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EP4202998
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EP About this file: EP4202998
| EP4202998 - INTEGRATED CIRCUIT STRUCTURE HAVING ANTI-FUSE STRUCTURE [Right-click to bookmark this link] | Status | The application has been published Status updated on 26.05.2023 Database last updated on 15.06.2024 | Most recent event Tooltip | 15.12.2023 | Publication of search report | published on 17.01.2024 [2024/03] | 15.12.2023 | Change - classification | published on 17.01.2024 [2024/03] | 15.12.2023 | Change - classification | published on 17.01.2024 [2024/03] | Applicant(s) | For all designated states INTEL Corporation 2200 Mission College Blvd. Santa Clara, CA 95054 / US | [2023/26] | Inventor(s) | 01 /
PARK, Changyok Portland, 97229 / US | [2023/26] | Representative(s) | 2SPL Patentanwälte PartG mbB Landaubogen 3 81373 München / DE | [2023/26] | Application number, filing date | 22214743.1 | 19.12.2022 | [2023/26] | Priority number, date | US202117561687 | 23.12.2021 Original published format: US202117561687 | [2023/26] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP4202998 | Date: | 28.06.2023 | Language: | EN | [2023/26] | Type: | A3 Search report | No.: | EP4202998 | Date: | 17.01.2024 | Language: | EN | [2024/03] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.12.2023 | Classification | IPC: | H01L21/8234, H01L27/088, H01L29/06, H01L29/775, H01L29/786 | [2023/26] | CPC: |
H01L27/088 (EP);
H01L23/5252 (US);
H01L21/823412 (EP);
H01L21/823456 (EP);
H01L29/0673 (EP,US);
H01L29/0847 (EP);
H01L29/42392 (EP,US);
H01L29/66439 (EP);
H01L29/66545 (EP);
H01L29/775 (EP);
H01L29/78696 (EP);
B82Y10/00 (EP);
H01L29/1079 (EP)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/26] | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | INTEGRIERTE SCHALTUNGSSTRUKTUR MIT ANTISCHMELZVERBINDUNGSSTRUKTUR | [2023/26] | English: | INTEGRATED CIRCUIT STRUCTURE HAVING ANTI-FUSE STRUCTURE | [2023/26] | French: | STRUCTURE DE CIRCUIT INTÉGRÉ AYANT UNE STRUCTURE ANTIFUSIBLE | [2023/26] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2018175035 (YANG JUNG-GIL [KR], et al) [X] 1,5,8,12 * paragraphs [0081] - [0083] * * figures 11, 12 *; | [X]US2020287046 (FROUGIER JULIEN [US], et al) [X] 1-5,8-12 * paragraphs [0048] , [0 63] , [0 66] - [0069] * * figure 12 *; | [X]US2021193821 (DENTONI LITTA EUGENIO [BE], et al) [X] 1,8 * paragraphs [0088] - [0094] ** figure 8a * |