EP4131905 - FLEXIBLE CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE [Right-click to bookmark this link] | Status | Grant of patent is intended Status updated on 11.07.2024 Database last updated on 02.08.2024 | |
Former | Examination is in progress Status updated on 19.04.2024 | ||
Former | Request for examination was made Status updated on 06.01.2023 | ||
Former | The international publication has been made Status updated on 30.12.2022 | ||
Former | unknown Status updated on 27.07.2022 | Most recent event Tooltip | 12.07.2024 | Change: Validation states | published on 14.08.2024 [2024/33] | 12.07.2024 | Change - extension states | published on 14.08.2024 [2024/33] | Applicant(s) | For all designated states Honor Device Co., Ltd. Suite 3401, Unit A, Building 6 Shum Yip Sky Park, No. 8089 Hongli West Road Xiangmihu Street, Futian District Shenzhen, Guangdong 518040 / CN | [2023/06] | Inventor(s) | 01 /
WANG, Wenhao Shenzhen, Guangdong 518040 / CN | 02 /
YANG, Xiujuan Shenzhen, Guangdong 518040 / CN | 03 /
LI, Mingchuan Shenzhen, Guangdong 518040 / CN | [2023/07] | Representative(s) | Epping - Hermann - Fischer Patentanwaltsgesellschaft mbH Schloßschmidstraße 5 80639 München / DE | [2023/06] | Application number, filing date | 22741140.2 | 18.01.2022 | [2023/06] | WO2022CN72538 | Priority number, date | CN202110700216 | 23.06.2021 Original published format: CN202110700216 | [2023/06] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2022267461 | Date: | 29.12.2022 | Language: | ZH | [2022/52] | Type: | A1 Application with search report | No.: | EP4131905 | Date: | 08.02.2023 | Language: | EN | [2023/06] | Type: | A8 Corrected patent application | No.: | EP4131905 | Date: | 12.04.2023 | [2023/15] | Search report(s) | International search report - published on: | CN | 29.12.2022 | (Supplementary) European search report - dispatched on: | EP | 25.10.2023 | Classification | IPC: | H05K1/02, H04M1/02 | [2024/32] | CPC: |
H04M1/0277 (EP,CN,US);
H05K5/0226 (US);
H04M1/0208 (EP);
H04N23/57 (US);
H05K1/028 (EP);
H05K1/148 (US);
H04M1/0216 (EP);
H05K2201/051 (EP);
H05K2201/055 (EP);
|
Former IPC [2023/34] | H04M1/02, G06F9/30, H05K7/14, H05K1/14, H05K1/18 | ||
Former IPC [2023/06] | H04M1/02, G06F9/30, H05K7/14 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2023/06] | Title | German: | FLEXIBLE GEDRUCKTE SCHALTUNGSANORDNUNG UND ELEKTRONISCHE VORRICHTUNG | [2023/06] | English: | FLEXIBLE CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE | [2023/06] | French: | ENSEMBLE CARTE DE CIRCUIT IMPRIMÉ SOUPLE ET DISPOSITIF ÉLECTRONIQUE | [2023/06] | Entry into regional phase | 27.07.2022 | Translation filed | 27.07.2022 | National basic fee paid | 27.07.2022 | Search fee paid | 27.07.2022 | Designation fee(s) paid | 27.07.2022 | Examination fee paid | Examination procedure | 27.07.2022 | Examination requested [2023/06] | 15.02.2024 | Amendment by applicant (claims and/or description) | 15.02.2024 | Date on which the examining division has become responsible | 19.04.2024 | Despatch of a communication from the examining division (Time limit: M04) | 20.06.2024 | Reply to a communication from the examining division | 12.07.2024 | Communication of intention to grant the patent | Fees paid | Renewal fee | 19.01.2024 | Renewal fee patent year 03 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]EP1198037 (NOKIA CORP [FI]); | [XA]US2004266239 (KUROKAWA TOMOYASU [JP]); | [I]US2015305146 (TOMITA YOSHIHIRO [JP]) | International search | [A]JP2005167597 (KYOCERA CORP); | [A]CN105518767 (ROYOLE CORP); | [A]CN110290238 (OPPO GUANGDONG MOBILE TELECOMMUNICATIONS CO LTD); | [A]CN111147630 (HUAWEI TECH CO LTD); | [A]CN111314514 (VIVO COMM TECHNOLOGY CO LTD); | [XA]CN113014709 (BOE TECHNOLOGY GROUP CO LTD, et al) |