EP3702387 - PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 15.03.2024 Database last updated on 19.10.2024 | |
Former | The patent has been granted Status updated on 07.04.2023 | ||
Former | Grant of patent is intended Status updated on 15.01.2023 | ||
Former | Examination is in progress Status updated on 25.03.2022 | ||
Former | Request for examination was made Status updated on 05.03.2021 | ||
Former | The application has been published Status updated on 31.07.2020 | Most recent event Tooltip | 03.10.2024 | Lapse of the patent in a contracting state New state(s): MC | published on 06.11.2024 [2024/45] | Applicant(s) | For all designated states TOKYO OHKA KOGYO CO., LTD. 150, Nakamaruko Nakahara-ku Kawasaki-shi, Kanagawa 211 0012 / JP | [2020/36] | Inventor(s) | 01 /
UEMATSU, Teruhiro c/o TOKYO OHKA KOGYO CO., LTD. 150, Nakamaruko Nakahara-ku Kawasaki-shi Kanagawa 211-0012 / JP | [2020/36] | Representative(s) | Plasseraud IP 104 Rue de Richelieu CS92104 75080 Paris Cedex 02 / FR | [N/P] |
Former [2020/36] | Plasseraud IP 66, rue de la Chaussée d'Antin 75440 Paris Cedex 09 / FR | Application number, filing date | 20159057.7 | 24.02.2020 | [2020/36] | Priority number, date | JP20190036725 | 28.02.2019 Original published format: JP 2019036725 | JP20190158539 | 30.08.2019 Original published format: JP 2019158539 | [2020/36] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP3702387 | Date: | 02.09.2020 | Language: | EN | [2020/36] | Type: | B1 Patent specification | No.: | EP3702387 | Date: | 10.05.2023 | Language: | EN | [2023/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.05.2020 | Classification | IPC: | C08G59/00, C08G2/00, C08G59/40, C08G65/18, G03C1/73, G03F7/039, H01L21/027 | [2020/36] | CPC: |
C08G59/00 (EP);
G03F7/004 (CN);
C03C15/00 (CN);
C08G59/40 (EP);
C08G65/18 (EP);
C08L61/06 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2021/14] |
Former [2020/36] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | LICHTEMPFINDLICHE HARZZUSAMMENSETZUNG UND VERFAHREN ZUM ÄTZEN VON GLASSUBSTRATEN | [2020/36] | English: | PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE | [2020/36] | French: | COMPOSITION DE RÉSINE PHOTOSENSIBLE ET PROCÉDÉ DE GRAVURE DE SUBSTRAT DE VERRE | [2020/36] | Examination procedure | 26.02.2021 | Amendment by applicant (claims and/or description) | 26.02.2021 | Examination requested [2021/14] | 26.02.2021 | Date on which the examining division has become responsible | 28.03.2022 | Despatch of a communication from the examining division (Time limit: M04) | 21.07.2022 | Reply to a communication from the examining division | 16.01.2023 | Communication of intention to grant the patent | 28.03.2023 | Fee for grant paid | 28.03.2023 | Fee for publishing/printing paid | 28.03.2023 | Receipt of the translation of the claim(s) | Opposition(s) | 13.02.2024 | No opposition filed within time limit [2024/16] | Fees paid | Renewal fee | 20.12.2021 | Renewal fee patent year 03 | 18.01.2023 | Renewal fee patent year 04 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 10.05.2023 | CZ | 10.05.2023 | DK | 10.05.2023 | EE | 10.05.2023 | ES | 10.05.2023 | FI | 10.05.2023 | HR | 10.05.2023 | IT | 10.05.2023 | LT | 10.05.2023 | LV | 10.05.2023 | MC | 10.05.2023 | PL | 10.05.2023 | RO | 10.05.2023 | RS | 10.05.2023 | SE | 10.05.2023 | SI | 10.05.2023 | SK | 10.05.2023 | SM | 10.05.2023 | NO | 10.08.2023 | GR | 11.08.2023 | IS | 10.09.2023 | PT | 11.09.2023 | [2024/45] |
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PT | 11.09.2023 | Documents cited: | Search | [X]US6338936 (ICHIKAWA MIYAKO [JP], et al) [X] 1-9 * column 1, line 5 - column 18, line 46; example -; claims 1-27 *; | [X]JP2004330269 (JSR CORP) [X] 1-9 * paragraph [0001] - paragraph [0062]; example -; claims 1-7 *; | [X]US2006003260 (NAKAGAWA YUSUKE [JP], et al) [X] 1-9 * paragraph [0001] - paragraph [0176]; example -; claims 1-14 *; | [X]JP2008096717 (TOKYO OHKA KOGYO CO LTD) [X] 1-9* paragraph [0001] - paragraph [0116]; example -; claims 1-11 *; | [X]JP2009157235 (SANYO CHEMICAL IND LTD) [X] 1-9 * paragraph [0001] - paragraph [0097]; example -; claims 1-5 *; | [X]JP2009157225 (SANYO CHEMICAL IND LTD) [X] 1-9 * paragraph [0001] - paragraph [0070]; example -; claims 1-5 *; | [X]JP2009237412 (SANYO CHEMICAL IND LTD) [X] 1-9 * paragraph [0001] - paragraph [0086]; example -; claims 1-5 * | by applicant | JP2008076768 | JP2019036725 | JP2019158539 |