pages 785 - 793, XP055593485 [A] 1-18 * abstract *

DOI:   http://dx.doi.org/10.1016/j.snb.2017.06.053
 [A]  - REBECCA J JACKMAN ET AL, "Microfluidic systems with on-line UV detection fabricated in photodefinable epoxy; Microfluidic systems with on-line UV detection", JOURNAL OF MICROMECHANICS & MICROENGINEERING, INSTITUTE OF PHYSICS PUBLISHING, BRISTOL, GB, (20010328), vol. 11, no. 3, doi:10.1088/0960-1317/11/3/316, ISSN 0960-1317, pages 263 - 269, XP020068645 [A] 1-18 * figures 1, 3(b) *

DOI:   http://dx.doi.org/10.1088/0960-1317/11/3/316
 [A]  - SETHU P ET AL, "Cast epoxy-based microfluidic systems and their application in biotechnology", SENSORS AND ACTUATORS B: CHEMICAL: INTERNATIONAL JOURNAL DEVOTED TO RESEARCH AND DEVELOPMENT OF PHYSICAL AND CHEMICAL TRANSDUCERS, ELSEVIER BV, NL, (20040315), vol. 98, no. 2-3, doi:10.1016/J.SNB.2003.09.036, ISSN 0925-4005, pages 337 - 346, XP004493696 [A] 1-18 * abstract; part "4.2 Bonding";; figure 3 *

DOI:   http://dx.doi.org/10.1016/j.snb.2003.09.036
 [XA]  - Esprit Composite, "Résine Époxy EC251", 22 Rue Gassendi, 75014 Paris, France, (20071022), URL: https://espritcomposite.com/img/cms/pdf/resine_epoxy_ec251_ft.pdf, (20190603), XP055593396 [X] 16 * the whole document * [A] 1,15,17
by applicantWO2011072713
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.