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Extract from the Register of European Patents

EP About this file: EP4029055

EP4029055 - SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  17.06.2022
Database last updated on 03.09.2024
FormerThe international publication has been made
Status updated on  17.04.2021
Most recent event   Tooltip27.08.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Wolfspeed, Inc.
4600 Silicon Drive
Durham, NC 27703 / US
[2022/29]
Inventor(s)01 / JOO, Sung Chul
611 Stafford Brook Lane
Cary, North Carolina 27519 / US
02 / POWELL, Jack
8544 Wolverton Fields Drive
Wake Forest, North Carolina 27587 / US
03 / FARRELL, Donald
2311 Carriage Oaks Drive
Raleigh, North Carolina 27614 / US
04 / MILLON, Bradley
5002 Lindon Oaks Avenue
Durham, North Carolina 27713 / US
 [2022/29]
Representative(s)Isarpatent
Patent- und Rechtsanwälte Barth
Charles Hassa Peckmann & Partner mbB
Friedrichstrasse 31
80801 München / DE
[2022/29]
Application number, filing date20875483.819.08.2020
[2022/29]
WO2020US46981
Priority number, dateUS20191659722409.10.2019         Original published format: US201916597224
[2022/29]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2021071591
Date:15.04.2021
Language:EN
[2021/15]
Type: A1 Application with search report 
No.:EP4029055
Date:20.07.2022
Language:EN
The application published by WIPO in one of the EPO official languages on 15.04.2021 takes the place of the publication of the European patent application.
[2022/29]
Search report(s)International search report - published on:US15.04.2021
(Supplementary) European search report - dispatched on:EP06.10.2023
ClassificationIPC:H01L27/00, H01L33/62, H01L23/482, H01L23/528, H01L29/872, H01L23/00
[2023/45]
CPC:
H01P1/047 (EP); H01L23/4821 (KR); H01L24/37 (EP,US);
H01L21/4885 (KR); H01L23/4824 (KR); H01L23/488 (KR);
H01L23/562 (EP,KR,US); H01L23/66 (EP,KR,US); H01L24/03 (KR);
H01L24/07 (KR); H01L24/35 (US); H01L24/40 (EP,US);
H01L24/84 (EP,US); H01P11/003 (EP,US); H01P3/003 (US);
H01P5/02 (EP); H05K1/115 (KR); H01L2223/6627 (EP,US);
H01L2224/37012 (EP,US); H01L2224/37147 (EP); H01L2224/37155 (EP);
H01L2224/3716 (EP); H01L2224/40091 (EP); H01L2224/40105 (EP);
H01L2224/40111 (EP); H01L2224/40157 (EP,US); H01L2224/40159 (EP);
H01L2224/40227 (EP); H01L2224/40229 (EP); H01L2224/84801 (EP);
H01L2924/10272 (EP); H01L2924/1033 (EP); H01L2924/12032 (EP);
H01L2924/13064 (EP); H01L2924/13091 (EP); H01L2924/1421 (EP);
H01L2924/19033 (US); H01L2924/3025 (EP); H01L2924/3512 (EP);
H01L2924/35121 (EP,US) (-)
C-Set:
H01L2224/37147, H01L2924/00014 (EP);
H01L2224/37155, H01L2924/01027 (EP);
H01L2224/3716, H01L2924/01027 (EP);
H01L2224/3716, H01L2924/01028 (EP)
Former IPC [2022/29]H01L27/00, H01L33/62, H01L23/482, H01L23/528, H01L29/872
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2022/29]
TitleGerman:SYSTEME UND VERFAHREN ZUM ERHÖHEN DER ZUVERLÄSSIGKEIT VON HALBLEITERBAUELEMENTEN[2022/29]
English:SYSTEMS AND PROCESSES FOR INCREASING SEMICONDUCTOR DEVICE RELIABILITY[2022/29]
French:SYSTÈMES ET PROCÉDÉS POUR ACCROÎTRE LA FIABILITÉ D'UN DISPOSITIF À SEMI-CONDUCTEUR[2022/29]
Entry into regional phase13.04.2022National basic fee paid 
13.04.2022Search fee paid 
13.04.2022Designation fee(s) paid 
13.04.2022Examination fee paid 
Examination procedure13.04.2022Examination requested  [2022/29]
25.04.2024Amendment by applicant (claims and/or description)
25.04.2024Date on which the examining division has become responsible
Fees paidRenewal fee
29.08.2022Renewal fee patent year 03
28.08.2023Renewal fee patent year 04
27.08.2024Renewal fee patent year 05
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Documents cited:Search[XYI]US2014264611  (LEE KISUN [KR], et al) [X] 1-6,8-10,13-15 * paragraphs [0001] - [0046]; figures 14-17 * [Y] 11,12 [I] 7;
 [XYI]US2018047697  (LUEDEKE HEINRICH [DE], et al) [X] 1-6,8,13-15 * the whole document * [Y] 11,12 [I] 7,9,10;
 [Y]  - Tapan Pattnayak ET AL, "Antenna Design and RF Layout Guidelines", (20180124), URL: https://web.archive.org/web/20180124131035if_/http://www.cypress.com:80/file/136236/download, (20190124), XP055547079 [Y] 11,12 * pages 1-46; figures 48-52 *
International search[XY]US2010090330  (NAKAZATO ISAO [JP]) [X] 1,2,4,6,8,13,14,16, 18,20 * , entire document, especially fig 1, 2, 3B, para [0017], [0022], [0036], [0038], [0040], [0041]-[0045], [0060]-[0061], [0069]. * [Y] 3, 5, 7, 9-12, 15, 17, 19, 21-24;
 [Y]US2014070235  (ANDREWS PETER SCOTT [US], et al) [Y] 7, 19 * , entire document, especially fig 9B, para [0007], [0053], [0056]-[0057]. *;
 [Y]US2015001691  (HIGGINS III LEO M [US]) [Y] 3, 5, 15, 17 * , entire document, especially fig 2, para [0017], [0020]. *;
 [Y]US2017125881  (MANGRUM MARC ALAN [US], et al) [Y] 9-12,21-24* , entire document, especially fig 15, 17, 30, 31 para [0009], [0062], [0075], [0097]-[0098], [0100]-[0101], [0130], [0132]-[0133], [0159]. *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.