EP3763709 - ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUIT, AND ADHESIVE FILM COMPRISING SAME [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 05.01.2024 Database last updated on 20.07.2024 | |
Former | The patent has been granted Status updated on 27.01.2023 | ||
Former | Grant of patent is intended Status updated on 21.12.2022 | ||
Former | Request for examination was made Status updated on 11.12.2020 | ||
Former | The international publication has been made Status updated on 02.05.2020 | Most recent event Tooltip | 19.07.2024 | Lapse of the patent in a contracting state New state(s): CH | published on 21.08.2024 [2024/34] | Applicant(s) | For all designated states LG CHEM, LTD. 128, Yeoui-daero Yeongdeungpo-gu Seoul 07336 / KR | [2021/02] | Inventor(s) | 01 /
KIM, Youngsam LG Chem Research Park, 188, Munji-ro, Yuseong-gu Daejeon 34122 / KR | 02 /
KIM, Junghak LG Chem Research Park, 188, Munji-ro, Yuseong-gu Daejeon 34122 / KR | 03 /
KIM, Ju Hyeon LG Chem Research Park, 188, Munji-ro, Yuseong-gu Daejeon 34122 / KR | 04 /
LEE, Kwang Joo LG Chem Research Park, 188, Munji-ro, Yuseong-gu Daejeon 34122 / KR | [2021/02] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2021/02] | Application number, filing date | 19877004.2 | 22.10.2019 | [2021/02] | WO2019KR13905 | Priority number, date | KR20180126662 | 23.10.2018 Original published format: KR 20180126662 | [2021/02] | Filing language | KO | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020085770 | Date: | 30.04.2020 | Language: | KO | [2020/18] | Type: | A1 Application with search report | No.: | EP3763709 | Date: | 13.01.2021 | Language: | EN | [2021/02] | Type: | B1 Patent specification | No.: | EP3763709 | Date: | 01.03.2023 | Language: | EN | [2023/09] | Search report(s) | International search report - published on: | KR | 30.04.2020 | (Supplementary) European search report - dispatched on: | EP | 02.06.2021 | Classification | IPC: | C07D403/12, C09J11/06, C09J201/00, C09D163/00, C09J7/00, H01L21/67 | [2021/02] | CPC: |
C07D403/12 (EP,KR,US);
C08F220/34 (KR);
C08F220/36 (KR);
C09D163/00 (EP);
C09J11/06 (EP,US);
C09J11/08 (KR);
C09J163/00 (KR,US);
C09J201/00 (EP,KR);
C09J7/00 (EP);
C09J7/30 (US);
H01L21/67 (EP);
H01L24/10 (KR);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/02] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | KLEBSTOFFZUSAMMENSETZUNG ZUM VERBINDEN EINER HALBLEITERSCHALTUNG UND DAMIT VERSEHENE KLEBEFOLIE | [2021/02] | English: | ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUIT, AND ADHESIVE FILM COMPRISING SAME | [2021/02] | French: | COMPOSITION ADHÉSIVE POUR CONNECTER UN CIRCUIT SEMI-CONDUCTEUR, ET FILM ADHÉSIF LA COMPRENANT | [2021/02] | Entry into regional phase | 08.09.2020 | Translation filed | 08.09.2020 | National basic fee paid | 08.09.2020 | Search fee paid | 08.09.2020 | Designation fee(s) paid | 08.09.2020 | Examination fee paid | Examination procedure | 08.09.2020 | Examination requested [2021/02] | 15.12.2021 | Amendment by applicant (claims and/or description) | 22.12.2022 | Communication of intention to grant the patent | 13.01.2023 | Fee for grant paid | 13.01.2023 | Fee for publishing/printing paid | 13.01.2023 | Receipt of the translation of the claim(s) | Opposition(s) | 04.12.2023 | No opposition filed within time limit [2024/06] | Fees paid | Renewal fee | 22.10.2021 | Renewal fee patent year 03 | 21.10.2022 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 01.03.2023 | CZ | 01.03.2023 | DK | 01.03.2023 | EE | 01.03.2023 | ES | 01.03.2023 | FI | 01.03.2023 | HR | 01.03.2023 | IT | 01.03.2023 | LT | 01.03.2023 | LV | 01.03.2023 | MC | 01.03.2023 | NL | 01.03.2023 | PL | 01.03.2023 | RO | 01.03.2023 | RS | 01.03.2023 | SE | 01.03.2023 | SI | 01.03.2023 | SK | 01.03.2023 | SM | 01.03.2023 | NO | 01.06.2023 | GR | 02.06.2023 | IS | 01.07.2023 | PT | 03.07.2023 | LU | 22.10.2023 | CH | 31.10.2023 | [2024/34] |
Former [2024/30] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
IT | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
LU | 22.10.2023 | ||
Former [2024/28] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
IT | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
MC | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2024/26] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
IT | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2024/10] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
DK | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SI | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2023/50] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SK | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
IS | 01.07.2023 | ||
PT | 03.07.2023 | ||
Former [2023/49] | AT | 01.03.2023 | |
CZ | 01.03.2023 | ||
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RO | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/48] | AT | 01.03.2023 | |
EE | 01.03.2023 | ||
ES | 01.03.2023 | ||
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/46] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
SM | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
PT | 03.07.2023 | ||
Former [2023/38] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
NL | 01.03.2023 | ||
PL | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
Former [2023/37] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
GR | 02.06.2023 | ||
Former [2023/36] | ES | 01.03.2023 | |
FI | 01.03.2023 | ||
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
LV | 01.03.2023 | ||
RS | 01.03.2023 | ||
SE | 01.03.2023 | ||
NO | 01.06.2023 | ||
Former [2023/35] | ES | 01.03.2023 | |
HR | 01.03.2023 | ||
LT | 01.03.2023 | ||
RS | 01.03.2023 | ||
NO | 01.06.2023 | ||
Former [2023/34] | ES | 01.03.2023 | |
LT | 01.03.2023 | ||
RS | 01.03.2023 | ||
Former [2023/33] | ES | 01.03.2023 | |
LT | 01.03.2023 | Cited in | International search | [A]JP2002194057 (TOAGOSEI CO LTD); | [A]US2009111930 (VAN GEMERT GABY MARIA LEONARDA [NL], et al); | [A]CN104231157 (UNIV XIAMEN); |