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Extract from the Register of European Patents

EP About this file: EP3763709

EP3763709 - ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUIT, AND ADHESIVE FILM COMPRISING SAME [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  05.01.2024
Database last updated on 20.07.2024
FormerThe patent has been granted
Status updated on  27.01.2023
FormerGrant of patent is intended
Status updated on  21.12.2022
FormerRequest for examination was made
Status updated on  11.12.2020
FormerThe international publication has been made
Status updated on  02.05.2020
Most recent event   Tooltip19.07.2024Lapse of the patent in a contracting state
New state(s): CH
published on 21.08.2024 [2024/34]
Applicant(s)For all designated states
LG CHEM, LTD.
128, Yeoui-daero
Yeongdeungpo-gu
Seoul 07336 / KR
[2021/02]
Inventor(s)01 / KIM, Youngsam
LG Chem Research Park, 188, Munji-ro, Yuseong-gu
Daejeon 34122 / KR
02 / KIM, Junghak
LG Chem Research Park, 188, Munji-ro, Yuseong-gu
Daejeon 34122 / KR
03 / KIM, Ju Hyeon
LG Chem Research Park, 188, Munji-ro, Yuseong-gu
Daejeon 34122 / KR
04 / LEE, Kwang Joo
LG Chem Research Park, 188, Munji-ro, Yuseong-gu
Daejeon 34122 / KR
 [2021/02]
Representative(s)Goddar, Heinz J.
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[2021/02]
Application number, filing date19877004.222.10.2019
[2021/02]
WO2019KR13905
Priority number, dateKR2018012666223.10.2018         Original published format: KR 20180126662
[2021/02]
Filing languageKO
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2020085770
Date:30.04.2020
Language:KO
[2020/18]
Type: A1 Application with search report 
No.:EP3763709
Date:13.01.2021
Language:EN
[2021/02]
Type: B1 Patent specification 
No.:EP3763709
Date:01.03.2023
Language:EN
[2023/09]
Search report(s)International search report - published on:KR30.04.2020
(Supplementary) European search report - dispatched on:EP02.06.2021
ClassificationIPC:C07D403/12, C09J11/06, C09J201/00, C09D163/00, C09J7/00, H01L21/67
[2021/02]
CPC:
C07D403/12 (EP,KR,US); C08F220/34 (KR); C08F220/36 (KR);
C09D163/00 (EP); C09J11/06 (EP,US); C09J11/08 (KR);
C09J163/00 (KR,US); C09J201/00 (EP,KR); C09J7/00 (EP);
C09J7/30 (US); H01L21/67 (EP); H01L24/10 (KR);
H01L24/26 (KR); H01L24/29 (US); C09J2203/326 (KR) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2021/02]
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:KLEBSTOFFZUSAMMENSETZUNG ZUM VERBINDEN EINER HALBLEITERSCHALTUNG UND DAMIT VERSEHENE KLEBEFOLIE[2021/02]
English:ADHESIVE COMPOSITION FOR CONNECTING SEMICONDUCTOR CIRCUIT, AND ADHESIVE FILM COMPRISING SAME[2021/02]
French:COMPOSITION ADHÉSIVE POUR CONNECTER UN CIRCUIT SEMI-CONDUCTEUR, ET FILM ADHÉSIF LA COMPRENANT[2021/02]
Entry into regional phase08.09.2020Translation filed 
08.09.2020National basic fee paid 
08.09.2020Search fee paid 
08.09.2020Designation fee(s) paid 
08.09.2020Examination fee paid 
Examination procedure08.09.2020Examination requested  [2021/02]
15.12.2021Amendment by applicant (claims and/or description)
22.12.2022Communication of intention to grant the patent
13.01.2023Fee for grant paid
13.01.2023Fee for publishing/printing paid
13.01.2023Receipt of the translation of the claim(s)
Opposition(s)04.12.2023No opposition filed within time limit [2024/06]
Fees paidRenewal fee
22.10.2021Renewal fee patent year 03
21.10.2022Renewal fee patent year 04
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See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipAT01.03.2023
CZ01.03.2023
DK01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
IT01.03.2023
LT01.03.2023
LV01.03.2023
MC01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SI01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
LU22.10.2023
CH31.10.2023
[2024/34]
Former [2024/30]AT01.03.2023
CZ01.03.2023
DK01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
IT01.03.2023
LT01.03.2023
LV01.03.2023
MC01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SI01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
LU22.10.2023
Former [2024/28]AT01.03.2023
CZ01.03.2023
DK01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
IT01.03.2023
LT01.03.2023
LV01.03.2023
MC01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SI01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
Former [2024/26]AT01.03.2023
CZ01.03.2023
DK01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
IT01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SI01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
Former [2024/10]AT01.03.2023
CZ01.03.2023
DK01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SI01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
Former [2023/50]AT01.03.2023
CZ01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SK01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
IS01.07.2023
PT03.07.2023
Former [2023/49]AT01.03.2023
CZ01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RO01.03.2023
RS01.03.2023
SE01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
PT03.07.2023
Former [2023/48]AT01.03.2023
EE01.03.2023
ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RS01.03.2023
SE01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
PT03.07.2023
Former [2023/46]ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RS01.03.2023
SE01.03.2023
SM01.03.2023
NO01.06.2023
GR02.06.2023
PT03.07.2023
Former [2023/38]ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
NL01.03.2023
PL01.03.2023
RS01.03.2023
SE01.03.2023
NO01.06.2023
GR02.06.2023
Former [2023/37]ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
RS01.03.2023
SE01.03.2023
NO01.06.2023
GR02.06.2023
Former [2023/36]ES01.03.2023
FI01.03.2023
HR01.03.2023
LT01.03.2023
LV01.03.2023
RS01.03.2023
SE01.03.2023
NO01.06.2023
Former [2023/35]ES01.03.2023
HR01.03.2023
LT01.03.2023
RS01.03.2023
NO01.06.2023
Former [2023/34]ES01.03.2023
LT01.03.2023
RS01.03.2023
Former [2023/33]ES01.03.2023
LT01.03.2023
Cited inInternational search[A]JP2002194057  (TOAGOSEI CO LTD);
 [A]US2009111930  (VAN GEMERT GABY MARIA LEONARDA [NL], et al);
 [A]CN104231157  (UNIV XIAMEN);
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.