-
EP4012750
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4012750
| EP4012750 - SUBSTRATE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 13.05.2022 Database last updated on 15.07.2024 | |
| Former | The international publication has been made Status updated on 12.02.2021 | Most recent event Tooltip | 05.04.2024 | Amendment by applicant | Applicant(s) | For all designated states Shin-Etsu Handotai Co., Ltd. 2-1, Ohtemachi 2-chome Chiyoda-ku Tokyo 100-0004 / JP | [2022/24] | Inventor(s) | 01 /
HAGIMOTO, Kazunori c/o Isobe R&D Center, Shin-Etsu Handotai Co., Ltd. 13-1, Isobe 2-chome Annaka-shi, Gunma 379-0196 / JP | 02 /
GOTO, Shouzaburo c/o Head Office, Shin-Etsu Handotai Co., Ltd., 2-1, Ohtemachi 2-chome, Chiyoda-ku Tokyo 100-0004 / JP | [2022/24] | Representative(s) | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstraße 2 81541 München / DE | [N/P] |
| Former [2022/24] | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte PartG mbB Schweigerstraße 2 81541 München / DE | Application number, filing date | 20849816.2 | 02.07.2020 | [2022/24] | WO2020JP25934 | Priority number, date | JP20190144251 | 06.08.2019 Original published format: JP 2019144251 | [2022/24] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021024654 | Date: | 11.02.2021 | Language: | JA | [2021/06] | Type: | A1 Application with search report | No.: | EP4012750 | Date: | 15.06.2022 | Language: | EN | [2022/24] | Search report(s) | International search report - published on: | JP | 11.02.2021 | (Supplementary) European search report - dispatched on: | EP | 14.09.2023 | Classification | IPC: | H01L21/20, H01L27/12, H01L21/02 | [2023/42] | CPC: |
H01L21/02002 (EP,US);
H01L21/02 (CN);
H01L21/185 (EP,US);
C30B29/06 (EP,CN,US);
C30B33/06 (EP);
H01L21/02381 (US);
H01L21/02389 (US);
H01L21/76254 (EP,US);
H01L23/562 (US);
H01L27/12 (CN)
(-)
|
| Former IPC [2022/24] | H01L21/02, H01L21/20, H01L27/12, C30B29/06 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/24] | Title | German: | SUBSTRAT FÜR ELEKTRONISCHE VORRICHTUNG UND HERSTELLUNGSVERFAHREN DAFÜR | [2022/24] | English: | SUBSTRATE FOR ELECTRONIC DEVICE AND PRODUCTION METHOD THEREFOR | [2022/24] | French: | SUBSTRAT POUR DISPOSITIF ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION | [2022/24] | Entry into regional phase | 21.01.2022 | Translation filed | 21.01.2022 | National basic fee paid | 21.01.2022 | Search fee paid | 21.01.2022 | Designation fee(s) paid | 21.01.2022 | Examination fee paid | Examination procedure | 21.01.2022 | Examination requested [2022/24] | 04.04.2024 | Amendment by applicant (claims and/or description) | 04.04.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 31.03.2022 | Renewal fee patent year 03 | 27.07.2023 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [IY]US2011284869 (BRIERE MICHAEL A [US]) [I] 1,6 * paragraphs [0018] - [0020]; figure 1 * [Y] 2,5,7,10; | [Y]US2012153440 (IKUTA TETSUYA [JP], et al) [Y] 5,10 * figure - *; | [Y]US2015084163 (SHIKAUCHI HIROSHI [JP], et al) [Y] 2,7 * paragraphs [0026] - [0034]; figures 1, 2 *; | [Y]JP2018041851 (COORSTEK KK) [Y] 2,7 * paragraphs [0018] , [0 19]; figure - *; | [E]EP3998376 (SHINETSU HANDOTAI KK [JP]) [E] 1-10* the whole document * | International search | [Y]JPH0590117 (TOSHIBA CORP) [Y] 1-10 * 2, [0012] *; | [Y]JPH09246505 (HITACHI LTD) [Y] 1-10 * [0031] *; | [Y]WO2011016219 (DOWA ELECTRONICS MATERIALS CO [JP], et al) [Y] 1-10 * [0002]-[0004], [0019]-[0026] *; | [Y]JP2011103380 (COVALENT MATERIALS CORP) [Y] 1-10 * :[0015]-[0019], [0026]-[0031] *; | [Y]JP2014236093 (SANKEN ELECTRIC CO LTD, et al) [Y] 3-4, 8-9* [0010], [0014], [0044] * | by applicant | WO2011016219 | JP2014192226 |