blank Quick help
blank Maintenance news

Scheduled maintenance

Regular maintenance outages:
between 05.00 and 05.15 hrs CET (Monday to Sunday).

Other outages
Availability
Register Forum

2022.02.11

More...
blank News flashes

News Flashes

New version of the European Patent Register – SPC proceedings information in the Unitary Patent Register.

2024-07-24

More...
blank Related links

Extract from the Register of European Patents

EP About this file: EP4060077

EP4060077 - SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PROGRAM [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  16.06.2023
Database last updated on 24.08.2024
FormerThe application has been published
Status updated on  19.08.2022
Most recent event   Tooltip01.03.2024New entry: Renewal fee paid 
Applicant(s)For all designated states
Kokusai Electric Corp.
3-4, Kandakaji-cho
Chiyoda-ku
Tokyo 1010045 / JP
[2022/38]
Inventor(s)01 / SATO, Taketoshi
Toyama-shi, 939-2393 / JP
02 / ITATANI, Hideharu
Toyama-shi, 939-2393 / JP
03 / SAMBU, Makoto
Toyama-shi, 939-2393 / JP
 [2022/38]
Representative(s)Verscht, Thomas Kurt Albert
Josephsburgstrasse 88 A
81673 München / DE
[2022/38]
Application number, filing date22156630.014.02.2022
[2022/38]
Priority number, dateJP2021004238516.03.2021         Original published format: JP 2021042385
[2022/38]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP4060077
Date:21.09.2022
Language:EN
[2022/38]
Type: A3 Search report 
No.:EP4060077
Date:14.12.2022
Language:EN
[2022/50]
Search report(s)(Supplementary) European search report - dispatched on:EP11.11.2022
ClassificationIPC:C23C16/455, C23C16/34
[2022/50]
CPC:
C23C16/45578 (EP,CN,US); C23C16/45514 (CN); C23C16/345 (EP,CN);
C23C16/45508 (US); C23C16/45512 (EP); C23C16/45561 (EP);
C23C16/45574 (CN); C23C16/45591 (EP); C23C16/4584 (CN);
C23C16/52 (CN); H01L21/02104 (CN); H01L21/02211 (US);
H01L21/0228 (US); H01L21/67017 (EP); H01L21/67098 (US);
H01L21/67103 (EP); H01L21/67303 (US) (-)
Former IPC [2022/38]C23C16/455
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/29]
Former [2022/38]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:SUBSTRATVERARBEITUNGSVORRICHTUNG, VERFAHREN ZUM HERSTELLEN EINER HALBLEITERVORRICHTUNG UND PROGRAMM[2022/38]
English:SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PROGRAM[2022/38]
French:APPAREIL DE TRAITEMENT DE SUBSTRAT, PROCÉDÉ DE FABRICATION DE DISPOSITIF SEMI-CONDUCTEUR ET PROGRAMME[2022/38]
Examination procedure14.06.2023Amendment by applicant (claims and/or description)
14.06.2023Examination requested  [2023/29]
14.06.2023Date on which the examining division has become responsible
Fees paidRenewal fee
29.02.2024Renewal fee patent year 03
Opt-out from the exclusive  Tooltip
competence of the Unified
Patent Court
See the Register of the Unified Patent Court for opt-out data
Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[A]JPS5754328  (HITACHI LTD) [A] 1 * figure 4 *;
 [A]JPH09102463  (SHARP KK) [A] 1 * figures 5(2), 5(3) * * paragraph [0018] - paragraph [0022] * * paragraph [0029] - paragraph [0034] *;
 [XI]US2003111013  (OOSTERLAKEN THEODORUS GERARDUS [NL], et al) [X] 1,2,4-6,14 * figures 2-4, 6 * * paragraph [0062] * [I] 7,8;
 [A]US2005121145  (DU BOIS DALE R [US], et al) [A] 1,3,9-15 * figures 20, 21, 25, 27 * * paragraph [0115] - paragraph [0122] *;
 [A]US2010212593  (TAKEBAYASHI YUJI [JP], et al) [A] 10 * figure 3 * * paragraph [0072] *;
 [A]JP2018085392  (TOKYO ELECTRON LTD) [A] 6-8 * figures 1, 2, 6, 7, 10 ** paragraph [0024] - paragraph [0025] *;
 [XI]US2018264516  (FUJIKAWA MAKOTO [JP], et al) [X] 1,3,9,12-14 * figures 1, 3, 12 * * paragraph [0024] - paragraph [0036] * * paragraph [0058] * [I] 10,11,15;
 [A]US2019309420  (OIKAWA MASAMI [JP], et al) [A] 6-8 * figures -41 * * paragraph [0045] - paragraph [0046] *;
 [A]EP3599290  (LG ELECTRONICS INC [KR]) [A] 2,4-8 * figures 12a,b,c, 13a,b, 14 * * paragraph [0146] - paragraph [0152] * * paragraph [0166] - paragraph [0176] * * paragraph [0181] - paragraph [0186] *
by applicantJPH06349761
 JP2014175494
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.