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Extract from the Register of European Patents

EP About this file: EP4201632

EP4201632 - ELECTRONIC COMPONENT-EQUIPPED RESIN CASING AND METHOD FOR PRODUCING SAME [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  26.05.2023
Database last updated on 26.06.2024
FormerThe international publication has been made
Status updated on  17.06.2022
Most recent event   Tooltip23.02.2024Supplementary search reportpublished on 27.03.2024  [2024/13]
23.02.2024Change - classificationpublished on 27.03.2024  [2024/13]
Applicant(s)For all designated states
Nissha Co., Ltd.
3, Mibu Hanai-cho
Nakagyo-ku
Kyoto-shi, Kyoto 604-8551 / JP
[2023/26]
Inventor(s)01 / TANIGUCHI, Chuzo
Kyoto-shi, Kyoto 604-8551 / JP
02 / SASAKI, Jun
Kyoto-shi, Kyoto 604-8551 / JP
03 / KAWASHIMA, Eiji
Kyoto-shi, Kyoto 604-8551 / JP
04 / TAKINISHI, Yasuisa
Kyoto-shi, Kyoto 604-8551 / JP
 [2023/26]
Representative(s)Winter, Brandl - Partnerschaft mbB
Alois-Steinecker-Straße 22
85354 Freising / DE
[2023/26]
Application number, filing date21903085.509.11.2021
[2023/26]
WO2021JP41109
Priority number, dateJP2020020246707.12.2020         Original published format: JP 2020202467
[2023/26]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022123981
Date:16.06.2022
Language:JA
[2022/24]
Type: A1 Application with search report 
No.:EP4201632
Date:28.06.2023
Language:EN
[2023/26]
Search report(s)International search report - published on:JP16.06.2022
(Supplementary) European search report - dispatched on:EP22.02.2024
ClassificationIPC:B29C45/14, // B29L31/34
[2024/13]
CPC:
B29C45/14655 (EP); H04R1/025 (US); B29C45/14065 (EP);
H04R1/028 (US); B29C45/14639 (US); B29L2031/3418 (EP);
B29L2031/3425 (US); B29L2031/3481 (EP); H04R2201/02 (US);
H04R2499/11 (US); H04R2499/15 (US) (-)
Former IPC [2023/26]B29C45/14
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/26]
TitleGerman:HARZGEHÄUSE MIT ELEKTRONISCHER KOMPONENTE UND VERFAHREN ZUR HERSTELLUNG DAVON[2023/26]
English:ELECTRONIC COMPONENT-EQUIPPED RESIN CASING AND METHOD FOR PRODUCING SAME[2023/26]
French:BOÎTIER DE RÉSINE ÉQUIPÉ D'UN COMPOSANT ÉLECTRONIQUE ET SON PROCÉDÉ DE PRODUCTION[2023/26]
Entry into regional phase24.03.2023Translation filed 
24.03.2023National basic fee paid 
24.03.2023Search fee paid 
24.03.2023Designation fee(s) paid 
24.03.2023Examination fee paid 
Examination procedure24.03.2023Amendment by applicant (claims and/or description)
24.03.2023Examination requested  [2023/26]
Fees paidRenewal fee
06.11.2023Renewal fee patent year 03
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Documents cited:Search[XI]JP2000164803  (SANYO ELECTRIC CO) [X] 1,6-8 * Claim 1, 6; para. [0016, 0019, 0031-0034]; fig. 1, 2, 5, 5 * [I] 9;
 [XI]US2010208920  (LEE DUK WOO [KR], et al) [X] 1,5,6 * Claim 8, 13, 15; para. [0036, 0064, 0111]; fig. 1-3, 6, 7 *[I] 2-4,10-12
International search[AX]JP2000164803  (SANYO ELECTRIC CO) [A] 5-11 [X] 1-4;
 [AX]EP1158375  (ASULAB SA [CH]) [A] 5-11 [X] 1-4;
 [A]JP2006196865  (SHINKO ELECTRIC IND CO) [A] 1-11 * entire text, all drawings *;
 [AX]JP2012134272  (NEC CORP) [A] 5-11 [X] 1-4;
 [A]CN207764571U  (CHUMEN WENWEN INFORMATION TECH CO LTD) [A] 1-11* entire text, all drawings *;
 [A]JP2018524799  (TACTOTEK OY) [A] 1-11 * paragraphs [0028]-[0059], fig. 1-5 *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.