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Extract from the Register of European Patents

EP About this file: EP4243067

EP4243067 - ELECTRONIC PACKAGE ARRANGEMENTS [Right-click to bookmark this link]
StatusRequest for examination was made
Status updated on  24.05.2024
Database last updated on 03.09.2024
FormerThe application has been published
Status updated on  11.08.2023
Most recent event   Tooltip24.05.2024The date on which the examining division becomes responsible, has been established 
24.05.2024Amendment by applicant 
24.05.2024Request for examination filedpublished on 26.06.2024  [2024/26]
24.05.2024Change - designated statespublished on 26.06.2024  [2024/26]
Applicant(s)For all designated states
Qorvo US, Inc.
7628 Thorndike Road
Greensboro, NC 27409 / US
[2023/37]
Inventor(s)01 / NAIR, Deepukumar, M.
Greensboro, 27409 / US
02 / DRY, Robert Charles
Greensboro, 27409 / US
03 / DEKOSKY, Jeffrey
Greensboro, 27409 / US
 [2023/37]
Representative(s)D Young & Co LLP
3 Noble Street
London EC2V 7BQ / GB
[N/P]
Former [2023/37]D Young & Co LLP
120 Holborn
London EC1N 2DY / GB
Application number, filing date23181904.617.12.2019
[2023/37]
Priority number, dateUS201862782373P20.12.2018         Original published format: US 201862782373 P
US20191657908023.09.2019         Original published format: US201916579080
[2023/37]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP4243067
Date:13.09.2023
Language:EN
[2023/37]
Type: A3 Search report 
No.:EP4243067
Date:22.11.2023
Language:EN
[2023/47]
Search report(s)(Supplementary) European search report - dispatched on:EP19.10.2023
ClassificationIPC:H01L23/367, H01L23/31, H01L23/552
[2023/47]
CPC:
H01L23/3675 (EP,US); H01L21/4882 (US); H01L21/565 (US);
H01L23/3121 (EP,US); H01L23/552 (EP,US); H01L23/66 (EP);
H01L2223/6677 (EP) (-)
Former IPC [2023/37]H01L23/552
Designated contracting statesAL,   AT,   BE,   BG,   CH,   CY,   CZ,   DE,   DK,   EE,   ES,   FI,   FR,   GB,   GR,   HR,   HU,   IE,   IS,   IT,   LI,   LT,   LU,   LV,   MC,   MK,   MT,   NL,   NO,   PL,   PT,   RO,   RS,   SE,   SI,   SK,   SM,   TR [2024/26]
Former [2023/37]AL,  AT,  BE,  BG,  CH,  CY,  CZ,  DE,  DK,  EE,  ES,  FI,  FR,  GB,  GR,  HR,  HU,  IE,  IS,  IT,  LI,  LT,  LU,  LV,  MC,  MK,  MT,  NL,  NO,  PL,  PT,  RO,  RS,  SE,  SI,  SK,  SM,  TR 
TitleGerman:ELEKTRONISCHE VERPACKUNGSANORDNUNGEN[2023/37]
English:ELECTRONIC PACKAGE ARRANGEMENTS[2023/37]
French:AGENCEMENTS DE BOÎTIERS ÉLECTRONIQUES[2023/37]
Examination procedure22.05.2024Amendment by applicant (claims and/or description)
22.05.2024Examination requested  [2024/26]
22.05.2024Date on which the examining division has become responsible
Parent application(s)   TooltipEP19842448.3  / EP3884517
Fees paidRenewal fee
13.07.2023Renewal fee patent year 03
13.07.2023Renewal fee patent year 04
19.12.2023Renewal fee patent year 05
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Documents cited:Search[YA]US6534859  (SHIM IL KWON [SG], et al) [Y] 2,3 * column 6, line 38 - column 8, line 7; figures 3,8,9 * [A] 1;
 [XY]EP1458023  (DELPHI TECH INC [US]) [X] 1,15 * paragraphs [0012] - [0019]; figure 1 * [Y] 2,3;
 [A]TW201108360  (ADVANCED SEMICONDUCTOR ENG [TW]) [A] 1-3 * abstract * * paragraphs [0019] - [0035] *;
 [A]TW201142965  (STATS CHIPPAC LTD [SG]) [A] 1-3 * paragraphs [0045] - [0056]; figures 5,6 *;
 [A]US8093691  (FUENTES RUBEN [US], et al) [A] 1,5,6,8* column 9, line 39 - column 10, line 36; figures 1D,5A-5C *
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.