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EP4030476
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EP About this file: EP4030476
| EP4030476 - AN INTEGRATED COOLING LIQUID CAVITY IN A PRINTED CIRCUIT BOARD AND A METHOD TO MAKE THE SAME [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 20.01.2023 Database last updated on 16.07.2024 | |
| Former | The application has been published Status updated on 17.06.2022 | Most recent event Tooltip | 26.01.2024 | New entry: Renewal fee paid | Applicant(s) | For:FR
Mitsubishi Electric R & D Centre Europe B.V. Capronilaan 46 1119 NS Schiphol Rijk / NL | For:AL
AT
BE
BG
CH
CY
CZ
DE
DK
EE
ES
FI
GB
GR
HR
HU
IE
IS
IT
LI
LT
LU
LV
MC
MK
MT
NL
NO
PL
PT
RO
RS
SE
SI
SK
SM
TR
Mitsubishi Electric Corporation 7-3, Marunouchi 2-chome Chiyoda-ku Tokyo 100-8310 / JP | [2022/29] | Inventor(s) | 01 /
MORAND, Julien 35708 RENNES Cedex / FR | 02 /
MOLLOV, Stefan 35708 RENNES Cedex 7 / FR | [2022/29] | Representative(s) | Cabinet Le Guen Maillet 3, impasse de la Vigie CS 71840 35418 Saint-Malo Cedex / FR | [2022/29] | Application number, filing date | 21305046.1 | 15.01.2021 | [2022/29] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4030476 | Date: | 20.07.2022 | Language: | EN | [2022/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.07.2021 | Classification | IPC: | H01L23/473, H05K3/46, H01L23/538 | [2022/29] | CPC: |
H01L23/5389 (EP);
H01L21/4857 (US);
H01L21/56 (US);
H01L23/3121 (US);
H01L23/473 (EP,US);
H01L23/49827 (EP);
H01L23/5385 (EP);
H01L25/072 (US);
H05K1/0272 (EP);
H05K3/4697 (EP)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/08] |
| Former [2022/29] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | INTEGRIERTER KÜHLFLÜSSIGKEITSHOHLRAUM IN EINER LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG DAVON | [2022/29] | English: | AN INTEGRATED COOLING LIQUID CAVITY IN A PRINTED CIRCUIT BOARD AND A METHOD TO MAKE THE SAME | [2022/29] | French: | CAVITÉ DE LIQUIDE DE REFROIDISSEMENT INTÉGRÉE DANS UNE CARTE DE CIRCUIT IMPRIMÉ ET SON PROCÉDÉ DE FABRICATION | [2022/29] | Examination procedure | 13.01.2023 | Amendment by applicant (claims and/or description) | 13.01.2023 | Examination requested [2023/08] | 13.01.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 25.01.2023 | Renewal fee patent year 03 | 25.01.2024 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2001001897 (ZHAO JI CHENG [US], et al); | [Y]US2005112798 (BJORBELL STEN [IE]); | [Y]US2007254411 (UHLAND SCOTT A [US], et al); | [Y]US2016172278 (COLLIN LOUIS-MICHEL [CA], et al); | [Y]US2018226310 (EID FERAS [US], et al); | [Y]US2020098669 (ELSHERBINI ADEL [US], et al) |