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Extract from the Register of European Patents

EP About this file: EP4066976

EP4066976 - COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  02.09.2022
Database last updated on 18.10.2024
FormerThe international publication has been made
Status updated on  04.06.2021
Most recent event   Tooltip05.10.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Fuji Corporation
19, Chausuyama
Yamamachi
Chiryu-shi, Aichi 472-8686 / JP
[2022/40]
Inventor(s)01 / SAKURAYAMA, Takeshi
c/o FUJI CORPORATION
19 Chausuyama, Yamamachi
Chiryu-shi, Aichi 472-8686 / JP
 [2022/40]
Representative(s)Grünecker Patent- und Rechtsanwälte PartG mbB
Leopoldstraße 4
80802 München / DE
[2022/40]
Application number, filing date19953826.526.11.2019
[2022/40]
WO2019JP46056
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021106056
Date:03.06.2021
Language:JA
[2021/22]
Type: A1 Application with search report 
No.:EP4066976
Date:05.10.2022
Language:EN
[2022/40]
Search report(s)International search report - published on:JP03.06.2021
(Supplementary) European search report - dispatched on:EP04.04.2023
ClassificationIPC:B23K1/00, H05K3/34, H05K3/30, B23K1/008, B23K1/20, B23K35/02, B23K35/26, B23K3/06, // H05K1/18, H05K3/12
[2023/18]
CPC:
B23K1/008 (EP); H01L33/0095 (US); B23K1/20 (EP);
B23K3/0638 (EP); B23K35/025 (EP); B23K35/262 (EP);
H01L33/62 (US); H05K3/303 (EP); H05K3/3463 (EP);
H05K1/181 (EP); H05K2201/10106 (EP); H05K2203/0126 (EP);
H05K2203/0139 (EP); H05K2203/048 (EP); H05K2203/166 (EP);
H05K3/1216 (EP); H05K3/1241 (EP); H05K3/3431 (EP);
H05K3/3485 (EP); Y02P70/50 (EP) (-)
Former IPC [2022/40]B23K1/00, H05K3/34
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/40]
TitleGerman:KOMPONENTENMONTAGEVERFAHREN UND KOMPONENTENMONTAGESYSTEM[2022/40]
English:COMPONENT MOUNTING METHOD, AND COMPONENT MOUNTING SYSTEM[2022/40]
French:PROCÉDÉ DE MONTAGE DE COMPOSANTS ET SYSTÈME DE MONTAGE DE COMPOSANTS[2022/40]
Entry into regional phase23.05.2022Translation filed 
23.05.2022National basic fee paid 
23.05.2022Search fee paid 
23.05.2022Designation fee(s) paid 
23.05.2022Examination fee paid 
Examination procedure23.05.2022Examination requested  [2022/40]
25.09.2023Amendment by applicant (claims and/or description)
25.09.2023Date on which the examining division has become responsible
Fees paidRenewal fee
23.05.2022Renewal fee patent year 03
13.10.2022Renewal fee patent year 04
29.09.2023Renewal fee patent year 05
04.10.2024Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[Y]JP2007201286  (KYOCERA CORP) [Y] 3-5,8* paragraphs [0034] - [0055]; figures 1a-f *;
 [XY]US2015223347  (ELGER GORDON PATRICK RUDOLF [NL]) [X] 1,2,6,7,9,10 * paragraphs [0009] - [0010] - [0015] - [0019]; figures 1-3 * [Y] 3-5,8
International search[YA]JP2004185631  (MATSUSHITA ELECTRIC IND CO LTD) [Y] 5,8,10 * [0026], [0027], [0120], [0207], [0536]-[0543] [0026], [0027], [0120], [0207], [0536]-[0543] *[A] 6;
 [YA]WO2011027659  (MURATA MANUFACTURING CO [JP], et al) [Y] 1-5,7-10 * [0010],[0054],[0058],[0062] [0010],[0054],[0058],[0062] * [A] 6;
 [YA]WO2015152387  (SENJU METAL INDUSTRY CO [JP]) [Y] 1-5,7,9-10 * [0055] [0055] * [A] 6
by applicantJP2015517222
 JP2015517222
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.