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Extract from the Register of European Patents

EP About this file: EP4163967

EP4163967 - SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF [Right-click to bookmark this link]
StatusThe application is deemed to be withdrawn
Status updated on  09.02.2024
Database last updated on 08.06.2024
FormerRequest for examination was made
Status updated on  20.10.2023
FormerThe application has been published
Status updated on  10.03.2023
Most recent event   Tooltip09.02.2024Application deemed to be withdrawnpublished on 13.03.2024  [2024/11]
Applicant(s)For all designated states
NXP USA, Inc.
6501 William Cannon Drive
Austin TX 78735 / US
[2023/15]
Inventor(s)01 / Lye, Meng Kong
5656 AG Eindhoven / NL
02 / Wang, Zhijie
5656 AG Eindhoven / NL
03 / Ge, You
5656 AG Eindhoven / NL
04 / Li, Zhiming
5656 AG Eindhoven / NL
 [2023/15]
Representative(s)Schmütz, Christian Klaus Johannes
NXP Semiconductors Germany GmbH
Intellectual Property Group
Beiersdorfstr. 12
22529 Hamburg / DE
[N/P]
Former [2023/15]Schmütz, Christian Klaus Johannes
NXP Semiconductors Germany GmbH
Intellectual Property Group
Troplowitzstraße 20
22529 Hamburg / DE
Application number, filing date22197358.923.09.2022
[2023/15]
Priority number, dateCN20211117281108.10.2021         Original published format: CN202111172811
[2023/15]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4163967
Date:12.04.2023
Language:EN
[2023/15]
Search report(s)(Supplementary) European search report - dispatched on:EP13.03.2023
ClassificationIPC:H01L23/495, H01L23/31
[2023/15]
CPC:
H01L23/49541 (EP); H01L23/49838 (US); H01L21/4828 (US);
H01L21/4842 (US); H01L23/3107 (EP); H01L23/49805 (US);
H01L24/48 (US); H01L21/4839 (US); H01L2224/48091 (US);
H01L2224/48245 (US); H01L2924/182 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2023/47]
Former [2023/15]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
MENot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:QFN-GEHÄUSE FÜR HALBLEITERBAUELEMENT UND HERSTELLUNGSVERFAHREN DAFÜR[2023/15]
English:SEMICONDUCTOR DEVICE QFN PACKAGE AND METHOD OF MAKING THEREOF[2023/15]
French:BOÎTIER QFN DE DISPOSITIF SEMI-CONDUCTEUR ET SON PROCÉDÉ DE FABRICATION[2023/15]
Examination procedure12.10.2023Examination requested  [2023/47]
12.10.2023Date on which the examining division has become responsible
13.10.2023Application deemed to be withdrawn, date of legal effect  [2024/11]
06.11.2023Despatch of communication that the application is deemed to be withdrawn, reason: reply to the Extended European Search Report/Written Opinion of the International Searching Authority/International Preliminary Examination Report/Supplementary international search report not received in time  [2024/11]
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Documents cited:Search[Y]JP2003078100  (SONY CORP) [Y] 1,8,9 * paragraph [0017]; figures 5(4), 5(5) *;
 [Y]US10199312  (RIVERA-MARTY PEDRO JOEL [US]) [Y] 1,8,9* column 10, lines 1-51; figures 12,13 *;
 [XYI]US2019385938  (SHI LEI [CN]) [X] 1-6,8 * paragraphs [0004] , [0042] - [0057]; figures 4e,6,13 * [Y] 9 [I] 7,10
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.