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Extract from the Register of European Patents

EP About this file: EP4322330

EP4322330 - WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  12.01.2024
Database last updated on 17.07.2024
FormerThe international publication has been made
Status updated on  14.10.2022
Most recent event   Tooltip14.06.2024Change: Validation statespublished on 17.07.2024  [2024/29]
14.06.2024Change - extension statespublished on 17.07.2024  [2024/29]
Applicant(s)For all designated states
Dai Nippon Printing Co., Ltd.
1-1, Ichigaya-kaga-cho 1-chome Shinjuku-ku
Tokyo 162-8001 / JP
[2024/07]
Inventor(s)01 / IIMURA Keita
Tokyo 162-8001 / JP
02 / KAWAGUCHI Shuji
Tokyo 162-8001 / JP
03 / KINOSHITA Kazuki
Tokyo 162-8001 / JP
04 / IIOKA Hidetoshi
Tokyo 162-8001 / JP
05 / TAKE Seiji
Tokyo 162-8001 / JP
 [2024/07]
Representative(s)Müller-Boré & Partner Patentanwälte PartG mbB
Friedenheimer Brücke 21
80639 München / DE
[2024/07]
Application number, filing date22784665.604.04.2022
[2024/07]
WO2022JP17051
Priority number, dateJP2021006676109.04.2021         Original published format: JP 2021066761
[2024/07]
Filing languageJA
Procedural languageEN
PublicationType: A1 Application with search report
No.:WO2022215683
Date:13.10.2022
Language:JA
[2022/41]
Type: A1 Application with search report 
No.:EP4322330
Date:14.02.2024
Language:EN
[2024/07]
Search report(s)International search report - published on:JP13.10.2022
ClassificationIPC:H01Q1/38, H05K1/02
[2024/07]
CPC:
H01Q1/38 (EP,KR); H05K3/4602 (US); H05K1/0213 (KR);
H05K1/0274 (EP); H05K1/0298 (US); H05K1/165 (EP);
H05K3/4652 (US); H05K2201/0108 (EP); H05K2201/09681 (EP);
H05K2201/09781 (EP,US); H05K2201/10098 (EP) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/07]
TitleGerman:LEITERPLATTE UND VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE[2024/07]
English:WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD[2024/07]
French:CARTE DE CIRCUIT IMPRIMÉ, ET PROCÉDÉ DE FABRICATION DE CELLE-CI[2024/07]
Entry into regional phase30.10.2023Translation filed 
02.11.2023National basic fee paid 
02.11.2023Search fee paid 
02.11.2023Designation fee(s) paid 
02.11.2023Examination fee paid 
Examination procedure02.11.2023Examination requested  [2024/07]
15.01.2024Amendment by applicant (claims and/or description)
Fees paidRenewal fee
26.03.2024Renewal fee patent year 03
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Cited inInternational search[YX]JP2018060345  (JAPAN AVIATION ELECTRONICS IND LTD);
 [Y]JP2020036031  (DAINIPPON PRINTING CO LTD);
 [YX]KR20210034577  (DONGWOO FINE CHEM CO LTD [KR])
by applicantJP2011066610
 JP5636735B
 JP5695947B
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.