EP0113820 - Method and apparatus for embedding wire in a photocurable adhesive [Right-click to bookmark this link] | Status | No opposition filed within time limit Status updated on 07.07.1988 Database last updated on 19.10.2024 | Most recent event Tooltip | 07.07.1988 | No opposition filed within time limit | published on 24.08.1988 [1988/34] | Applicant(s) | For all designated states International Business Machines Corporation New Orchard Road Armonk, NY 10504 / US | [N/P] |
Former [1984/30] | For all designated states International Business Machines Corporation Old Orchard Road Armonk, N.Y. 10504 / US | Inventor(s) | 01 /
Jones, Philip Gordan Rd3 Box 310 Towanda Pennsylvania 18848 / US | 02 /
Skarvinko, Eugene Roman 4 Giles Street Binghamton, N.Y. 13905 / US | [1984/30] | Representative(s) | Kindermann, Manfred Patentanwalt, Sperberweg 29 71032 Böblingen / DE | [N/P] |
Former [1986/44] | Kindermann, Manfred Schönaicher Strasse 220 D-7030 Böblingen / DE | ||
Former [1984/30] | Barth, Carl Otto IBM Corporation Säumerstrasse 4 CH-8803 Rüschlikon / CH | Application number, filing date | 83110963.2 | 03.11.1983 | [1984/30] | Priority number, date | US19820452161 | 22.12.1982 Original published format: US 452161 | [1984/30] | Filing language | EN | Procedural language | EN | Publication | Type: | A2 Application without search report | No.: | EP0113820 | Date: | 25.07.1984 | Language: | EN | [1984/30] | Type: | A3 Search report | No.: | EP0113820 | Date: | 12.09.1984 | Language: | EN | [1984/37] | Type: | B1 Patent specification | No.: | EP0113820 | Date: | 09.09.1987 | Language: | EN | [1987/37] | Search report(s) | (Supplementary) European search report - dispatched on: | EP | 11.07.1984 | Classification | IPC: | H05K7/06 | [1984/30] | CPC: |
H05K3/103 (EP);
H05K7/06 (EP);
H05K2201/10287 (EP);
H05K2203/1105 (EP);
H05K3/386 (EP)
| Designated contracting states | DE, FR, GB [1984/30] | Title | German: | Verfahren und Vorrichtung zum Einbetten eines Drahtes in einem lichthärtbaren Klebstoff | [1984/30] | English: | Method and apparatus for embedding wire in a photocurable adhesive | [1984/30] | French: | Procédé et appareil pour encastrer un fil dans un adhésif photodurcissable | [1984/30] | File destroyed: | 15.01.2000 | Examination procedure | 29.10.1984 | Examination requested [1985/02] | 24.04.1986 | Despatch of a communication from the examining division (Time limit: {0}) | 09.05.1986 | Despatch of a communication from the examining division (Time limit: M04) | 20.08.1986 | Reply to a communication from the examining division | 17.11.1986 | Despatch of communication of intention to grant (Approval: ) | 05.03.1987 | Communication of intention to grant the patent | 12.05.1987 | Fee for grant paid | 12.05.1987 | Fee for publishing/printing paid | Opposition(s) | 10.06.1988 | No opposition filed within time limit [1988/34] | Fees paid | Renewal fee | 26.11.1985 | Renewal fee patent year 03 | 25.11.1986 | Renewal fee patent year 04 |
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