-
EP4131345
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP4131345
| EP4131345 - CERAMIC CIRCUIT BOARD WITH RESIST CURED FILM, MANUFACTURING METHOD THEREFOR, AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 19.09.2024 Database last updated on 19.10.2024 | |
| Former | Grant of patent is intended Status updated on 23.06.2024 | ||
| Former | Request for examination was made Status updated on 06.01.2023 | ||
| Former | The international publication has been made Status updated on 09.10.2021 | Most recent event Tooltip | 19.09.2024 | (Expected) grant | published on 23.10.2024 [2024/43] | Applicant(s) | For all designated states Denka Company Limited 1-1 Nihonbashi-Muromachi 2-chome Chuo-ku Tokyo 103-8338 / JP | [2023/06] | Inventor(s) | 01 /
YUASA, Akimasa c/o Denka Company Limited 1-1 Nihonbashi- Muromachi 2-chome Chuo-ku Tokyo 103-8338 / JP | 02 /
NAKAMURA, Takahiro c/o Denka Company Limited 1-1 Nihonbashi- Muromachi 2-chome Chuo-ku Tokyo 103-8338 / JP | 03 /
NISHIMURA, Koji c/o Denka Company Limited 1-1 Nihonbashi- Muromachi 2-chome Chuo-ku Tokyo 103-8338 / JP | [2024/43] |
| Former [2023/06] | 01 /
YUASA, Akimasa c/o Denka Company Limited, 1-1, Nihonbashi- Muromachi 2-chome, Chuo-ku Tokyo 103-8338 / JP | ||
| 02 /
NAKAMURA, Takahiro c/o Denka Company Limited, 1-1, Nihonbashi- Muromachi 2-chome, Chuo-ku Tokyo 103-8338 / JP | |||
| 03 /
NISHIMURA, Koji c/o Denka Company Limited, 1-1, Nihonbashi- Muromachi 2-chome, Chuo-ku Tokyo 103-8338 / JP | Representative(s) | Zacco Sweden AB P.O. Box 5581 Löjtnantsgatan 21 114 85 Stockholm / SE | [2023/06] | Application number, filing date | 21780361.8 | 29.03.2021 | [2023/06] | WO2021JP13261 | Priority number, date | JP20200060208 | 30.03.2020 Original published format: JP 2020060208 | [2023/06] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021200810 | Date: | 07.10.2021 | Language: | JA | [2021/40] | Type: | A1 Application with search report | No.: | EP4131345 | Date: | 08.02.2023 | Language: | EN | [2023/06] | Type: | B1 Patent specification | No.: | EP4131345 | Date: | 23.10.2024 | Language: | EN | [2024/43] | Search report(s) | International search report - published on: | JP | 07.10.2021 | (Supplementary) European search report - dispatched on: | EP | 10.08.2023 | Classification | IPC: | H01L21/308, H05K3/06, H01L21/48 | [2023/37] | CPC: |
C04B37/026 (EP);
H05K3/061 (EP,KR);
H01L21/4867 (EP);
H05K1/0306 (EP,KR);
H05K3/125 (KR);
C04B2235/3886 (EP);
C04B2237/122 (EP);
C04B2237/125 (EP);
C04B2237/366 (EP);
C04B2237/407 (EP);
C04B2237/60 (EP);
H01L23/15 (EP);
H05K2203/013 (EP)
(-)
|
| Former IPC [2023/06] | H01L21/308, H05K3/06 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/06] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | KERAMISCHE LEITERPLATTE MIT GEHÄRTETEM RESISTFILM, HERSTELLUNGSVERFAHREN DAFÜR UND HERSTELLUNGSVERFAHREN FÜR KERAMISCHE LEITERPLATTE | [2023/06] | English: | CERAMIC CIRCUIT BOARD WITH RESIST CURED FILM, MANUFACTURING METHOD THEREFOR, AND CERAMIC CIRCUIT BOARD MANUFACTURING METHOD | [2023/06] | French: | CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE À FILM DURCI DE RÉSERVE, SON PROCÉDÉ DE FABRICATION ET PROCÉDÉ DE FABRICATION DE CARTE DE CIRCUIT IMPRIMÉ EN CÉRAMIQUE | [2023/06] | Entry into regional phase | 27.09.2022 | Translation filed | 27.09.2022 | National basic fee paid | 27.09.2022 | Search fee paid | 27.09.2022 | Designation fee(s) paid | 27.09.2022 | Examination fee paid | Examination procedure | 27.09.2022 | Examination requested [2023/06] | 22.02.2024 | Amendment by applicant (claims and/or description) | 22.02.2024 | Date on which the examining division has become responsible | 24.06.2024 | Communication of intention to grant the patent | 13.09.2024 | Fee for grant paid | 13.09.2024 | Fee for publishing/printing paid | 13.09.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 23.03.2023 | Renewal fee patent year 03 | 21.02.2024 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JPH098436 (CANON KK); | [Y]US2008158278 (INOUE SEIICHI [JP]); | [Y]EP2916627 (HITACHI METALS LTD [JP]) | International search | [A]JPH05163077 (DENKI KAGAKU KOGYO KK) [A] 1-6* paragraphs [0008]-[0020], [0029]-[0034] *; | [Y]JPH06228774 (OLYMPUS OPTICAL CO) [Y] 1-6 * paragraphs [0035]-[0060], fig. 1-4 *; | [A]JPH1129371 (TOKUYAMA CORP) [A] 1-6 * paragraphs [0038]-[0040], fig. 1-3 *; | [A]WO2011034075 (TOSHIBA KK [JP], et al) [A] 1-6 * paragraphs [0013]-[0033], fig. 1-6 *; | [YA]JP2013084822 (HITACHI METALS LTD) [Y] 3, 5-6 * paragraphs [0019]-[0022], fig. 1-2 * [A] 1-2, 4; | [Y]WO2015029478 (HITACHI METALS LTD [JP]) [Y] 1-6 * paragraphs [0029]-[0056], [0070]-[0079], fig. 1-5 * | by applicant | JPH1070212 | JP2020060208 |