EP0103888 - Method and device to protect film-mounted integrated circuits (micropacks) against disturbance by electrostatic charges [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 12.03.1990 Database last updated on 03.06.2024 | Most recent event Tooltip | 12.03.1990 | No opposition filed within time limit | published on 02.05.1990 [1990/18] | Applicant(s) | For all designated states SIEMENS AKTIENGESELLSCHAFT Werner-von-Siemens-Str. 1 DE-80333 München / DE | [N/P] |
Former [1984/13] | For all designated states SIEMENS AKTIENGESELLSCHAFT Wittelsbacherplatz 2 D-80333 München / DE | Inventor(s) | 01 /
Fritz, Otmar, Dipl.-Ing. Johann-Hackl-Ring 64 D-8011 Neukeferloh / DE | [1984/13] | Application number, filing date | 83109337.2 | 20.09.1983 | [1984/13] | Priority number, date | DE19823234745 | 20.09.1982 Original published format: DE 3234745 | [1984/13] | Filing language | DE | Procedural language | DE | Publication | Type: | A2 Application without search report | No.: | EP0103888 | Date: | 28.03.1984 | Language: | DE | [1984/13] | Type: | A3 Search report | No.: | EP0103888 | Date: | 21.11.1985 | Language: | DE | [1985/47] | Type: | B1 Patent specification | No.: | EP0103888 | Date: | 10.05.1989 | Language: | DE | [1989/19] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 18.09.1985 | Classification | IPC: | H01L23/56, H01L23/48 | [1984/13] | CPC: |
H01L23/49572 (EP,US);
H01L23/60 (EP,US);
H01L2924/0002 (EP,US);
H05K1/0254 (EP,US)
| C-Set: |
H01L2924/0002, H01L2924/00 (EP,US)
| Designated contracting states | AT, BE, CH, DE, FR, GB, IT, LI, NL [1984/13] | Title | German: | Verfahren und Vorrichtung zum Schützen von filmmontierten integrierten Schaltkreisen (Mikropacks) vor Zerstörung durch elektrostatische Aufladung | [1984/13] | English: | Method and device to protect film-mounted integrated circuits (micropacks) against disturbance by electrostatic charges | [1984/13] | French: | Procédé et dispositif pour protéger des circuits intégrés à montage sur film (micropacks) contre la perturbation par des charges électrostatiques | [1984/13] | Examination procedure | 21.12.1984 | Examination requested [1985/11] | 13.01.1988 | Despatch of a communication from the examining division (Time limit: M04) | 20.05.1988 | Reply to a communication from the examining division | 15.09.1988 | Despatch of communication of intention to grant (Approval: Yes) | 10.11.1988 | Communication of intention to grant the patent | 25.11.1988 | Fee for grant paid | 25.11.1988 | Fee for publishing/printing paid | Opposition(s) | 13.02.1990 | No opposition filed within time limit [1990/18] | Fees paid | Renewal fee | 25.09.1985 | Renewal fee patent year 03 | 23.09.1986 | Renewal fee patent year 04 | 25.09.1987 | Renewal fee patent year 05 | 23.09.1988 | Renewal fee patent year 06 |
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Responsibility for the accuracy, completeness or quality of the data displayed under the link provided lies entirely with the Unified Patent Court. | Documents cited: | Search | [X]US3746157 (ANSON T); | [A]GB1326437 (BOWTHORPE HELLERMANN LTD); | [A]US3823350 (STONER C); | [A]US4007479 (KOWALSKI JOHN L); | [A]US4069496 (KOWALSKI JOHN LAWRENCE); | [A]DE3035125 (SIEMENS AG [DE]); | [AP]DE3207458 (SIEMENS AG) |