EP4163967 - SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF [Right-click to bookmark this link] | Status | The application is deemed to be withdrawn Status updated on 09.02.2024 Database last updated on 08.06.2024 | |
Former | Request for examination was made Status updated on 20.10.2023 | ||
Former | The application has been published Status updated on 10.03.2023 | Most recent event Tooltip | 09.02.2024 | Application deemed to be withdrawn | published on 13.03.2024 [2024/11] | Applicant(s) | For all designated states NXP USA, Inc. 6501 William Cannon Drive Austin TX 78735 / US | [2023/15] | Inventor(s) | 01 /
Lye, Meng Kong 5656 AG Eindhoven / NL | 02 /
Wang, Zhijie 5656 AG Eindhoven / NL | 03 /
Ge, You 5656 AG Eindhoven / NL | 04 /
Li, Zhiming 5656 AG Eindhoven / NL | [2023/15] | Representative(s) | Schmütz, Christian Klaus Johannes NXP Semiconductors Germany GmbH Intellectual Property Group Beiersdorfstr. 12 22529 Hamburg / DE | [N/P] |
Former [2023/15] | Schmütz, Christian Klaus Johannes NXP Semiconductors Germany GmbH Intellectual Property Group Troplowitzstraße 20 22529 Hamburg / DE | Application number, filing date | 22197358.9 | 23.09.2022 | [2023/15] | Priority number, date | CN202111172811 | 08.10.2021 Original published format: CN202111172811 | [2023/15] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4163967 | Date: | 12.04.2023 | Language: | EN | [2023/15] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 13.03.2023 | Classification | IPC: | H01L23/495, H01L23/31 | [2023/15] | CPC: |
H01L23/49541 (EP);
H01L23/49838 (US);
H01L21/4828 (US);
H01L21/4842 (US);
H01L23/3107 (EP);
H01L23/49805 (US);
H01L24/48 (US);
H01L21/4839 (US);
H01L2224/48091 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/47] |
Former [2023/15] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | QFN-GEHÄUSE FÜR HALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR | [2023/15] | English: | SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF | [2023/15] | French: | BOÎTIER QFN DE DISPOSITIF SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION | [2023/15] | Examination procedure | 12.10.2023 | Examination requested [2023/47] | 12.10.2023 | Date on which the examining division has become responsible | 13.10.2023 | Application deemed to be withdrawn, date of legal effect [2024/11] | 06.11.2023 | Despatch of communication that the application is deemed to be withdrawn, reason: reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report not received in time [2024/11] |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]JP2003078100 (SONY CORP) [Y] 1,8,9 * paragraph [0017]; figures 5(4), 5(5) *; | [Y]US10199312 (RIVERA-MARTY PEDRO JOEL [US]) [Y] 1,8,9* column 10, lines 1-51; figures 12,13 *; | [XYI]US2019385938 (SHI LEI [CN]) [X] 1-6,8 * paragraphs [0004] , [0042] - [0057]; figures 4e,6,13 * [Y] 9 [I] 7,10 |