| EP4336552 - ELECTRONIC COMPONENT COMPRISING A TWO-PHASE FLUID FOR REMOVING THERMAL HEAT FROM SEMICONDUCTORS OF SAID ELECTRONIC COMPONENT [Right-click to bookmark this link] | |||
| Former [2024/11] | ELECTRONIC COMPONENT COMPRISING A TWO-PHASE FLUID FOR REMOVING THERMAL CALORIES FROM SEMICONDUCTORS OF SAID ELECTRONIC COMPONENT | ||
| [2024/42] | Status | No opposition filed within time limit Status updated on 16.01.2026 Database last updated on 14.03.2026 | |
| Former | The patent has been granted Status updated on 07.02.2025 | ||
| Former | Grant of patent is intended Status updated on 28.11.2024 | ||
| Former | Examination is in progress Status updated on 18.11.2024 | ||
| Former | Grant of patent is intended Status updated on 16.09.2024 | ||
| Former | Examination is in progress Status updated on 16.02.2024 | ||
| Former | Request for examination was made Status updated on 09.02.2024 | Most recent event Tooltip | 16.01.2026 | Lapse of the patent in a contracting state New state(s): DK | published on 18.02.2026 [2026/08] | 16.01.2026 | No opposition filed within time limit | published on 18.02.2026 [2026/08] | Applicant(s) | For all designated states Airbus (S.A.S.) 2, Rond Point Emile Dewoitine 31700 Blagnac / FR | [2024/11] | Inventor(s) | 01 /
LOEHRMANN, Antoine 31700 BLAGNAC / FR | 02 /
CREPEL, Olivier 31700 BLAGNAC / FR | [2024/11] | Representative(s) | Airbus-OPS SAS LLF-M0101/1 316, route de Bayonne 31060 Toulouse Cedex / FR | [2024/11] | Application number, filing date | 23187170.8 | 24.07.2023 | [2024/11] | Priority number, date | FR20220009135 | 12.09.2022 Original published format: FR 2209135 | [2024/11] | Filing language | FR | Procedural language | FR | Publication | Type: | A1 Application with search report | No.: | EP4336552 | Date: | 13.03.2024 | Language: | FR | [2024/11] | Type: | B1 Patent specification | No.: | EP4336552 | Date: | 12.03.2025 | Language: | FR | [2025/11] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 07.02.2024 | Classification | IPC: | H01L23/427, // H01L23/373 | [2024/11] | CPC: |
H10W40/73 (EP);
H05K7/2029 (CN);
H05K7/20327 (US);
B64D47/00 (CN);
H05K7/20318 (CN,US);
H10W40/735 (EP);
H10W40/255 (EP)
(-)
| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/43] |
| Former [2024/11] | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR | Title | German: | ELEKTRONISCHES BAUTEIL MIT ZWEIPHASENFLUID ZUR WÄRMEKALORISCHEN ABFÜHRUNG AUS HALBLEITERN EINES ELEKTRONISCHEN BAUTEILS | [2024/42] | English: | ELECTRONIC COMPONENT COMPRISING A TWO-PHASE FLUID FOR REMOVING THERMAL HEAT FROM SEMICONDUCTORS OF SAID ELECTRONIC COMPONENT | [2024/42] | French: | COMPOSANT ÉLECTRONIQUE COMPRENANT UN FLUIDE DIPHASIQUE POUR ÉVACUER LES CALORIES THERMIQUES DES SEMI-CONDUCTEURS DUDIT COMPOSANT ÉLECTRONIQUE | [2024/11] |
| Former [2024/11] | ELEKTRONISCHES BAUTEIL MIT ZWEIPHASENFLUID ZUR WÄRMEKALORISCHEN ABFÜHRUNG VON HALBLEITERN AUS DEM ELEKTRONISCHEN BAUELEMENT | ||
| Former [2024/11] | ELECTRONIC COMPONENT COMPRISING A TWO-PHASE FLUID FOR REMOVING THERMAL CALORIES FROM SEMICONDUCTORS OF SAID ELECTRONIC COMPONENT | Examination procedure | 24.07.2023 | Examination requested [2024/11] | 07.02.2024 | Date on which the examining division has become responsible | 19.02.2024 | Despatch of a communication from the examining division (Time limit: M04) | 27.02.2024 | Reply to a communication from the examining division | 17.09.2024 | Communication of intention to grant the patent | 18.11.2024 | Disapproval of the communication of intention to grant the patent by the applicant or resumption of examination proceedings by the EPO | 18.11.2024 | Fee for grant paid | 18.11.2024 | Fee for publishing/printing paid | 02.12.2024 | Communication of intention to grant the patent | 29.01.2025 | Receipt of the translation of the claim(s) | Opposition(s) | 15.12.2025 | No opposition filed within time limit [2026/08] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | AT | 12.03.2025 | BG | 12.03.2025 | CZ | 12.03.2025 | DK | 12.03.2025 | EE | 12.03.2025 | ES | 12.03.2025 | FI | 12.03.2025 | HR | 12.03.2025 | IT | 12.03.2025 | LV | 12.03.2025 | NL | 12.03.2025 | PL | 12.03.2025 | RO | 12.03.2025 | SE | 12.03.2025 | SK | 12.03.2025 | SM | 12.03.2025 | NO | 12.06.2025 | RS | 12.06.2025 | GR | 13.06.2025 | IS | 12.07.2025 | PT | 14.07.2025 | [2026/08] |
| Former [2025/49] | AT | 12.03.2025 | |
| BG | 12.03.2025 | ||
| CZ | 12.03.2025 | ||
| EE | 12.03.2025 | ||
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| IT | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NL | 12.03.2025 | ||
| PL | 12.03.2025 | ||
| RO | 12.03.2025 | ||
| SE | 12.03.2025 | ||
| SK | 12.03.2025 | ||
| SM | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| IS | 12.07.2025 | ||
| PT | 14.07.2025 | ||
| Former [2025/48] | AT | 12.03.2025 | |
| BG | 12.03.2025 | ||
| CZ | 12.03.2025 | ||
| EE | 12.03.2025 | ||
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| IT | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NL | 12.03.2025 | ||
| PL | 12.03.2025 | ||
| SE | 12.03.2025 | ||
| SM | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| PT | 14.07.2025 | ||
| Former [2025/46] | BG | 12.03.2025 | |
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NL | 12.03.2025 | ||
| SE | 12.03.2025 | ||
| SM | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| PT | 14.07.2025 | ||
| Former [2025/42] | BG | 12.03.2025 | |
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NL | 12.03.2025 | ||
| SE | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| Former [2025/39] | BG | 12.03.2025 | |
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NL | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| Former [2025/35] | BG | 12.03.2025 | |
| ES | 12.03.2025 | ||
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| GR | 13.06.2025 | ||
| Former [2025/34] | ES | 12.03.2025 | |
| FI | 12.03.2025 | ||
| HR | 12.03.2025 | ||
| LV | 12.03.2025 | ||
| NO | 12.06.2025 | ||
| RS | 12.06.2025 | ||
| Former [2025/33] | ES | 12.03.2025 | |
| FI | 12.03.2025 | ||
| RS | 12.06.2025 | Documents cited: | Search | [XI] US2019096780 (ROESNER MICHAEL et al.) [X] 1,7 * paragraphs [0014] , [0100]; figure 6 *[I] 5,8 | [XI] US2021111098 (JOSHI SHAILESH N et al.) [X] 1,4,6,7 * paragraphs [0033] - [0036]; figure 3B *[I] 5,8 | [A] DE102016218679 (SIEMENS AG et al.) [A] 1,2,7 * paragraphs [0009] , [0010] , [0025] , [0026]; figures 1,2 * |