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EP4104965
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Extract from the Register of European Patents
EP About this file: EP4104965
| EP4104965 - LASER CUTTING METHOD [Right-click to bookmark this link] | Status | Examination is in progress Status updated on 09.12.2022 Database last updated on 13.07.2024 | |
| Former | Request for examination was made Status updated on 18.11.2022 | Most recent event Tooltip | 30.03.2024 | New entry: Renewal fee paid | Applicant(s) | For all designated states Shenzhen Geesun Intelligent Technology Co., Ltd. Building D, 101-501, Building EF Dejin Industrial Plant No. 40, 1st Fuyuan Road Zhancheng Community, Fuhai Street, Baoan District Shenzhen, Guangdong 518000 / CN | [2022/51] | Inventor(s) | 01 /
LI, Xiaoping Shenzhen, 518000 / CN | 02 /
WU, Xueke Shenzhen, 518000 / CN | 03 /
XIONG, Binbin Shenzhen, 518000 / CN | 04 /
YANG, Rukun Shenzhen, 518000 / CN | [2022/51] | Representative(s) | Loyer & Abello 9, rue Anatole de la Forge 75017 Paris / FR | [2022/51] | Application number, filing date | 22172916.3 | 12.05.2022 | [2022/51] | Priority number, date | CN202110671637 | 17.06.2021 Original published format: CN202110671637 | [2022/51] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4104965 | Date: | 21.12.2022 | Language: | EN | [2022/51] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 23.11.2022 | Classification | IPC: | B23K26/40, B23K26/38, // B23K103/16 | [2022/51] | CPC: |
B23K26/40 (EP,US);
B23K26/38 (EP,CN,US);
B23K26/60 (CN);
B23K2103/166 (EP);
Y02E60/10 (EP)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2022/51] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | LASERSCHNEIDEVERFAHREN | [2022/51] | English: | LASER CUTTING METHOD | [2022/51] | French: | PROCÉDÉ DE DÉCOUPE AU LASER | [2022/51] | Examination procedure | 12.05.2022 | Examination requested [2022/51] | 23.11.2022 | Date on which the examining division has become responsible | 12.12.2022 | Despatch of a communication from the examining division (Time limit: M04) | 24.03.2023 | Reply to a communication from the examining division | Fees paid | Renewal fee | 29.03.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JP2000149911 (MATSUSHITA ELECTRIC IND CO LTD) [Y] 8,9* paragraph [0006] *; | [XY]EP3477754 (SAMSUNG SDI CO LTD [KR]) [X] 1-7,10 * paragraphs [0006] - [0012] - [0022] - [0028] - [0040] , [0046]; figures 2A, 2C * [Y] 8,9 |