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EP4056620
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EP About this file: EP4056620
| EP4056620 - EPOXY-MODIFIED SILICONE FINE PARTICLES AND METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION CONTAINING SAID FINE PARTICLES, AND SEALING MATERIAL [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 12.08.2022 Database last updated on 24.07.2024 | |
| Former | The international publication has been made Status updated on 14.05.2021 | Most recent event Tooltip | 10.04.2024 | Amendment by applicant | Applicant(s) | For all designated states Shin-Etsu Chemical Co., Ltd. 4-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100-0005 / JP | For all designated states Nissin Chemical Industry Co., Ltd. 17-33 Kitago 2-chome Echizen-shi Fukui 915-0802 / JP | [2022/37] | Inventor(s) | 01 /
INOKUCHI Yoshinori c/o Silicone-Electronics Materials Research Center of Shin-Etsu Chemical Co., Ltd., 1-10 Hitomi, Matsuida-machi Annaka-shi, Gunma 379-0224 / JP | 02 /
SAKAI Mio c/o Nissin Chemical Industry Co., Ltd., 17-33, Kitago 2-choume Echizen-shi, Fukui 915-0802 / JP | [2022/37] | Representative(s) | V.O. P.O. Box 87930 2508 DH Den Haag / NL | [2022/37] | Application number, filing date | 20885132.9 | 29.10.2020 | [2022/37] | WO2020JP40578 | Priority number, date | JP20190202357 | 07.11.2019 Original published format: JP 2019202357 | [2022/37] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021090752 | Date: | 14.05.2021 | Language: | JA | [2021/19] | Type: | A1 Application with search report | No.: | EP4056620 | Date: | 14.09.2022 | Language: | EN | [2022/37] | Search report(s) | International search report - published on: | JP | 14.05.2021 | (Supplementary) European search report - dispatched on: | EP | 30.10.2023 | Classification | IPC: | C08J3/12, C09D183/06, C08L63/00, H01L23/29 | [2023/48] | CPC: |
H01L23/295 (EP);
C08J3/126 (EP,CN,US);
C08G77/38 (US);
C08G77/14 (EP,CN);
C08L63/00 (CN);
C09D183/06 (EP);
H01L23/296 (CN);
C08J2363/00 (EP);
C08J2383/04 (EP,CN,US);
C08J2483/06 (EP,CN)
(-)
| C-Set: |
C08L63/00, C08L83/04, C08L83/06 (CN)
|
| Former IPC [2022/37] | C08G59/20, C08L63/00 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/37] | Title | German: | EPOXYMODIFIZIERTE SILIKONFEINTEILCHEN UND VERFAHREN ZUM PRODUZIEREN DERSELBEN, WÄRMEHÄRTBARE HARZZUSAMMENSETZUNG, DIE DIESE FEINTEILCHEN ENTHÄLT, UND DICHTUNGSMATERIAL | [2022/37] | English: | EPOXY-MODIFIED SILICONE FINE PARTICLES AND METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION CONTAINING SAID FINE PARTICLES, AND SEALING MATERIAL | [2022/37] | French: | FINES PARTICULES DE SILICONE MODIFIÉE PAR ÉPOXY ET LEUR PROCÉDÉ DE PRODUCTION, COMPOSITION DE RÉSINE THERMODURCISSABLE CONTENANT LESDITES FINES PARTICULES ET MATÉRIAU D'ÉTANCHÉITÉ | [2022/37] | Entry into regional phase | 04.05.2022 | Translation filed | 04.05.2022 | National basic fee paid | 04.05.2022 | Search fee paid | 04.05.2022 | Designation fee(s) paid | 04.05.2022 | Examination fee paid | Examination procedure | 04.05.2022 | Examination requested [2022/37] | 08.04.2024 | Amendment by applicant (claims and/or description) | 08.04.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 04.05.2022 | Renewal fee patent year 03 | 13.09.2023 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XAI]JPH0920631 (SHINETSU CHEMICAL CO) [X] 1-5,8-11 * production example 2 * [A] 12-14[I] 6,7 | International search | [XY]JPH0885753 (SHINETSU CHEMICAL CO) [X] 1-5, 8-14 * paragraphs [0026], [0033]-[0037], [0042], [0043], [0050], table 2, example 2 * [Y] 6, 7; | [Y]JP2009280767 (ASAHI KASEI CORP) [Y] 6, 7* paragraph [0030] *; | [Y]JP2014015522 (ARAKAWA CHEM IND) [Y] 6, 7 * paragraph [0024] *; | [Y]JP2017110092 (TORAY FINECHEMICALS CO LTD, et al) [Y] 6, 7 * paragraph [0020] * | by applicant | JPH0885753 | JP2007023061 | JP2007146148 | JP2018172545 |