-
EP0078480
European procedure
- EP About this file
- EP Legal status
- EP Federated register
- EP Event history
- EP Citations
- EP Patent family
- EP All documents
Extract from the Register of European Patents
EP About this file: EP0078480
| EP0078480 - Method for fusing and connecting solder of IC chip [Right-click to bookmark this link] | Status | The application has been refused Status updated on 02.07.1986 Database last updated on 20.07.2024 | Most recent event Tooltip | 15.08.2008 | Change - representative | published on 17.09.2008 [2008/38] | Applicant(s) | For all designated states Hitachi, Ltd. 5-1, Marunouchi 1-chome Chiyoda-ku Tokyo 100 / JP | [N/P] |
| Former [1983/19] | For all designated states Hitachi, Ltd. 5-1, Marunouchi 1-chome Chiyoda-ku, Tokyo 100 / JP | Inventor(s) | 01 /
Ohshima, Muneo Hitachi Hachimanyama Apartment No. 113, 1545 Yoshida-cho Totsuka-ku Yokohama-shi Kanagawa-ken / JP | 02 /
Kenmotsu, Akihiro 866-15, Kameino Fujisawa-shi Kanagawa-ken / JP | [1983/19] | Representative(s) | Beetz & Partner mbB Patentanwälte Prinzregentenstraße 54 80538 München / DE | [N/P] |
| Former [2008/38] | Beetz & Partner Patentanwälte Steinsdorfstrasse 10 80538 München / DE | ||
| Former [1983/19] | Patentanwälte Beetz - Timpe - Siegfried Schmitt-Fumian - Mayr Steinsdorfstrasse 10 D-80538 München / DE | Application number, filing date | 82109845.6 | 25.10.1982 | [1983/19] | Priority number, date | JP19810171411 | 28.10.1981 Original published format: JP 17141181 | [1983/19] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0078480 | Date: | 11.05.1983 | Language: | EN | [1983/19] | Type: | A3 Search report | No.: | EP0078480 | Date: | 25.07.1984 | Language: | EN | [1984/30] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 25.05.1984 | Classification | IPC: | H01L21/60, H01L23/48 | [1983/19] | CPC: |
H01L24/10 (EP);
H01L24/13 (EP);
H01L24/81 (EP);
H05K3/3436 (EP);
H01L2224/13 (EP);
H01L2224/13099 (EP);
H01L2224/13111 (EP);
H01L2224/14505 (EP);
H01L2224/16 (EP);
H01L2224/81136 (EP);
H01L2224/81801 (EP);
H01L2924/01005 (EP);
H01L2924/01006 (EP);
H01L2924/01014 (EP);
H01L2924/01015 (EP);
H01L2924/01033 (EP);
H01L2924/0105 (EP);
H01L2924/01078 (EP);
H01L2924/01082 (EP);
H01L2924/014 (EP);
H01L2924/14 (EP);
H05K2201/094 (EP);
H05K2201/09781 (EP);
H05K2201/2036 (EP);
| C-Set: |
H01L2224/13, H01L2924/00 (EP)
| Designated contracting states | DE, FR [1983/19] | Title | German: | Verfahren zum Schmelzen und Verbinden des Lots eines integrierten Schaltungschips | [1983/19] | English: | Method for fusing and connecting solder of IC chip | [1983/19] | French: | Procédé pour fondre et lier de la brasure d'une puce à circuit intégré | [1983/19] | File destroyed: | 03.12.1992 | Examination procedure | 30.07.1984 | Examination requested [1984/41] | 11.09.1985 | Despatch of a communication from the examining division (Time limit: M04) | 07.01.1986 | Reply to a communication from the examining division | 21.02.1986 | Despatch of communication that the application is refused, reason: substantive examination [1986/34] | 03.03.1986 | Application refused, date of legal effect [1986/34] | Fees paid | Renewal fee | 29.10.1984 | Renewal fee patent year 03 | 30.10.1985 | Renewal fee patent year 04 |
| Opt-out from the exclusive Tooltip competence of the Unified Patent Court | See the Register of the Unified Patent Court for opt-out data | ||
| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [A]JP56111234 ; | [Y]GB2062963 (HITACHI LTD) | [Y] - IBM TECHNICAL DISCLOSURE BULLETIN, vol. 14, no. 1, June 1971, pages 257-258, New York, US; R.L. HAMILTON et al.: "Thermal stress resistant solder reflow chip joints". | [A] - SOLID STATE TECHNOLOGY, vol. 12, no. 9, September 1969, pages 33-41, part 2, New York, US; L.F. MILLER: "A survey of chip joining techniques". | [A] - PATENTS ABSTRACTS OF JAPAN, vol. 5, no. 186 (E-84)[858], 25th November 1981 & JP-A-56 111 234 (HITACHI SEISAKUSHO K.K.) 02-09-1981, & JP56111234 A 00000000 |