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EP4307352
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EP About this file: EP4307352
| EP4307352 - PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 15.12.2023 Database last updated on 19.10.2024 | |
| Former | The international publication has been made Status updated on 08.12.2023 | ||
| Former | unknown Status updated on 13.01.2023 | Most recent event Tooltip | 31.08.2024 | Amendment by applicant | Applicant(s) | For all designated states Changxin Memory Technologies, Inc. No. 388 Xingye Avenue Airport Industrial Park Economic and Technological Development Area Hefei, Anhui 230601 / CN | [2024/03] | Inventor(s) | 01 /
TIAN, Kai Hefei, Anhui 230601 / CN | 02 /
LI, Hongwen Hefei, Anhui 230601 / CN | 03 /
QUAN, Changhao Hefei, Anhui 230601 / CN | 04 /
CHEN, Liang Hefei, Anhui 230601 / CN | 05 /
WANG, Yuxia Hefei, Anhui 230601 / CN | 06 /
GUO, Yingdong Hefei, Anhui 230601 / CN | [2024/03] | Representative(s) | Lavoix Bayerstraße 83 80335 München / DE | [2024/03] | Application number, filing date | 22836031.9 | 29.06.2022 | [2024/03] | WO2022CN102515 | Priority number, date | CN202210619084 | 01.06.2022 Original published format: CN202210619084 | [2024/03] | Filing language | ZH | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | WO2023231122 | Date: | 07.12.2023 | Language: | ZH | [2023/49] | Type: | A1 Application with search report | No.: | EP4307352 | Date: | 17.01.2024 | Language: | EN | [2024/03] | Search report(s) | International search report - published on: | CN | 07.12.2023 | (Supplementary) European search report - dispatched on: | EP | 21.02.2024 | Classification | IPC: | H01L21/66, H01L23/544, H01L23/00 | [2024/12] | CPC: |
H01L22/32 (EP,US);
H01L24/04 (KR);
H01L22/12 (KR);
H01L22/34 (KR);
H01L23/5226 (KR);
H01L23/5283 (KR);
H01L24/02 (US);
H01L24/03 (EP,KR,US);
H01L24/05 (EP,US);
H01L24/06 (EP,US);
H01L25/0657 (KR);
H01L25/50 (KR);
H01L2224/0231 (KR);
H01L2224/02311 (US);
H01L2224/0233 (KR);
H01L2224/02381 (KR);
H01L2224/03462 (US);
H01L2224/0391 (US);
H01L2224/0392 (EP);
H01L2224/04042 (EP,US);
H01L2224/05548 (EP,US);
H01L2224/05567 (EP,US);
H01L2224/05624 (EP);
H01L2224/0603 (EP);
H01L2224/06135 (EP);
H01L2224/06138 (US);
H01L2224/0615 (EP);
|
| Former IPC [2024/03] | H01L21/66, H01L23/544 | Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/03] | Extension states | BA | Not yet paid | ME | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERPACKUNGSSTRUKTUR, HERSTELLUNGSVERFAHREN DAFÜR UND HALBLEITERBAUELEMENT | [2024/03] | English: | PACKAGING STRUCTURE, MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR DEVICE | [2024/03] | French: | STRUCTURE D'ENCAPSULATION, PROCÉDÉ DE FABRICATION ASSOCIÉ ET DISPOSITIF À SEMI-CONDUCTEUR | [2024/03] | Entry into regional phase | 13.01.2023 | Translation filed | 13.01.2023 | National basic fee paid | 13.01.2023 | Search fee paid | 13.01.2023 | Designation fee(s) paid | 13.01.2023 | Examination fee paid | Examination procedure | 13.01.2023 | Examination requested [2024/03] | 30.08.2024 | Amendment by applicant (claims and/or description) | 30.08.2024 | Date on which the examining division has become responsible | Fees paid | Renewal fee | 31.03.2024 | Renewal fee patent year 03 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]US2002180026 (LIU AN-HONG [TW], et al); | [A]US2007090356 (HANAOKA TERUNAO [JP]) |