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EP0073149
European procedure
Extract from the Register of European Patents
EP About this file: EP0073149
| EP0073149 - Semiconductor chip mounting module [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 21.09.1988 Database last updated on 11.04.2026 | Most recent event Tooltip | 21.09.1988 | No opposition filed within time limit | published on 09.11.1988 [1988/45] | Applicant(s) | For all designated states SPERRY CORPORATION 1290, Avenue of the Americas New York, N.Y. 10019 / US | [1983/09] | Inventor(s) | 01 /
Currie, Thomas Peter 198 Montrofe Place St. Paul, Minnesota 55104 / US | 02 /
Goldberg, Norman, Dr. 1580 Tralee Drive Dresher, Pa. 19025 / US | [1983/09] | Representative(s) | Orchard, Oliver John JOHN ORCHARD & CO. Staple Inn Buildings North High Holborn London WC1V 7PZ / GB | [N/P] |
| Former [1984/19] | Orchard, Oliver John JOHN ORCHARD & CO. Staple Inn Buildings North High Holborn London WC1V 7PZ / GB | ||
| Former [1983/09] | Michaels, Peter Albert Sperry Univac Patent & Licensing Services M.S. N1W4 Sperry Rand Ltd. Sperry Univac Centre Brentfields London NW10 8LS / GB | Application number, filing date | 82304406.0 | 20.08.1982 | [1983/09] | Priority number, date | US19810294100 | 21.08.1981 Original published format: US 294100 | [1983/09] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0073149 | Date: | 02.03.1983 | Language: | EN | [1983/09] | Type: | A3 Search report | No.: | EP0073149 | Date: | 19.12.1984 | Language: | EN | [1984/51] | Type: | B1 Patent specification | No.: | EP0073149 | Date: | 25.11.1987 | Language: | EN | [1987/48] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 17.10.1984 | Classification | IPC: | H01L23/52 | [1983/09] | CPC: |
H10W76/153 (EP,US);
H10W70/685 (EP,US);
H10W70/611 (EP,US);
H10W72/075 (EP,US);
H10W72/29 (EP,US);
H10W72/5363 (EP,US);
| Designated contracting states | DE, FR, GB, IT [1983/09] | Title | German: | Halbleiterchip-Montierungsmodul | [1983/09] | English: | Semiconductor chip mounting module | [1983/09] | French: | Module de montage pour puce semi-conductrice | [1983/09] | Examination procedure | 30.11.1984 | Examination requested [1985/08] | 10.04.1986 | Despatch of a communication from the examining division (Time limit: M04) | 20.08.1986 | Reply to a communication from the examining division | 18.02.1987 | Despatch of communication of intention to grant (Approval: ) | 27.05.1987 | Communication of intention to grant the patent | 24.08.1987 | Fee for grant paid | 24.08.1987 | Fee for publishing/printing paid | Opposition(s) | 26.08.1988 | No opposition filed within time limit [1988/45] | Fees paid | Renewal fee | 13.08.1984 | Renewal fee patent year 03 | 01.08.1985 | Renewal fee patent year 04 | 18.08.1986 | Renewal fee patent year 05 | 19.06.1987 | Renewal fee patent year 06 |
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| Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [AP] JP56120147 | [Y] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 23, no. 9, February 1981, pages 4062-4063, New York, US; S.M. JENSEN et al.: "Pin/chip carrier assembly" [Y] | [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 23, no. 3, August 1980, page 966, New York, US; P.F. IAFRATE et al.: "Integrated circuit wafer package" [A] | [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 22, no. 3, August 1979, pages 948-949, New York, US; L.R. CUTTING et al.: "Stacked MC module with variable size substrates" [A] | [A] IBM TECHNICAL DISCLOSURE BULLETIN, vol. 20, no. 6, November 1977, pages 2221-2222, New York, US; J.A. BENENATI: "Semiconductor module" [A] | [AP] PATENTS ABSTRACTS OF JAPAN, vol. 5, no. 198 (E-87)[870], 16th December 1981; & JP - A - 56 120 147 (HITACHI SEISAKUSHO K.K.) 21-09-1981 [AP] |