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Extract from the Register of European Patents

EP About this file: EP4231351

EP4231351 - SEMICONDUCTOR PACKAGES [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  16.02.2024
Database last updated on 19.10.2024
FormerThe application has been published
Status updated on  21.07.2023
Most recent event   Tooltip16.02.2024The date on which the examining division becomes responsible, has been established 
16.02.2024Amendment by applicant 
16.02.2024Request for examination filedpublished on 20.03.2024  [2024/12]
16.02.2024Change - designated statespublished on 20.03.2024  [2024/12]
Applicant(s)For all designated states
MediaTek Inc.
No. 1, Dusing 1st Rd.
Hsinchu Science Park
Hsinchu City 30078 / TW
[2023/34]
Inventor(s)01 / CHEN, Hsiao-Yun
30078 Hsinchu City / TW
02 / HUANG, Chi-Hung
30078 Hsinchu City / TW
03 / HUANG, Yao-Tsung
30078 Hsinchu City / TW
04 / CHANG, Cheng-Jyi
30078 Hsinchu City / TW
05 / CHANG, Sheng-Chieh
30078 Hsinchu City / TW
 [2023/34]
Representative(s)Goddar, Heinz J.
Boehmert & Boehmert
Anwaltspartnerschaft mbB
Pettenkoferstrasse 22
80336 München / DE
[2023/34]
Application number, filing date23155838.809.02.2023
[2023/34]
Priority number, dateUS202263311099P17.02.2022         Original published format: US 202263311099 P
US20221796218507.10.2022         Original published format: US202217962185
[2023/34]
Filing languageEN
Procedural languageEN
PublicationType: A1 Application with search report 
No.:EP4231351
Date:23.08.2023
Language:EN
[2023/34]
Search report(s)(Supplementary) European search report - dispatched on:EP20.07.2023
ClassificationIPC:H01L25/16, H01L23/00, H01L25/00, H01L27/06, H01L29/94, // H01L23/498, H01L23/522, H01L25/065, H01L25/10, H01L25/18
[2023/34]
CPC:
H01L25/16 (EP); H01L25/162 (US); H01L23/481 (US);
H01L23/49816 (EP,US); H01L23/49838 (US); H01L24/08 (US);
H01L24/16 (EP,US); H01L24/32 (US); H01L24/73 (US);
H01L24/80 (US); H01L24/81 (EP); H01L24/82 (EP);
H01L25/165 (US); H01L25/50 (EP); H01L27/0694 (EP);
H01L28/75 (US); H01L28/90 (EP,US); H01L21/76898 (EP);
H01L2224/02331 (EP); H01L2224/02371 (EP); H01L2224/08235 (US);
H01L2224/08265 (US); H01L2224/16235 (US); H01L2224/32225 (US);
H01L2224/73204 (US); H01L2224/80895 (US); H01L2224/80896 (US);
H01L2225/06524 (EP); H01L2225/06541 (EP); H01L2225/06548 (EP);
H01L2225/06586 (EP); H01L2225/1023 (EP); H01L2225/1035 (EP);
H01L2225/1041 (EP); H01L2225/1058 (EP); H01L2225/107 (EP);
H01L23/5389 (EP); H01L24/05 (EP); H01L24/24 (EP);
H01L25/0652 (EP); H01L25/0657 (EP); H01L25/105 (EP);
H01L25/18 (EP); H01L27/0629 (EP); H01L2924/1431 (US);
H01L2924/1434 (US); H01L2924/19011 (US); H01L2924/19041 (US) (-)
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   ME,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/12]
Former [2023/34]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  ME,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
Extension statesBANot yet paid
Validation statesKHNot yet paid
MANot yet paid
MDNot yet paid
TNNot yet paid
TitleGerman:HALBLEITERGEHÄUSE[2023/34]
English:SEMICONDUCTOR PACKAGES[2023/34]
French:BOÎTIERS DE SEMI-CONDUCTEURS[2023/34]
Examination procedure15.02.2024Amendment by applicant (claims and/or description)
15.02.2024Examination requested  [2024/12]
15.02.2024Date on which the examining division has become responsible
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Documents cited:Search[XI]US2020411636  (KAO MIN-FENG [TW], et al) [X] 1-6,9-12,14,15 * paragraph [0002]; figures 1-3 * * paragraph [0013] - paragraph [0035] * * paragraph [0044] * [I] 4,7,8,13,15;
 [XAI]DE102021109881  (TAIWAN SEMICONDUCTOR MFG CO LTD [TW]) [X] 9-12,14,15 * paragraph [0002]; figure 1F * * paragraph [0024] - paragraph [0036] * * paragraph [0048] - paragraph [0051] * [A] 7,8[I] 13,15
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