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EP0023400
European procedure
Extract from the Register of European Patents
EP About this file: EP0023400
| EP0023400 - Leadless packages for semiconductor devices [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 31.01.1985 Database last updated on 28.03.2026 | Most recent event Tooltip | 31.01.1985 | No opposition filed within time limit | published on 03.04.1985 [1985/14] | Applicant(s) | For all designated states FUJITSU LIMITED 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi Kanagawa 211 / JP | [N/P] |
| Former [1981/05] | For all designated states FUJITSU LIMITED 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 / JP | Inventor(s) | 01 /
Honda, Norio 21-4, Miyashita Kamiarakuda Machikitamachi Aizuwakamatsu-shi Fukushima, 965 / JP | 02 /
Hayashi, Kunihiko 6212-3-5-104, Izumi-cho Totsuka-ku Yokohama-shi Kanagawa, 245 / JP | [1981/05] | Representative(s) | Bedggood, Guy Stuart, et al Haseltine Lake & Co., Imperial House, 15-19 Kingsway London WC2B 6UD / GB | [N/P] |
| Former [1981/05] | Bedggood, Guy Stuart, et al Haseltine Lake & Co. Hazlitt House 28 Southampton Buildings Chancery Lane London WC2A 1AT / GB | Application number, filing date | 80302341.5 | 10.07.1980 | [1981/05] | Priority number, date | JP19790095327 | 11.07.1979 Original published format: JP 9532779 | [1981/05] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0023400 | Date: | 04.02.1981 | Language: | EN | [1981/05] | Type: | B1 Patent specification | No.: | EP0023400 | Date: | 21.03.1984 | Language: | EN | [1984/12] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 20.11.1980 | Classification | IPC: | H01L23/02, H01L23/50 | [1981/05] | CPC: |
H10W76/157 (EP);
H05K3/403 (EP);
H10W70/68 (EP);
H10W70/685 (EP);
H10W76/18 (EP);
H05K1/0306 (EP);
H05K1/092 (EP);
H05K2201/09181 (EP);
H05K2201/09709 (EP);
H05K2201/09845 (EP);
H05K3/3442 (EP);
H05K3/4061 (EP);
| Designated contracting states | DE, FR, GB, NL [1981/16] |
| Former [1981/05] | AT, BE, CH, DE, FR, GB, IT, LI, LU, NL, SE | Title | German: | Leitungsloses Gehäuse für Halbleitervorrichtungen | [1981/05] | English: | Leadless packages for semiconductor devices | [1981/05] | French: | Boîtiers sans conducteurs pour dispositifs semiconducteurs | [1981/05] | File destroyed: | 20.04.2002 | Examination procedure | 10.11.1980 | Despatch of communication of loss of particular rights: designated state(s) AT, BE, CH, IT, LI, LU, SE | 20.01.1981 | Loss of particular rights, legal effect: designated state(s) | 05.03.1981 | Examination requested [1981/20] | 22.07.1981 | Despatch of a communication from the examining division (Time limit: M04) | 19.11.1981 | Reply to a communication from the examining division | 15.06.1983 | Despatch of communication of intention to grant (Approval: ) | 09.09.1983 | Communication of intention to grant the patent | 10.11.1983 | Fee for grant paid | 10.11.1983 | Fee for publishing/printing paid | Opposition(s) | 22.12.1984 | No opposition filed within time limit [1985/14] | Fees paid | Renewal fee | 01.07.1982 | Renewal fee patent year 03 | 30.06.1983 | Renewal fee patent year 04 | Penalty fee | Penalty fee Rule 85a EPC 1973 | 11.08.1980 | AT M02 Not yet paid | 11.08.1980 | BE M02 Not yet paid | 11.08.1980 | CH M02 Not yet paid | 11.08.1980 | IT M02 Not yet paid | 11.08.1980 | LI M02 Not yet paid | 11.08.1980 | LU M02 Not yet paid | 11.08.1980 | SE M02 Not yet paid |
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