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EP0054539
European procedure
Extract from the Register of European Patents
EP About this file: EP0054539
| EP0054539 - A semiconductor integrated circuit device with an improved heat sink [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.03.1987 Database last updated on 10.03.2026 | Most recent event Tooltip | 07.03.1997 | Lapse of the patent in a contracting state | published on 23.04.1997 [1997/17] | Applicant(s) | For all designated states FUJITSU LIMITED 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi Kanagawa 211 / JP | [N/P] |
| Former [1982/25] | For all designated states FUJITSU LIMITED 1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 / JP | Inventor(s) | 01 /
Wakabayashi, Tetsushi 18-406 Asodaidanchi 861-2, Shimoaso, Tama-ku Kawasaki-shi Kanagawa 215 / JP | 02 /
Sakuma, Osamu 2-2-5, Edakita Midori-ku Yokohama-shi Kanagawa 227 / JP | 03 /
Honda, Norio 21-4, Aza Miyashita Oaza Kamiarakuda Machikitamachi Aizuwakamatsu-shi Fukushima 965 / JP | [1982/25] | Representative(s) | Abbott, Leonard Charles, et al GILL JENNINGS & EVERY 53-64 Chancery Lane London WC2A 1HN / GB | [1982/25] | Application number, filing date | 82200051.9 | 27.02.1981 | [1982/25] | Priority number, date | JP19800024689 | 29.02.1980 Original published format: JP 2468980 | [1982/25] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0054539 | Date: | 23.06.1982 | Language: | EN | [1982/25] | Type: | A3 Search report | No.: | EP0054539 | Date: | 16.02.1983 | Language: | EN | [1983/07] | Type: | B1 Patent specification | No.: | EP0054539 | Date: | 07.05.1986 | Language: | EN | [1986/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 15.12.1982 | Classification | IPC: | H01L23/36 | [1982/25] | CPC: |
H10W40/22 (EP,US)
| Designated contracting states | DE, FR, GB, NL [1982/25] | Title | German: | Integriertes Halbleiterbauelement mit Wärmesenke | [1982/25] | English: | A semiconductor integrated circuit device with an improved heat sink | [1982/25] | French: | Dispositif semi-conducteur à circuit intégré comprenant un dissipateur de chaleur | [1982/25] | File destroyed: | 20.04.2002 | Examination procedure | 13.05.1983 | Examination requested [1983/30] | 27.06.1984 | Despatch of a communication from the examining division (Time limit: M04) | 29.10.1984 | Reply to a communication from the examining division | 28.06.1985 | Despatch of communication of intention to grant (Approval: ) | 10.10.1985 | Communication of intention to grant the patent | 02.01.1986 | Fee for grant paid | 02.01.1986 | Fee for publishing/printing paid | Parent application(s) Tooltip | EP81300835.6 / EP0035390 | Opposition(s) | 10.02.1987 | No opposition filed within time limit [1987/18] | Fees paid | Renewal fee | 17.03.1983 | Renewal fee patent year 03 | 11.02.1984 | Renewal fee patent year 04 | 11.02.1985 | Renewal fee patent year 05 | 10.02.1986 | Renewal fee patent year 06 | Penalty fee | Additional fee for renewal fee | 28.02.1983 | 03 M06 Fee paid on 17.03.1983 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Lapses during opposition Tooltip | NL | 07.05.1986 | [1997/17] |
| Former [1988/31] | NL | 07.05.1986 | Documents cited: | Search | [Y] IBM TECHNICAL BULLETIN, Vol. 22, No. 6, November 1979, New York. A.J. Arnold: "Structure for the Removal of Heat from an Integrated Circuit Module", pages 2294 to 2296 [Y] | [YP] ELECTRONICS INTERNATIONAl, Vol. 53, No. 26, 4 December 1980, New York. M. MARSHALL: "Amdahl Leapfrogs IBM With Technology", pages 41, 42 [YP] |