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EP4071802
European procedure
Extract from the Register of European Patents
EP About this file: EP4071802
| EP4071802 - COOLING SYSTEM WHERE SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCTOR CHIP AND COOLING APPARATUS ARE JOINED [Right-click to bookmark this link] | Status | The patent has been granted Status updated on 29.03.2024 Database last updated on 03.09.2024 | |
| Former | Grant of patent is intended Status updated on 10.01.2024 | ||
| Former | Request for examination was made Status updated on 09.09.2022 | Most recent event Tooltip | 29.03.2024 | (Expected) grant | published on 01.05.2024 [2024/18] | Applicant(s) | For all designated states JMJ Korea Co., Ltd. 29, Uigwahak 5-ro Jangan-eup Gijang-gun Busan 46034 / KR | For all designated states NHINC Co. Ltd. 187, Bucheon-ro Bucheon-si Gyeonggi-do 14553 / KR | [2024/06] |
| Former [2022/41] | For all designated states JMJ Korea Co., Ltd. 29, Uigwahak 5-ro Jangan-eup Gijang-gu Busan 46034 / KR | ||
| For all designated states NHINC Co. Ltd. 187, Bucheon-ro Bucheon-si Gyeonggi-do 14553 / KR | Inventor(s) | 01 /
CHOI, Yun Hwa Busan 46038 / KR | [2024/06] |
| Former [2022/41] | 01 /
CHOI, Yun Hwa 46038 Busan / KR | Representative(s) | dompatent von Kreisler Selting Werner - Partnerschaft von Patent- und Rechtsanwälten mbB Deichmannhaus am Dom Bahnhofsvorplatz 1 50667 Köln / DE | [2022/41] | Application number, filing date | 22162382.0 | 16.03.2022 | [2022/41] | Priority number, date | KR20210044053 | 05.04.2021 Original published format: KR 20210044053 | KR20210076086 | 11.06.2021 Original published format: KR 20210076086 | [2022/41] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4071802 | Date: | 12.10.2022 | Language: | EN | [2022/41] | Type: | B1 Patent specification | No.: | EP4071802 | Date: | 01.05.2024 | Language: | EN | [2024/18] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 06.09.2022 | Classification | IPC: | H01L23/473, H01L23/367, // H01L23/373 | [2024/04] | CPC: |
H01L23/473 (EP,CN,US);
H01L23/367 (US);
H01L23/3672 (CN);
H01L23/3677 (EP);
H01L23/4334 (EP);
H01L25/072 (EP);
H01L25/115 (EP);
H01L29/7393 (CN);
H01L29/78 (CN);
H01L2224/29139 (EP);
H01L2224/29147 (EP);
H01L2224/32225 (EP);
H01L2224/33181 (EP);
H01L2224/371 (EP);
H01L2224/40225 (EP);
H01L2224/451 (EP);
H01L2224/48091 (EP);
H01L2224/48227 (EP);
H01L2224/73221 (EP);
H01L2224/73265 (EP);
H01L23/3121 (EP);
H01L23/3735 (EP);
H01L24/29 (EP);
H01L24/32 (EP);
H01L24/33 (EP);
H01L24/37 (EP);
H01L24/40 (EP);
H01L24/45 (EP);
H01L24/73 (EP);
H01L2924/00014 (EP);
| C-Set: |
H01L2224/371, H01L2924/00014 (EP);
H01L2224/451, H01L2924/00014 (EP);
H01L2224/48091, H01L2924/00014 (EP);
H01L2224/73221, H01L2224/40225, H01L2224/48227, H01L2924/00 (EP);
H01L2224/73265, H01L2224/32225, H01L2224/48227, H01L2924/00012 (EP);
H01L2924/00014, H01L2224/73221 (EP); |
| Former IPC [2022/41] | H01L23/473, H01L25/11, H01L23/367, // H01L23/373 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/19] |
| Former [2022/41] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | KÜHLSYSTEM, BEI DEM EIN HALBLEITERBAUTEIL, DAS EINEN HALBLEITERCHIP UMFASST, UND EINE KÜHLVORRICHTUNG MITEINANDER VERBUNDEN SIND | [2022/41] | English: | COOLING SYSTEM WHERE SEMICONDUCTOR COMPONENT COMPRISING SEMICONDUCTOR CHIP AND COOLING APPARATUS ARE JOINED | [2022/41] | French: | SYSTÈME DE REFROIDISSEMENT OÙ SONT JOINTS UN COMPOSANT SEMI-CONDUCTEUR COMPRENANT UNE PUCE SEMI-CONDUCTRICE ET UN APPAREIL DE REFROIDISSEMENT | [2022/41] | Examination procedure | 16.03.2022 | Examination requested [2022/41] | 04.04.2023 | Amendment by applicant (claims and/or description) | 04.04.2023 | Date on which the examining division has become responsible | 11.01.2024 | Communication of intention to grant the patent | 25.03.2024 | Fee for grant paid | 25.03.2024 | Fee for publishing/printing paid | 25.03.2024 | Receipt of the translation of the claim(s) | Fees paid | Renewal fee | 27.02.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]JP2002158322 (MITSUBISHI ELECTRIC CORP) [X] 2,6,11-13 * figure 3 *; | [X]US2013285234 (UHLEMANN ANDRE [DE], et al) [X] 2-4,6,8,10-13 * paragraphs [0006] , [0028] , [0029]; figures 3,5 *; | [X]US2014321063 (UHLEMANN ANDRE [DE], et al) [X] 2,4,6,11-13 * paragraph [0029]; figures 6,7 *; | [X]US2014367842 (MIYAMOTO NOBORU [JP], et al) [X] 1,3,4,6,8,9,13 * paragraphs [0021] , [0022] , [0031] , [0034]; figure 2 *; | [X]US2016079155 (KAWASE TATSUYA [JP], et al) [X] 2,4,11,13 * paragraph [0040]; figures 26,27 *; | [A]US2018082925 (GRASSMANN ANDREAS [DE], et al) [A] 1,3,4,6,11,12,15 * figures 1, 2 *; | [X]EP3703117 (AUDI AG [DE], et al) [X] 2-4,6,11-13 * figures 1,2 *; | [X]WO2020174584 (MITSUBISHI ELECTRIC CORP [JP]) [X] 1-3,8,11,12 * figures 2, 5, 7 *; | [X]US2020350232 (GRADINGER THOMAS [CH], et al) [X] 2,3,5,6,12 * paragraphs [0006] , [0008] , [0013] , [0 15] , [0034]; figures 1-3 *; | [X]US2020388557 (YOO INPIL [DE], et al) [X] 2,4,6,11-14 * figures 3,4,5 *; | US2022189859 [ ] (ROKUBUICHI HODAKA [JP], et al) [ ] * paragraph [0035]; figures 2, 5,7 *; | [E]KR102411122B (JMJ KOREA CO LTD [KR]) [E] 1-15* the whole document * |