-
EP0073487
European procedure
Extract from the Register of European Patents
EP About this file: EP0073487
| EP0073487 - Method for manufacturing three-dimensional semiconductor device [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 25.05.1989 Database last updated on 19.07.2024 | Most recent event Tooltip | 28.09.2007 | Lapse of the patent in a contracting state | published on 31.10.2007 [2007/44] | Applicant(s) | For all designated states Kabushiki Kaisha Toshiba 72, Horikawa-cho, Saiwai-ku Kawasaki-shi Kanagawa-ken 210-8572 / JP | [N/P] |
| Former [1983/10] | For all designated states KABUSHIKI KAISHA TOSHIBA 72, Horikawa-cho, Saiwai-ku Kawasaki-shi, Kanagawa-ken 210, Tokyo / JP | Inventor(s) | 01 /
Inoue, Tomoyasu 2-2-8-504, Atago Tama-shi Tokyo / JP | 02 /
Shibata, Kenji 575 Kamiharama Nakahara-ku Kawasaki-shi / JP | [1983/10] | Representative(s) | Lehn, Werner, et al Hoffmann Eitle, Patent- und Rechtsanwälte, Postfach 81 04 20 81904 München / DE | [N/P] |
| Former [1983/10] | Lehn, Werner, Dipl.-Ing., et al Hoffmann, Eitle & Partner, Patentanwälte, Postfach 81 04 20 D-81904 München / DE | Application number, filing date | 82107859.9 | 26.08.1982 | [1983/10] | Priority number, date | JP19810135421 | 31.08.1981 Original published format: JP 13542181 | JP19810135422 | 31.08.1981 Original published format: JP 13542281 | [1983/10] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0073487 | Date: | 09.03.1983 | Language: | EN | [1983/10] | Type: | A3 Search report | No.: | EP0073487 | Date: | 03.04.1985 | Language: | EN | [1985/14] | Type: | B1 Patent specification | No.: | EP0073487 | Date: | 20.07.1988 | Language: | EN | [1988/29] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 28.01.1985 | Classification | IPC: | H01L27/06 | [1983/10] | CPC: |
H01L21/02488 (EP,US);
H01L21/02381 (EP,US);
H01L21/02532 (EP,US);
H01L21/02598 (EP,US);
H01L21/02675 (US);
H01L21/02689 (EP,US);
H01L21/02691 (EP,US);
H01L21/743 (EP,US);
H01L21/8221 (EP,US);
H01L23/5283 (EP,US);
H01L27/0688 (EP,US);
H01L29/78618 (EP,US);
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | DE, FR, GB, IT [1983/10] | Title | German: | Verfahren zur Herstellung einer dreidimensionalen Halbleitervorrichtung | [1983/10] | English: | Method for manufacturing three-dimensional semiconductor device | [1983/10] | French: | Procédé de fabrication d'un dispositif semi-conducteur tri-dimensionnel | [1983/10] | Examination procedure | 26.08.1982 | Examination requested [1983/10] | 26.08.1986 | Despatch of a communication from the examining division (Time limit: M06) | 20.02.1987 | Reply to a communication from the examining division | 14.10.1987 | Despatch of communication of intention to grant (Approval: Yes) | 13.01.1988 | Communication of intention to grant the patent | 29.03.1988 | Fee for grant paid | 29.03.1988 | Fee for publishing/printing paid | Opposition(s) | 21.04.1989 | No opposition filed within time limit [1989/28] | Fees paid | Renewal fee | 30.08.1984 | Renewal fee patent year 03 | 13.08.1985 | Renewal fee patent year 04 | 14.08.1986 | Renewal fee patent year 05 | 12.08.1987 | Renewal fee patent year 06 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | IT | 20.07.1988 | [2007/44] |
| Former [1999/42] | IT | 20.07.1988 | Documents cited: | Search | [X]DE3043913 (HITACHI LTD [JP]); | [A]US4272880 (PASHLEY RICHARD D); | [A]GB2064866 (GEN ELECTRIC CO LTD) |