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EP4333027
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EP About this file: EP4333027
| EP4333027 - METHOD OF MANUFACTURING OHMIC CONTACTS OF AN ELECTRONIC DEVICE, WITH THERMAL BUDGET OPTIMIZATION [Right-click to bookmark this link] | Status | The application has been published Status updated on 02.02.2024 Database last updated on 15.06.2024 | Most recent event Tooltip | 02.02.2024 | Publication in section I.1 EP Bulletin | published on 06.03.2024 [2024/10] | Applicant(s) | For all designated states STMicroelectronics S.r.l. Via C. Olivetti, 2 20864 Agrate Brianza (MB) / IT | [2024/10] | Inventor(s) | 01 /
SAGGIO, Mario Giuseppe 95020 ACI BONACCORSI (CT) / IT | 02 /
CAMALLERI, Cateno Marco 95125 CATANIA / IT | 03 /
BELLOCCHI, Gabriele 95124 CATANIA / IT | 04 /
RASCUNA', Simone 95129 CATANIA / IT | [2024/10] | Representative(s) | Studio Torta S.p.A. Via Viotti, 9 10121 Torino / IT | [2024/10] | Application number, filing date | 23190768.4 | 10.08.2023 | [2024/10] | Priority number, date | IT20220017733 | 29.08.2022 Original published format: IT202200017733 | [2024/10] | Filing language | IT | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP4333027 | Date: | 06.03.2024 | Language: | EN | [2024/10] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 02.02.2024 | Classification | IPC: | H01L21/336, H01L29/45, H01L29/78, H01L29/12 | [2024/10] | CPC: |
H01L29/66068 (EP,US);
H01L21/0485 (EP,US);
H01L29/1095 (EP);
H01L29/401 (EP,US);
H01L29/45 (EP);
H01L29/7802 (EP);
H01L21/046 (EP)
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| Designated contracting states | AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LI, LT, LU, LV, MC, ME, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR [2024/10] | Extension states | BA | Not yet paid | Validation states | KH | Not yet paid | MA | Not yet paid | MD | Not yet paid | TN | Not yet paid | Title | German: | VERFAHREN ZUR HERSTELLUNG VON OHMSCHEN KONTAKTEN EINER ELEKTRONISCHEN VORRICHTUNG MIT OPTIMIERUNG DES THERMISCHEN BUDGETS | [2024/10] | English: | METHOD OF MANUFACTURING OHMIC CONTACTS OF AN ELECTRONIC DEVICE, WITH THERMAL BUDGET OPTIMIZATION | [2024/10] | French: | PROCÉDÉ DE FABRICATION DE CONTACTS OHMIQUES D'UN DISPOSITIF ÉLECTRONIQUE, AVEC OPTIMISATION DE BUDGET THERMIQUE | [2024/10] |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US2014021623 (TENAGLIA DARIO [IT]) [X] 1-3,5,9,13-15 * paragraph [0004] * * paragraph [0007] - paragraph [0013]; figures 1-4 *; | [XAY]US9331157 (OKA TORU [JP], et al) [X] 1-3,6-9,13 * column 6, line 20 - column 9, line 37; figures 1, 2 * * column 9, line 66 - column 10, line 16; figure 4 * * column 15, line 1 - line 10; figure 7 * [A] 11,12 [Y] 4,5,10; | [Y]US2016247907 (OHASHI TERUYUKI [JP], et al) [Y] 4 * paragraph [0037]; figure 1 * * paragraph [0141]; figure 14 *; | [Y]US2018226474 (SHIMIZU TATSUO [JP]) [Y] 4 * paragraph [0037]; figure 1 * * paragraph [0053] *; | [X]US2021175369 (OHSE NAOYUKI [JP], et al) [X] 1,5,14,15 * paragraph [0119] - paragraph [0159]; figures 7-22 *; | [Y]US2021288147 (SHIMIZU TATSUO [JP]) [Y] 5 * paragraph [0173] - paragraph [0177]; figure 13 * * paragraph [0223] - paragraph [0233]; figures 21,22 *; | [Y]US11316025 (FIORENZA PATRICK [IT], et al) [Y] 10 * column 3, line 1 - line 11; figure 1 ** column 3, line 40 - line 49 * | by applicant | US2014021623 | US9331157 | US2016247907 | US2018226474 | US2021288147 | US11316025 |