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EP4319526
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EP About this file: EP4319526
| EP4319526 - SEMICONDUCTOR DEVICE [Right-click to bookmark this link] | Status | Request for examination was made Status updated on 05.01.2024 Database last updated on 16.07.2024 | Most recent event Tooltip | 05.01.2024 | Publication in section I.1 EP Bulletin | published on 07.02.2024 [2024/06] | 05.01.2024 | Request for examination filed | published on 07.02.2024 [2024/06] | Applicant(s) | For all designated states Samsung Electronics Co., Ltd. 129, Samsung-ro Yeongtong-gu Suwon-si, Gyeonggi-do 16677 / KR | [2024/06] | Inventor(s) | 01 /
LEE, Seunghun 16677 Suwon-si, Gyeonggi-do / KR | 02 /
YOON, Seokhyeon 16677 Suwon-si, Gyeonggi-do / KR | 03 /
LEE, Kyowook 16677 Suwon-si, Gyeonggi-do / KR | 04 /
LEE, Hyejin 16677 Suwon-si, Gyeonggi-do / KR | [2024/06] | Representative(s) | Kuhnen & Wacker Patent- und Rechtsanwaltsbüro PartG mbB Prinz-Ludwig-Straße 40A 85354 Freising / DE | [2024/06] | Application number, filing date | 23171253.0 | 03.05.2023 | [2024/06] | Priority number, date | KR20220096154 | 02.08.2022 Original published format: KR 20220096154 | [2024/06] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4319526 | Date: | 07.02.2024 | Language: | EN | [2024/06] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.12.2023 | Classification | IPC: | H10B10/00, H01L29/06, H01L29/423, H01L29/66, H01L29/775, H01L29/786 | [2024/06] | CPC: |
H10B10/125 (EP);
H10B10/12 (CN,KR,US);
G11C11/412 (US);
H01L29/0673 (EP);
H01L29/41766 (EP);
H01L29/42392 (EP);
H01L29/66439 (EP);
H01L29/66545 (EP);
H01L29/775 (EP);
H01L29/785 (KR);
H01L29/78696 (EP);
B82Y10/00 (EP);
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/06] | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | HALBLEITERANORDNUNG | [2024/06] | English: | SEMICONDUCTOR DEVICE | [2024/06] | French: | DISPOSITIF SEMI-CONDUCTEUR | [2024/06] | Examination procedure | 03.05.2023 | Examination requested [2024/06] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [Y]US2017200738 (KIM BO SOON [KR], et al) [Y] 1-15 * paragraphs [0083] , [0459] - [0502]; figures 54-57 *; | [Y]US2021408010 (LIEN CHONG-DE [TW], et al) [Y] 1-15 * paragraphs [0013] - [0047]; figures 11A,11B; claim - *; | [A]US2022037509 (HUANG JUI-CHIEN [TW], et al) [A] 1-15 * the whole document *; | [Y]CN114765175 (TAIWAN SEMICONDUCTOR MFG CO LTD) [Y] 1-15 * figures 1B, 12-15 *; | [P]US2022278110 (LIAW JHON JHY [TW]) [P] * paragraphs [0023] , [0024] , [0049] - [0053]; figures 1B, 12-15 * |