EP4231351 - SEMICONDUCTOR PACKAGES [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 16.02.2024 Database last updated on 19.10.2024 | |
Former | The application has been published Status updated on 21.07.2023 | Most recent event Tooltip | 16.02.2024 | The date on which the examining division becomes responsible, has been established | 16.02.2024 | Amendment by applicant | 16.02.2024 | Request for examination filed | published on 20.03.2024 [2024/12] | 16.02.2024 | Change - designated states | published on 20.03.2024 [2024/12] | Applicant(s) | For all designated states MediaTek Inc. No. 1, Dusing 1st Rd. Hsinchu Science Park Hsinchu City 30078 / TW | [2023/34] | Inventor(s) | 01 /
CHEN, Hsiao-Yun 30078 Hsinchu City / TW | 02 /
HUANG, Chi-Hung 30078 Hsinchu City / TW | 03 /
HUANG, Yao-Tsung 30078 Hsinchu City / TW | 04 /
CHANG, Cheng-Jyi 30078 Hsinchu City / TW | 05 /
CHANG, Sheng-Chieh 30078 Hsinchu City / TW | [2023/34] | Representative(s) | Goddar, Heinz J. Boehmert & Boehmert Anwaltspartnerschaft mbB Pettenkoferstrasse 22 80336 München / DE | [2023/34] | Application number, filing date | 23155838.8 | 09.02.2023 | [2023/34] | Priority number, date | US202263311099P | 17.02.2022 Original published format: US 202263311099 P | US202217962185 | 07.10.2022 Original published format: US202217962185 | [2023/34] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4231351 | Date: | 23.08.2023 | Language: | EN | [2023/34] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.07.2023 | Classification | IPC: | H01L25/16, H01L23/00, H01L25/00, H01L27/06, H01L29/94, // H01L23/498, H01L23/522, H01L25/065, H01L25/10, H01L25/18 | [2023/34] | CPC: |
H01L25/16 (EP);
H01L25/162 (US);
H01L23/481 (US);
H01L23/49816 (EP,US);
H01L23/49838 (US);
H01L24/08 (US);
H01L24/16 (EP,US);
H01L24/32 (US);
H01L24/73 (US);
H01L24/80 (US);
H01L24/81 (EP);
H01L24/82 (EP);
H01L25/165 (US);
H01L25/50 (EP);
H01L27/0694 (EP);
H01L28/75 (US);
H01L28/90 (EP,US);
H01L21/76898 (EP);
H01L2224/02331 (EP);
H01L2224/02371 (EP);
H01L2224/08235 (US);
H01L2224/08265 (US);
H01L2224/16235 (US);
H01L2224/32225 (US);
H01L2224/73204 (US);
H01L2224/80895 (US);
H01L2224/80896 (US);
H01L2225/06524 (EP);
H01L2225/06541 (EP);
H01L2225/06548 (EP);
H01L2225/06586 (EP);
H01L2225/1023 (EP);
H01L2225/1035 (EP);
H01L2225/1041 (EP);
H01L2225/1058 (EP);
H01L2225/107 (EP);
H01L23/5389 (EP);
H01L24/05 (EP);
H01L24/24 (EP);
H01L25/0652 (EP);
H01L25/0657 (EP);
H01L25/105 (EP);
H01L25/18 (EP);
H01L27/0629 (EP);
H01L2924/1431 (US);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/12] |
Former [2023/34] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HALBLEITERGEHÄUSE | [2023/34] | English: | SEMICONDUCTOR PACKAGES | [2023/34] | French: | BOÎTIERS DE SEMI-CONDUCTEURS | [2023/34] | Examination procedure | 15.02.2024 | Amendment by applicant (claims and/or description) | 15.02.2024 | Examination requested [2024/12] | 15.02.2024 | Date on which the examining division has become responsible |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [XI]US2020411636 (KAO MIN-FENG [TW], et al) [X] 1-6,9-12,14,15 * paragraph [0002]; figures 1-3 * * paragraph [0013] - paragraph [0035] * * paragraph [0044] * [I] 4,7,8,13,15; | [XAI]DE102021109881 (TAIWAN SEMICONDUCTOR MFG CO LTD [TW]) [X] 9-12,14,15 * paragraph [0002]; figure 1F * * paragraph [0024] - paragraph [0036] * * paragraph [0048] - paragraph [0051] * [A] 7,8[I] 13,15 |