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EP4166620
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EP About this file: EP4166620
| EP4166620 - TEMPORARY BONDING METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE FOR TEMPORARY BONDING, AND LAMINATE FOR DEVICE WAFER PROCESSING [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 17.03.2023 Database last updated on 03.09.2024 | |
| Former | The international publication has been made Status updated on 17.12.2021 | Most recent event Tooltip | 15.05.2024 | Supplementary search report | published on 12.06.2024 [2024/24] | Applicant(s) | For all designated states SHIN-ETSU CHEMICAL CO., LTD. 4-1, Marunouchi 1 chome Chiyoda-ku Tokyo 1000005 / JP | [2023/16] | Inventor(s) | 01 /
OOWADA, Tamotsu Annaka-shi, Gunma 379-0224 / JP | 02 /
TAGAMI, Shohei Annaka-shi, Gunma 379-0224 / JP | 03 /
MUTO, Mitsuo Annaka-shi, Gunma 379-0224 / JP | 04 /
TANABE, Masahito Annaka-shi, Gunma 379-0224 / JP | [2023/16] | Representative(s) | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte und Rechtsanwalt PartG mbB Schweigerstraße 2 81541 München / DE | [N/P] |
| Former [2023/16] | Sonnenhauser, Thomas Martin Wuesthoff & Wuesthoff Patentanwälte PartG mbB Schweigerstraße 2 81541 München / DE | Application number, filing date | 21823042.3 | 26.04.2021 | [2023/16] | WO2021JP16677 | Priority number, date | JP20200102386 | 12.06.2020 Original published format: JP 2020102386 | [2023/16] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2021251018 | Date: | 16.12.2021 | Language: | JA | [2021/50] | Type: | A1 Application with search report | No.: | EP4166620 | Date: | 19.04.2023 | Language: | EN | [2023/16] | Search report(s) | International search report - published on: | JP | 16.12.2021 | (Supplementary) European search report - dispatched on: | EP | 14.05.2024 | Classification | IPC: | C09J179/08, C09J183/04, C09J201/00, H01L21/683, C09J183/10, // C08G77/455 | [2024/24] | CPC: |
C09J179/08 (EP,KR,US);
H01L21/304 (KR);
H01L21/6836 (EP,KR,US);
C09J183/04 (KR,US);
C09J183/10 (EP);
C08G77/455 (EP);
C09J2203/326 (KR,US);
H01L2221/68318 (KR,US);
H01L2221/68327 (EP,KR,US);
|
| Former IPC [2023/16] | C09J179/08, C09J183/04, C09J201/00, H01L21/02 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/16] | Title | German: | TEMPORÄRES BINDUNGSVERFAHREN, VORRICHTUNGSWAFERVERARBEITUNGSVERFAHREN, LAMINAT FÜR TEMPORÄRES BONDEN UND LAMINAT FÜR VORRICHTUNGSWAFERVERARBEITUNG | [2023/16] | English: | TEMPORARY BONDING METHOD, DEVICE WAFER PROCESSING METHOD, LAMINATE FOR TEMPORARY BONDING, AND LAMINATE FOR DEVICE WAFER PROCESSING | [2023/16] | French: | PROCÉDÉ DE COLLAGE PROVISOIRE, PROCÉDÉ DE TRAITEMENT D'UNE TRANCHE DE DISPOSITIF, STRATIFIÉ POUR COLLAGE PROVISOIRE, ET STRATIFIÉ POUR TRAITEMENT D'UNE TRANCHE DE DISPOSITIF | [2023/16] | Entry into regional phase | 07.12.2022 | Translation filed | 07.12.2022 | National basic fee paid | 07.12.2022 | Search fee paid | 07.12.2022 | Designation fee(s) paid | 07.12.2022 | Examination fee paid | Examination procedure | 07.12.2022 | Examination requested [2023/16] | Fees paid | Renewal fee | 07.12.2022 | Renewal fee patent year 03 | 13.03.2024 | Renewal fee patent year 04 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XYI]US2011039095 (MAENO YOUHEI [JP], et al); | [XYI]US2018320264 (LAU SIMON [DE]); | [A]US2019040283 (STRAUMANN RETO [CH]); | International search | [XY]WO2009128342 (NITTO DENKO CORP [JP], et al); | [XY]JP2019504497 ; | [A]US2019088524 (LEE KUNSIL [KR], et al); | [Y]JP3220830U | by applicant | JP2004064040 | JP2006328104 | US7541264 | US2015368519 | US9566722 |