EP3979313 - POWER ELECTRONICS DEVICE AND POWER SEMICONDUCTOR MODULE USING THE SAME [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 06.10.2023 Database last updated on 24.07.2024 | |
Former | The patent has been granted Status updated on 28.10.2022 | ||
Former | Grant of patent is intended Status updated on 19.07.2022 | ||
Former | Request for examination was made Status updated on 04.03.2022 | Most recent event Tooltip | 07.06.2024 | Lapse of the patent in a contracting state New state(s): MC | published on 10.07.2024 [2024/28] | Applicant(s) | For all designated states SEMIKRON Elektronik GmbH & Co. KG Sigmundstrasse 200 90431 Nürnberg / DE | [2022/14] | Inventor(s) | 01 /
Cardi, Valeriano 00165 Rom / IT | 02 /
Hopfe, Stefan 90571 Schwaig / DE | 03 /
Muscolino, Maurilio Giovannantonio 00042 Anzio / IT | 04 /
Santoro, Matteo 00071 Pomezia / IT | 05 /
Obermaier, Werner 22455 Hamburg / DE | [2022/14] | Application number, filing date | 20199403.5 | 30.09.2020 | [2022/14] | Filing language | DE | Procedural language | DE | Publication | Type: | A1 Application with search report | No.: | EP3979313 | Date: | 06.04.2022 | Language: | DE | [2022/14] | Type: | B1 Patent specification | No.: | EP3979313 | Date: | 30.11.2022 | Language: | DE | [2022/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 31.03.2021 | Classification | IPC: | H01L23/373, H01L23/40 | [2022/14] | CPC: |
H01L23/3735 (EP);
H01L23/053 (US);
H01L23/13 (US);
H01L23/40 (US);
H01L23/49811 (US);
H01L23/3731 (EP);
H01L23/4006 (EP)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/23] |
Former [2022/14] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | LEISTUNGSELEKTRONISCHE EINRICHTUNG UND LEISTUNGSHALBLEITERMODUL DAMIT | [2022/14] | English: | POWER ELECTRONICS DEVICE AND POWER SEMICONDUCTOR MODULE USING THE SAME | [2022/14] | French: | DISPOSITIF ÉLECTRONIQUE DE PUISSANCE ET MODULE SEMI-CONDUCTEUR DE PUISSANCE CORRESPONDANT | [2022/14] | Examination procedure | 26.04.2021 | Examination requested [2022/14] | 26.04.2021 | Date on which the examining division has become responsible | 03.06.2022 | Amendment by applicant (claims and/or description) | 20.07.2022 | Communication of intention to grant the patent | 21.10.2022 | Fee for grant paid | 21.10.2022 | Fee for publishing/printing paid | 21.10.2022 | Receipt of the translation of the claim(s) | Opposition(s) | 31.08.2023 | No opposition filed within time limit [2023/45] | Fees paid | Renewal fee | 30.09.2022 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AL | 30.11.2022 | CZ | 30.11.2022 | DK | 30.11.2022 | EE | 30.11.2022 | ES | 30.11.2022 | FI | 30.11.2022 | HR | 30.11.2022 | LT | 30.11.2022 | LV | 30.11.2022 | MC | 30.11.2022 | NL | 30.11.2022 | PL | 30.11.2022 | RO | 30.11.2022 | RS | 30.11.2022 | SE | 30.11.2022 | SI | 30.11.2022 | SK | 30.11.2022 | SM | 30.11.2022 | NO | 28.02.2023 | GR | 01.03.2023 | IS | 30.03.2023 | PT | 31.03.2023 | [2024/28] |
Former [2023/51] | AL | 30.11.2022 | |
CZ | 30.11.2022 | ||
DK | 30.11.2022 | ||
EE | 30.11.2022 | ||
ES | 30.11.2022 | ||
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RO | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SI | 30.11.2022 | ||
SK | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/38] | AL | 30.11.2022 | |
CZ | 30.11.2022 | ||
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FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RO | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SK | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/37] | AL | 30.11.2022 | |
CZ | 30.11.2022 | ||
DK | 30.11.2022 | ||
EE | 30.11.2022 | ||
ES | 30.11.2022 | ||
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RO | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/35] | CZ | 30.11.2022 | |
DK | 30.11.2022 | ||
EE | 30.11.2022 | ||
ES | 30.11.2022 | ||
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RO | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
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LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/33] | DK | 30.11.2022 | |
ES | 30.11.2022 | ||
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
SM | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/29] | ES | 30.11.2022 | |
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
NL | 30.11.2022 | ||
PL | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/25] | ES | 30.11.2022 | |
FI | 30.11.2022 | ||
HR | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
PL | 30.11.2022 | ||
RS | 30.11.2022 | ||
SE | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
IS | 30.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/23] | ES | 30.11.2022 | |
FI | 30.11.2022 | ||
LT | 30.11.2022 | ||
LV | 30.11.2022 | ||
SE | 30.11.2022 | ||
NO | 28.02.2023 | ||
GR | 01.03.2023 | ||
PT | 31.03.2023 | ||
Former [2023/22] | ES | 30.11.2022 | |
FI | 30.11.2022 | ||
LT | 30.11.2022 | ||
SE | 30.11.2022 | ||
NO | 28.02.2023 | ||
PT | 31.03.2023 | ||
Former [2023/20] | LT | 30.11.2022 | |
NO | 28.02.2023 | Documents cited: | Search | [A]JP2000200865 (SHIBAFU ENGINEERING KK, et al) [A] 1-14 * figures 1,6,11-15 *; | [A]EP1217659 (SEMIKRON ELEKTRONIK GMBH [DE]) [A] 1-14 * figure - * * paragraphs [0006] , [0018] , [0019] , [0039] , [0040] *; | [A]US2016020161 (SUZUKI KENJI [JP]) [A] 1-14 * figures 1-3,7-10 * * paragraph [0032] - paragraph [0047] ** paragraph [0060] - paragraph [0086] *; | [A]DE102015213495 (MITSUBISHI ELECTRIC CORP [JP]) [A] 1-14 * figure - * * paragraph [0041] - paragraph [0076] *; | [A]EP3340291 (INFINEON TECHNOLOGIES AG [DE]) [A] 1-14 * figure - * * paragraph [0010] - paragraph [0054] * | by applicant | DE10063714 |