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EP4246559
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EP About this file: EP4246559
| EP4246559 - MANUFACTURING METHOD FOR COMPLEX AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 18.08.2023 Database last updated on 24.08.2024 | |
| Former | The international publication has been made Status updated on 21.05.2022 | Most recent event Tooltip | 11.04.2024 | Supplementary search report | published on 08.05.2024 [2024/19] | Applicant(s) | For all designated states Panasonic Intellectual Property Management Co., Ltd. 1-61, Shiromi 2-chome Chuo-ku Osaka-shi, Osaka 540-6207 / JP | [2023/38] | Inventor(s) | 01 /
KONDA, Tetsushi Osaka-shi, Osaka 540-6207 / JP | 02 /
KITAMURA, Kenji Osaka-shi, Osaka 540-6207 / JP | 03 /
HAGIWARA, Takahito Osaka-shi, Osaka 540-6207 / JP | 04 /
MATSUBAYASHI, Ryo Osaka-shi, Osaka 540-6207 / JP | 05 /
UMEDA, Hidekazu Osaka-shi, Osaka 540-6207 / JP | [2023/38] | Representative(s) | Appelt, Christian W. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2023/38] | Application number, filing date | 21891906.6 | 10.11.2021 | [2023/38] | WO2021JP41354 | Priority number, date | US202063112835P | 12.11.2020 Original published format: US 202063112835 P | [2023/38] | Filing language | JA | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022102660 | Date: | 19.05.2022 | Language: | JA | [2022/20] | Type: | A1 Application with search report | No.: | EP4246559 | Date: | 20.09.2023 | Language: | EN | [2023/38] | Search report(s) | International search report - published on: | JP | 19.05.2022 | (Supplementary) European search report - dispatched on: | EP | 10.04.2024 | Classification | IPC: | H01L21/52 | [2023/38] | CPC: |
H01L24/83 (EP,US);
H01L21/52 (KR);
H01L21/67098 (KR);
H01L24/02 (KR);
H01L24/32 (EP,US);
H01L2224/32225 (US);
H01L2224/48225 (US);
H01L2224/73265 (US);
H01L2224/83205 (EP);
H01L2224/8384 (EP,US);
H01L23/3121 (EP,US);
H01L24/48 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/38] | Title | German: | HERSTELLUNGSVERFAHREN FÜR EINEN KOMPLEX UND HERSTELLUNGSVERFAHREN FÜR EIN HALBLEITERBAUELEMENT | [2023/38] | English: | MANUFACTURING METHOD FOR COMPLEX AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | [2023/38] | French: | PROCÉDÉ DE FABRICATION D'UN COMPLEXE ET PROCÉDÉ DE FABRICATION D'UN DISPOSITIF SEMI-CONDUCTEUR | [2023/38] | Entry into regional phase | 24.04.2023 | Translation filed | 24.04.2023 | National basic fee paid | 24.04.2023 | Search fee paid | 24.04.2023 | Designation fee(s) paid | 24.04.2023 | Examination fee paid | Examination procedure | 24.04.2023 | Examination requested [2023/38] | Fees paid | Renewal fee | 24.11.2023 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]CN104201117 (UNIV TIANJIN); | [XYI]WO2019021637 (BANDO CHEMICAL IND [JP]) | International search | [AY]JP2008109009 (SONY CORP) [A] 6-8, 12 [Y] 1-5, 9-11, 13-14; | [AY]JP2010283021 (FUJIKURA LTD) [A] 6-8, 12 [Y] 1-5, 9-11, 13-14; | [AY]WO2019021637 (BANDO CHEMICAL IND [JP]) [A] 6-8, 12 [Y] 1-5, 9-11, 13-14; | [A]JP2019220641 (MITSUBISHI MATERIALS CORP) [A] 1-14* paragraphs [0001], [0024]-[0052], fig. 1-2 *; | [A]JP2020038896 (FURUKAWA ELECTRIC CO LTD) [A] 1-14 * paragraphs [0001], [0012]-[0060], fig. 1 * | by applicant | JP2012009703 |