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Extract from the Register of European Patents

EP About this file: EP0021402

EP0021402 - Integrated circuit board [Right-click to bookmark this link]
StatusNo opposition filed within time limit
Status updated on  19.08.1986
Database last updated on 15.07.2024
Most recent event   Tooltip08.12.1987Lapse of the patent in a contracting statepublished on 27.01.1988 [1988/04]
Applicant(s)For all designated states
International Business Machines Corporation
New Orchard Road
Armonk, NY 10504 / US
[N/P]
Former [1981/01]For all designated states
International Business Machines Corporation
Old Orchard Road
Armonk, N.Y. 10504 / US
Inventor(s)01 / Miersch, Ekkehard F.
NarzissenStrasse
D-7030 Böblingen 4 / DE
02 / Romankiw, Lubomyr T.
7 Dunn Lane
Briarcliff Manor New York 10510 / US
[1981/01]
Representative(s)Ahlman, Bertel
IBM Svenska AB Intellectual Property Department
163 92 Stockholm / SE
[N/P]
Former [1983/32]Ahlman, Bertel
IBM Svenska AB Intellectual Property Department
S-163 92 Stockholm / SE
Former [1983/21]Gasslander, Sten
IBM Svenska AB Intellectual Property Department
S-163 92 Stockholm / SE
Former [1981/27]Petersen, Richard Courtenay
IBM United Kingdom Patent Operations Hursley Park
Winchester Hants. SO21 2JN / GB
Former [1981/01]Grassi, Bruno
c/o IBM Semea S.r.l. Direzione Relazioni con l'Industria MI-SEG 543 P.O. 137
I-20090 Segrate (Milano) / IT
Application number, filing date80103554.424.06.1980
[1981/01]
Priority number, dateUS1979005349729.06.1979         Original published format: US 53497
[1981/01]
Filing languageEN
Procedural languageEN
PublicationType: A2 Application without search report 
No.:EP0021402
Date:07.01.1981
Language:EN
[1981/01]
Type: A3 Search report 
No.:EP0021402
Date:18.05.1983
Language:EN
[1983/20]
Type: B1 Patent specification 
No.:EP0021402
Date:09.10.1985
Language:EN
[1985/41]
Search report(s)(Supplementary) European search report - dispatched on:EP18.03.1983
ClassificationIPC:H01L23/54, H01L23/14, H05K1/00
[1983/16]
CPC:
H05K3/4641 (EP,US); H01L23/142 (EP,US); H01L23/5385 (EP,US);
H01L2224/16225 (EP,US); H05K1/113 (EP,US); H05K2201/09309 (EP,US);
H05K2201/09563 (EP,US); H05K2201/09809 (EP,US) (-)
Former IPC [1981/01]H01L23/54, H01L23/14
Designated contracting statesBE,   DE,   FR,   GB,   IT,   SE [1981/01]
TitleGerman:Platte für integrierte Schaltung[1981/01]
English:Integrated circuit board[1981/01]
French:Panneau pour circuit intégré[1981/01]
Examination procedure20.12.1982Examination requested  [1983/09]
15.06.1984Despatch of a communication from the examining division (Time limit: M04)
23.08.1984Reply to a communication from the examining division
21.12.1984Despatch of communication of intention to grant (Approval: )
28.03.1985Communication of intention to grant the patent
19.04.1985Fee for grant paid
19.04.1985Fee for publishing/printing paid
Opposition(s)10.07.1986No opposition filed within time limit [1986/41]
Fees paidRenewal fee
23.06.1982Renewal fee patent year 03
21.06.1983Renewal fee patent year 04
28.06.1984Renewal fee patent year 05
24.06.1985Renewal fee patent year 06
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court.
Lapses during opposition  TooltipBE09.10.1985
[1988/04]
Documents cited:Search[A]US3351816  (SEAR BRIAN E, et al);
 [A]US4047132  (KRAJEWSKI IGNACY);
 [A]US3299393  (KELLEY GEORGE F, et al)
ExaminationUS3519959
    - IBM Journal of Research & Development, May 1969, pages 226-238
The EPO accepts no responsibility for the accuracy of data originating from other authorities; in particular, it does not guarantee that it is complete, up to date or fit for specific purposes.