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EP3854492
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EP About this file: EP3854492
| EP3854492 - APPARATUS FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, METHOD FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, AND SYSTEM FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 17.05.2024 Database last updated on 06.07.2024 | |
| Former | Grant of patent is intended Status updated on 11.03.2024 | ||
| Former | Examination is in progress Status updated on 24.11.2023 | ||
| Former | Request for examination was made Status updated on 25.06.2021 | ||
| Former | The international publication has been made Status updated on 22.05.2020 | Most recent event Tooltip | 17.05.2024 | (Expected) grant | published on 19.06.2024 [2024/25] | Applicant(s) | For all designated states Taiyo Nippon Sanso Corporation 3-26, Koyama 1-chome Shinagawa-ku Tokyo 142-8558 / JP | [2021/30] | Inventor(s) | 01 /
YAMAGUCHI Akira c/o TAIYO NIPPON SANSO CORPORATION 3-26, Koyama 1-chome Shinagawa-ku Tokyo 142-8558 / JP | 02 /
ARIMURA Tadanobu c/o TAIYO NIPPON SANSO CORPORATION 3-26, Koyama 1-chome Shinagawa-ku Tokyo 142-8558 / JP | [2024/25] |
| Former [2021/30] | 01 /
YAMAGUCHI Akira c/o TAIYO NIPPON SANSO CORPORATION, 3-26, Koyama 1-chome, Shinagawa-ku Tokyo 142-8558 / JP | ||
| 02 /
ARIMURA Tadanobu c/o TAIYO NIPPON SANSO CORPORATION, 3-26, Koyama 1-chome, Shinagawa-ku Tokyo 142-8558 / JP | Representative(s) | HGF HGF Limited 1 City Walk Leeds LS11 9DX / GB | [2024/25] |
| Former [2021/30] | HGF 1 City Walk Leeds LS11 9DX / GB | Application number, filing date | 19884724.6 | 25.10.2019 | [2021/30] | WO2019JP41870 | Priority number, date | JP20180215791 | 16.11.2018 Original published format: JP 2018215791 | [2021/30] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2020100554 | Date: | 22.05.2020 | Language: | JA | [2020/21] | Type: | A1 Application with search report | No.: | EP3854492 | Date: | 28.07.2021 | Language: | EN | [2021/30] | Type: | B1 Patent specification | No.: | EP3854492 | Date: | 19.06.2024 | Language: | EN | [2024/25] | Search report(s) | International search report - published on: | JP | 22.05.2020 | (Supplementary) European search report - dispatched on: | EP | 23.12.2021 | Classification | IPC: | H01L21/67, C23C16/34, C23C16/44 | [2024/12] | CPC: |
H01L21/67109 (EP);
C23C16/4405 (US);
C23C16/34 (EP);
C23C16/4401 (EP);
H01L21/02041 (US);
H01L21/67028 (EP,US);
H01L21/67098 (US)
(-)
|
| Former IPC [2022/04] | B08B7/00, H01L21/205, H01L21/67, C23C16/44 | ||
| Former IPC [2021/30] | B08B7/00, H01L21/205 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/30] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VORRICHTUNG ZUR REINIGUNG EINER KOMPONENTE EINER HALBLEITERHERSTELLUNGSEINRICHTUNG, VERFAHREN ZUR REINIGUNG EINER KOMPONENTE EINER HALBLEITERHERSTELLUNGSEINRICHTUNG UND SYSTEM ZUR REINIGUNG EINER KOMPONENTE EINER HALBLEITERHERSTELLUNGSEINRICHTUNG | [2021/30] | English: | APPARATUS FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, METHOD FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS, AND SYSTEM FOR CLEANING COMPONENT OF SEMICONDUCTOR PRODUCTION APPARATUS | [2021/30] | French: | APPAREIL DE NETTOYAGE DE COMPOSANT D'APPAREIL DE PRODUCTION DE SEMI-CONDUCTEUR, PROCÉDÉ DE NETTOYAGE DE COMPOSANT D'APPAREIL DE PRODUCTION DE SEMI-CONDUCTEUR, ET SYSTÈME DE NETTOYAGE DE COMPOSANT D'APPAREIL DE PRODUCTION DE SEMI-CONDUCTEUR | [2021/30] | Entry into regional phase | 21.04.2021 | Translation filed | 21.04.2021 | National basic fee paid | 21.04.2021 | Search fee paid | 21.04.2021 | Designation fee(s) paid | 21.04.2021 | Examination fee paid | Examination procedure | 21.04.2021 | Examination requested [2021/30] | 23.05.2022 | Amendment by applicant (claims and/or description) | 23.11.2023 | Despatch of a communication from the examining division (Time limit: M04) | 22.01.2024 | Reply to a communication from the examining division | 12.03.2024 | Communication of intention to grant the patent | 10.05.2024 | Fee for grant paid | 10.05.2024 | Fee for publishing/printing paid | 10.05.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 11.10.2021 | Renewal fee patent year 03 | 14.10.2022 | Renewal fee patent year 04 | 26.09.2023 | Renewal fee patent year 05 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XYI]JPH07249585 (FUJITSU LTD); | [YA]US2002062837 (MIYANAGA MAMIKO [JP], et al); | [YA]JP2018041883 (TAIYO NIPPON SANSO CORP) | International search | [YA]JPH1187326 (EBARA CORP); | [YA]JP2001515282 ; | [YA]JP2010245376 (TAIYO NIPPON SANSO CORP); | [YA]JP2011501429 ; | [YA]JP2015192063 (TOKYO ELECTRON LTD); | [XYA]JP2017168607 (TAIYO NIPPON SANSO CORP); | [A]JP2018041883 (TAIYO NIPPON SANSO CORP) | by applicant | JP2013062342 | JP2015073132 |