EP4060077 - SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PROGRAM [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 16.06.2023 Database last updated on 24.08.2024 | |
Former | The application has been published Status updated on 19.08.2022 | Most recent event Tooltip | 01.03.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Kokusai Electric Corp. 3-4, Kandakaji-cho Chiyoda-ku Tokyo 1010045 / JP | [2022/38] | Inventor(s) | 01 /
SATO, Taketoshi Toyama-shi, 939-2393 / JP | 02 /
ITATANI, Hideharu Toyama-shi, 939-2393 / JP | 03 /
SAMBU, Makoto Toyama-shi, 939-2393 / JP | [2022/38] | Representative(s) | Verscht, Thomas Kurt Albert Josephsburgstrasse 88 A 81673 München / DE | [2022/38] | Application number, filing date | 22156630.0 | 14.02.2022 | [2022/38] | Priority number, date | JP20210042385 | 16.03.2021 Original published format: JP 2021042385 | [2022/38] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4060077 | Date: | 21.09.2022 | Language: | EN | [2022/38] | Type: | A3 Search report | No.: | EP4060077 | Date: | 14.12.2022 | Language: | EN | [2022/50] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.11.2022 | Classification | IPC: | C23C16/455, C23C16/34 | [2022/50] | CPC: |
C23C16/45578 (EP,CN,US);
C23C16/45514 (CN);
C23C16/345 (EP,CN);
C23C16/45508 (US);
C23C16/45512 (EP);
C23C16/45561 (EP);
C23C16/45574 (CN);
C23C16/45591 (EP);
C23C16/4584 (CN);
C23C16/52 (CN);
H01L21/02104 (CN);
H01L21/02211 (US);
H01L21/0228 (US);
H01L21/67017 (EP);
H01L21/67098 (US);
|
Former IPC [2022/38] | C23C16/455 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/29] |
Former [2022/38] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | SUBSTRATVERARBEITUNGSVORRICHTUNG, VERFAHREN ZUM HERSTELLEN EINER HALBLEITERVORRICHTUNG UND PROGRAMM | [2022/38] | English: | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PROGRAM | [2022/38] | French: | APPAREIL DE TRAITEMENT DE SUBSTRAT, PROCÉDÉ DE FABRICATION DE DISPOSITIF SEMI-CONDUCTEUR ET PROGRAMME | [2022/38] | Examination procedure | 14.06.2023 | Amendment by applicant (claims and/or description) | 14.06.2023 | Examination requested [2023/29] | 14.06.2023 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 29.02.2024 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JPS5754328 (HITACHI LTD) [A] 1 * figure 4 *; | [A]JPH09102463 (SHARP KK) [A] 1 * figures 5(2), 5(3) * * paragraph [0018] - paragraph [0022] * * paragraph [0029] - paragraph [0034] *; | [XI]US2003111013 (OOSTERLAKEN THEODORUS GERARDUS [NL], et al) [X] 1,2,4-6,14 * figures 2-4, 6 * * paragraph [0062] * [I] 7,8; | [A]US2005121145 (DU BOIS DALE R [US], et al) [A] 1,3,9-15 * figures 20, 21, 25, 27 * * paragraph [0115] - paragraph [0122] *; | [A]US2010212593 (TAKEBAYASHI YUJI [JP], et al) [A] 10 * figure 3 * * paragraph [0072] *; | [A]JP2018085392 (TOKYO ELECTRON LTD) [A] 6-8 * figures 1, 2, 6, 7, 10 ** paragraph [0024] - paragraph [0025] *; | [XI]US2018264516 (FUJIKAWA MAKOTO [JP], et al) [X] 1,3,9,12-14 * figures 1, 3, 12 * * paragraph [0024] - paragraph [0036] * * paragraph [0058] * [I] 10,11,15; | [A]US2019309420 (OIKAWA MASAMI [JP], et al) [A] 6-8 * figures -41 * * paragraph [0045] - paragraph [0046] *; | [A]EP3599290 (LG ELECTRONICS INC [KR]) [A] 2,4-8 * figures 12a,b,c, 13a,b, 14 * * paragraph [0146] - paragraph [0152] * * paragraph [0166] - paragraph [0176] * * paragraph [0181] - paragraph [0186] * | by applicant | JPH06349761 | JP2014175494 |