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Extract from the Register of European Patents

EP About this file: EP4113177

EP4113177 - METAMATERIAL STRUCTURE [Right-click to bookmark this link]
StatusThe patent has been granted
Status updated on  08.08.2024
Database last updated on 19.10.2024
FormerGrant of patent is intended
Status updated on  12.06.2024
FormerRequest for examination was made
Status updated on  13.01.2023
FormerThe application has been published
Status updated on  02.12.2022
Most recent event   Tooltip08.08.2024(Expected) grantpublished on 11.09.2024  [2024/37]
Applicant(s)For all designated states
Samsung Electronics Co., Ltd.
129, Samsung-ro
Yeongtong-gu
Suwon-si, Gyeonggi-do 16677 / KR
[2023/01]
Inventor(s)01 / HANANIA, Haeri Park
San Gabriel, CA 91775 / US
02 / CHOO, Hyuck
Yongin-si, Gyeonggi-do 16822 / KR
 [2023/01]
Representative(s)Kuhnen & Wacker Patent- und Rechtsanwaltsbüro PartG mbB
Prinz-Ludwig-Straße 40A
85354 Freising / DE
[2023/01]
Application number, filing date22174540.920.05.2022
[2023/01]
Priority number, dateUS202163217655P01.07.2021         Original published format: US 202163217655 P
US20211751265827.10.2021         Original published format: US202117512658
[2023/01]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4113177
Date:04.01.2023
Language:EN
[2023/01]
Type: B1 Patent specification 
No.:EP4113177
Date:11.09.2024
Language:EN
[2024/37]
Search report(s)(Supplementary) European search report - dispatched on:EP25.11.2022
ClassificationIPC:G02B1/118, G02B5/02, G02B1/00, G02B5/00
[2023/01]
CPC:
G02B5/008 (EP,KR,US); G02B1/002 (EP,KR,US); B22F1/0553 (CN);
A61B3/16 (CN,US); A61B3/165 (KR); B82Y30/00 (CN);
B82Y40/00 (CN); C01G19/02 (CN); C01G28/002 (CN);
C01G41/02 (CN); C01G9/02 (CN); G01L11/02 (US);
G02B1/118 (EP); G02B5/0215 (EP); A61B2562/0285 (US);
C23C14/025 (KR); C23C14/042 (KR); C23C14/14 (KR);
C23C16/0281 (KR); C23C16/042 (KR); C23C16/06 (KR);
C23C30/00 (KR); G02B2207/101 (EP,US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/07]
Former [2023/01]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:METAMATERIALSTRUKTUR[2023/01]
English:METAMATERIAL STRUCTURE[2023/01]
French:STRUCTURE EN MÉTAMATIÈRE[2023/01]
Examination procedure10.01.2023Amendment by applicant (claims and/or description)
10.01.2023Examination requested  [2023/07]
10.01.2023Date on which the examining division has become responsible
13.06.2024Communication of intention to grant the patent
31.07.2024Fee for grant paid
31.07.2024Fee for publishing/printing paid
31.07.2024Receipt of the translation of the claim(s)
Fees paidRenewal fee
13.03.2024Renewal fee patent year 03
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