-
EP0059926
European procedure
Extract from the Register of European Patents
EP About this file: EP0059926
| EP0059926 - A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 01.08.1987 Database last updated on 09.04.2026 | Most recent event Tooltip | 06.11.2009 | Change - representative | published on 09.12.2009 [2009/50] | Applicant(s) | For all designated states Matsushita Electronics Corporation 1006, Oaza-Kadoma Kadoma-shi Osaka 571-8501 / JP | [N/P] |
| Former [1982/37] | For all designated states Matsushita Electronics Corporation 1006, Oaza-Kadoma Kadoma-shi, Osaka 571 / JP | Inventor(s) | 01 /
Fujii, Hiroyuki 3-24, Togu-cho Ibaraki-shi Osaka / JP | 02 /
Tateno, Kenichi 1481 Minamigasa-cho Kusatsu-shi Shiga / JP | 03 /
Nishikawa, Mikio 379, Higashinakasuji Matsubarasagaru Shimogyo-ku Kyoto-shi Kyoto / JP | [1982/37] | Representative(s) | Schwabe, Hans-Georg, et al Schwabe, Sandmair, Marx Patentanwälte Stuntzstrasse 16 81677 München / DE | [2009/50] |
| Former [1985/44] | Schwabe, Hans-Georg, Dipl.-Ing., et al Patentanwälte Schwabe, Sandmair, Marx Stuntzstrasse 16 D-8000 München 80 / DE | ||
| Former [1982/37] | Berg, Wilhelm, Dr. Patentanwälte Dr. Berg Dipl.-Ing. Stapf Dipl.-Ing. Schwabe Dr. Dr. Sandmair Postfach 86 02 45 Stuntzstrasse 16 D-8000 München 86 / DE | Application number, filing date | 82101605.2 | 02.03.1982 | [1982/37] | Priority number, date | JP19810032229 | 05.03.1981 Original published format: JP 3222981 | [1982/37] | Filing language | EN | Procedural language | EN | Publication | Type: | A1 Application with search report | No.: | EP0059926 | Date: | 15.09.1982 | Language: | EN | [1982/37] | Type: | B1 Patent specification | No.: | EP0059926 | Date: | 08.10.1986 | Language: | EN | [1986/41] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 14.07.1982 | Classification | IPC: | H01L21/56, H01L23/30, H01L23/48 | [1982/37] | CPC: |
H10W74/016 (EP,US);
H10W70/481 (EP,US);
H10W72/0198 (EP,US);
H10W74/111 (EP,US);
H10W74/121 (EP,US);
H10W72/01515 (EP,US);
H10W72/075 (EP,US);
H10W72/5449 (EP,US);
H10W72/552 (EP,US);
| Designated contracting states | DE, FR, GB [1982/37] | Title | German: | Verfahren zum Herstellen einer in Kunststoff verkapselten Halbleiteranordnung und ein Leitergitter dafür | [1982/37] | English: | A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor | [1982/37] | French: | Un procédé pour fabriquer un dispositif semiconducteur encapsulé en plastique et une grille de conducteurs pour ce dispositif | [1982/37] | Examination procedure | 10.03.1983 | Examination requested [1983/21] | 05.09.1984 | Despatch of a communication from the examining division (Time limit: M06) | 11.02.1985 | Reply to a communication from the examining division | 28.06.1985 | Despatch of a communication from the examining division (Time limit: M04) | 02.10.1985 | Reply to a communication from the examining division | 13.12.1985 | Despatch of communication of intention to grant (Approval: ) | 02.04.1986 | Communication of intention to grant the patent | 30.06.1986 | Fee for grant paid | 30.06.1986 | Fee for publishing/printing paid | Opposition(s) | 09.07.1987 | No opposition filed within time limit [1987/38] | Fees paid | Renewal fee | 23.02.1984 | Renewal fee patent year 03 | 27.02.1985 | Renewal fee patent year 04 | 13.02.1986 | Renewal fee patent year 05 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | |||